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Moulded interconnect device with heat conduction property and manufacturing method thereof

A technology for molding interconnect components and manufacturing methods, applied in semiconductor devices, printed circuit manufacturing, cooling/ventilation/heating renovation, etc., and can solve problems such as electrical damage, fire, and electrical temperature rise.

Inactive Publication Date: 2012-05-30
KUANG HONG PRECISION
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0004] However, when designing products related to electrical appliances, it is always necessary to take heat dissipation into consideration, because when the current is turned on in the circuit, some of the energy will be converted into heat energy due to the resistance in the circuit, and the accumulation of heat energy will cause damage to the electrical appliances. The surrounding temperature is constantly rising, and a little carelessness may cause electrical damage or fire

Method used

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  • Moulded interconnect device with heat conduction property and manufacturing method thereof
  • Moulded interconnect device with heat conduction property and manufacturing method thereof
  • Moulded interconnect device with heat conduction property and manufacturing method thereof

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Embodiment Construction

[0091] The molded interconnection assembly with thermal conductivity and its manufacturing method according to preferred embodiments of the present invention will be described below with reference to the relevant drawings. For ease of understanding, the same components in the following embodiments are described with the same reference numerals.

[0092] Please refer to figure 1 , figure 1 is a schematic diagram of a first embodiment of a molded interconnection assembly with thermally conductive properties of the present invention. figure 1 Among them, the molded interconnection component with heat conduction properties of the present invention includes a carrier component, a heat conduction component 300 and a metal layer 400 . Wherein, the carrier component is, for example, a non-conductive support material (Non-conductive support material) 200 or a metallizable support material. In the first embodiment, the carrier component is a non-conductive carrier 200 . Wherein, the ...

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Abstract

A molded interconnect device (MID) with a thermal conductive property and a method for production thereof are disclosed. A thermal conductive element is set in a support element to improve the thermal conductivity of the support element, and the support element is a non-conductive support or a metallizable support. A metallization layer is formed on a surface of the support element. If a heat source is set on the metallization layer, heat produced by the heat source will pass out from the metallization layer or the support element with the thermal conductivity material element.

Description

technical field [0001] The present invention relates to a molded interconnection component and its manufacturing method, in particular to a molded interconnection component with heat conduction properties and its manufacturing method. Background technique [0002] Generally, when designing a circuit, the circuit is usually designed on a flat plate. However, the circuit board is usually a flat and sheet structure, so when designing related products that need to use the circuit, it is necessary to set up a space that can accommodate the circuit, which is quite inconvenient. . Therefore, some people began to integrate the circuit on the product, which is a molded interconnect device (Moulded Interconnect Device, MID). [0003] Molded interconnection components refer to the production of wires or graphics with electrical functions on the injection-molded plastic shell, so as to realize the integration of ordinary circuit boards and plastic protection and support functions, so a...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K7/20H01L23/36C23C18/14
CPCC25D5/56H05K3/185B29C2045/0079H01L23/49861B29K2995/0005H05K1/0206H05K3/182B29C45/0013B29C45/0053B29L2031/3493H01L2924/0002H05K2201/0236H05K2201/0209H05K2201/0215H05K2203/107C25D5/02B29C45/16C25D5/006H05K1/0203H05K3/0014C25D5/00H01L23/3677C25D7/00H01L2924/00
Inventor 江振丰江荣泉傅威程
Owner KUANG HONG PRECISION
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