Electrochemical etching liquid and etching method

An etching solution and electrochemical technology, which is applied in the field of electrochemical etching solution and etching, can solve the problems of slow etching speed, poor effect, and difficult processing of aluminum materials, and achieve the effect of speeding up and reducing side erosion
CN101210340AInactive Publication Date: 2008-07-02BYD CO LTD

Patent Information

Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
BYD CO LTD
Publication Date
2008-07-02
Estimated Expiration
Not applicable · inactive patent
Patent Text Reader

Abstract

An electrochemical etching solution is an aqueous solution containing sulfuric acid and phosphoric acid, wherein the etching solution also contains a surfactant. The electrochemical etching solution and the etching method provided by the invention can greatly increase the etching speed and reduce the occurrence of side etching phenomenon.
Need to check novelty before this filing date? Find Prior Art

Description

technical field

[0001] The invention relates to an etching solution and an etching method, in particular to an electrochemical etching solution and an etching method. Background technique

[0002] The principle of etching is to quickly dissolve and remove unwanted metals by using chemical solutions to corrode metals. The basic process of etching is to take the required pictures and make negatives, then expose them to ultraviolet radiation on the exposure table, print the pattern on the screen coated with photosensitive material, and then print the pattern on the metal surface by screen printing method. Selective corrosion is carried out with etching solution, and after removing the film, anodizing, cleaning, and drying, the metal material with graphics and text on the surface can be obtained, and a protective film can be further sprayed on the metal surface as required. This etching method is widely used in the treatment of metal surfaces in manufacturing and decoration ind...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More