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Nano-silver conductive slurry

A technology of conductive paste and nano-silver, which is applied in the direction of conductive materials, conductive materials, nanotechnology, etc., can solve the problems of high resistivity, poor conductivity, high sintering temperature, etc., and achieve the effect of good conductivity

Active Publication Date: 2010-05-19
HUAZHONG UNIV OF SCI & TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

These nano-slurries usually have the following disadvantages: after sintering or curing molding, they have high resistivity, resulting in poor electrical conductivity; or the slurry contains a glass binder phase, which requires a high sintering temperature in the later stage

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0020] Under stirring, dissolve 60g of silver nitrate in 2000mL of water, and add 50mL of ethylenediamine to it to form a silver ammonia complex solution, add 18g of octadecyl carboxylic acid to the above solution, and then add 120mL of concentrated ammonia water to adjust its pH value to facilitate the dissolution of octadecyl carboxylic acid. After octadecyl carboxylic acid is completely dissolved, under vigorous stirring, 400 mL of aqueous solution containing 7 g of sodium borohydride is added dropwise thereto. The whole dropping process lasts for 30 min. After the addition is completed, the stirring reaction is continued for 20 min. The process was maintained at room temperature. Thereafter, the stirring speed was reduced, and 200 mL of 22% (V / V) phosphoric acid was slowly added thereto. After the addition, it was allowed to stand for 1h and filtered to obtain a black solid. The obtained black solid was washed twice with 500 mL of n-propanol (250 mL each time), and filte...

Embodiment 2

[0025] Under stirring, 100g of silver nitrate was dissolved in 3000mL of water, and 125mL of 40% methylamine aqueous solution was added thereto to form a silver-ammonia complex solution, and 16g of sodium n-octoate was added to the above solution, and stirred to completely dissolve the sodium n-octoate. Thereafter, under vigorous stirring, 48 g of 37% formaldehyde aqueous solution was added dropwise thereto. The whole dropping process lasted for 30 minutes, and the stirring reaction was continued for 60 minutes after the dropping was completed. After that, the stirring speed was reduced, and 150 mL of 25% (V / V) phosphoric acid was slowly injected into the system. After the addition, it was allowed to stand for 1h and filtered to obtain a black solid. The obtained black solid was washed successively with 250 mL of ethanol and 250 mL of acetone, and filtered again to obtain about 45 g of "wet" silver nanoparticles.

[0026] The thickener was fully dissolved in the solvent, and ...

Embodiment 3

[0030] The thickener was fully dissolved in the solvent, and a dispersant, a leveling agent, and a thixotropic agent were added in proportion to form a carrier phase of 13 g. The components in the carrier phase and the mass percentages of each component are shown in Table 1.

[0031] Mix 27g of commercial nano-silver particles with the above-mentioned 13g of the carrier, first mechanically stir evenly, and then oscillate and disperse in an ultrasonic oscillator for 30min to obtain the slurry of the present invention.

[0032] The slurry is screen printed on the ceramic substrate, and then sintered at 200°C for 1 hour to obtain a conductive pattern with a resolution of 150 μm and a resistivity of about 5.3×10 by using the temperature programming method. -5 Ω·cm.

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PUM

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Abstract

The invention provides nano-silver conductive slurry, which comprises the following components in percentage by weight: 10 to 70 percent of nano-silver granules serving as a functional phase, and the balance of carrier phase. The nano-silver granules are uniformly dispersed in the carrier phase by methods of mechanical stirring, ultrasonic dispersion and the like to form the nano-silver conductive slurry; the slurry is molded by methods of spin coating, screen printing, micro thinning and micro-spray direct writing and the like, and then the molded slurry is thermally treated at the temperature of below 250 DEG C by a programmed heating method to form conductive patterns with good conductivity (the electrical resistivity is at a magnitude order of 0 to 50 ohm.cm) and high resolution (the maximum resolution is 30 mu m).

Description

technical field [0001] The invention belongs to the preparation technology of electronic paste, in particular to a nano-silver conductive paste. Background technique [0002] Electronic paste is an electronic functional material integrating materials, metallurgy, chemical industry, and electronic technology. It is the basic material for hybrid integrated circuits, sensitive components, surface mount technology, resistor networks, displays, and various electronic discrete devices. It occupies an important position in the information and electronics fields with its high quality, high efficiency, advanced technology, and wide application. It is widely used in aviation, aerospace, electronic computers, measurement and control systems, communication equipment, medical equipment, automotive industry, sensors, etc. and many other fields. [0003] As a basic electronic material with specific functions (such as conductivity, magnetism, resistance, etc.), electronic paste usually inc...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01B1/00H01B1/02H01B13/00B82B3/00
Inventor 刘建国曾晓雁王小叶李祥友
Owner HUAZHONG UNIV OF SCI & TECH
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