Multi-material laser direct writing conformal system and method

Abstract

The invention discloses a multi-material laser direct writing conformal system and a method. The system comprises a vacuum seal case, a multi-joint mechanical arm, a multi-material laser direct writing head and a control system for controlling the constituent parts, wherein the mechanical arm and the laser direct writing head are arranged in the vacuum seal case; the laser direct writing head comprises a direct writing head body, a laser and at least two groups of material cylinders; a material channel and a laser focusing channel communicated with the laser and the material cylinders respectively are arranged on the direct writing head body; and the at least two groups of material cylinders are arranged on the direct writing head body in parallel. A particular process is as follows: the mechanical arm drives a workpiece to move along a set path; a material controller selects the corresponding material cylinders; a discharge head delivers and allows materials to be attached to the surface of the workpiece; and at the same time, laser light emitted from the laser focusing channel carries out solidifying or sintering forming on the attached materials. According to the invention, a control process is simple, the forming precision is high, continuous production is achieved, and production efficiency is improved.

Description

technical field [0001] The invention belongs to the field of rapid prototyping, and relates to a multi-material laser direct writing conformal system and method. Background technique [0002] Three-dimensional molded interconnect device or electronic component (3D-MID) technology refers to the fabrication of a three-dimensional circuit with electrical functions on the surface of the workpiece shell. 3D-MID technology currently mainly includes two methods of double-mode injection molding (2 Shot MID) and laser laser molding (LDS MID), and mainly uses LDS as the main application. The main advantages of 3D-MID include: (1) three-dimensional circuit carrier, highly integrated circuit; (2) less conductive pattern processing steps, short manufacturing process; (3) the fabricated structure is lighter and smaller, saving design space; (4) ) At the same time, it meets the multiple verification and modification in the development and design, reducing the design and development time; ...

AI Technical Summary

Problems solved by technology

The existing inkjet printing technology and equipment have the following problems: (1) the printing material is single, (2) the printing head is in a moving state, the flow is difficult to control, which affects the molding accuracy, (3) the overall sintering is required after the wiring is completed, and the sintering is not real-time. , (4) There are processing dead angles in the 3D space of the gantry mobile table, etc.

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