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4 results about "Molded interconnect device" patented technology
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A molded interconnect device (MID) is an injection-molded thermoplastic part with integrated electronic circuit traces. The use of high temperature thermoplastics and their structured metallization opens a new dimension of circuit carrier design to the electronics industry. This technology combines plastic substrate/housing with circuitry into a single part by selective metallization.
Antenna assembly with metallized cavity waveguide
ActiveUS20260051660A1Antenna arraysRadiating elements structural formsAntenna substratePrinted circuit board
The present disclosure relates an antenna assembly that includes an antenna structure and a substrate. The antenna structure may be formed from a single contiguous piece of metal. The antenna structure may include at least one slot antenna formed in the single contiguous piece of metal. The substrate may include at least one dielectric layer, and a waveguide comprising a metallized cavity that extends through the at least one dielectric layer. The antenna structure may be attached to the substrate, may be disposed at an upper surface of the substrate, and may cover the metallized cavity of the waveguide. The substrate may be a printed circuit board (PCB) substrate, an in-mold electronics (IME) substrate, a molded interconnect device (MID) substrate, or another suitable substrate.
Owner:NXP BV
Acoustic transducer assembly with molded interconnect device (MID)
PendingJP2026518023AMaterial analysis using sonic/ultrasonic/infrasonic wavesPiezoelectric/electrostrictive transducersDielectricAcoustics
Acoustic transducer assemblies can be fabricated using a molded interconnect device (MID) approach. For example, each conductive interconnect can be formed on the inner surface of a cavity defined by a molded dielectric housing. Piezoelectric elements can be placed within the cavity and electrically supplied by the formed conductive interconnect. Backing material can be established within the cavity by filling and curing, etc. Parts of the molded dielectric housing, such as the walls, can provide an acoustic matching layer.
Owner:EVIDENT SCIENTIFIC INC
Antenna assembly with metallized cavity waveguide
ActiveUS12586915B2Radiating elements structural formsIndividually energised antenna arraysAntenna substratePrinted circuit board
The present disclosure relates an antenna assembly that includes an antenna structure and a substrate. The antenna structure may be formed from a single contiguous piece of metal. The antenna structure may include at least one slot antenna formed in the single contiguous piece of metal. The substrate may include at least one dielectric layer, and a waveguide comprising a metallized cavity that extends through the at least one dielectric layer. The antenna structure may be attached to the substrate, may be disposed at an upper surface of the substrate, and may cover the metallized cavity of the waveguide. The substrate may be a printed circuit board (PCB) substrate, an in-mold electronics (IME) substrate, a molded interconnect device (MID) substrate, or another suitable substrate.
Owner:NXP BV
Antenna assembly with metallized cavity waveguide
The present disclosure relates to an antenna assembly comprising an antenna structure and a substrate. The antenna structure may be formed from a single continuous metal piece. The antenna structure may include at least one slot antenna formed in the single continuous metal piece. The substrate may include at least one dielectric layer and a waveguide including a metallized cavity extending through the at least one dielectric layer. The antenna structure may be attached to the substrate, may be disposed at an upper surface of the substrate, and may cover the metallized cavity of the waveguide. The substrate may be a printed circuit board (PCB) substrate, an in-mold electronic (IME) substrate, a molded interconnect device (MID) substrate, or another suitable substrate.
Owner:NXP BV