46results about How to "Reduce side erosion" patented technology

The present invention provides one kind of magnetically controlled sputtering process of making printed circuit board. The process includes the following steps: drilling holes on the single layer base material; magnetically controlled sputtering the bottom dielectric and metal layer on the drilled single layer base material; magnetically controlled sputtering conducting copper layer on the single layer base material; drilling holes on multilayer board; magnetically controlled sputtering bottom dielectric and metal layer on the drilled multilayer board; magnetically controlled sputtering conducting copper layer on the drilled multilayer board; and repeating the foregoing steps until reaching the required layer number of the printed circuit board. The present invention combines unique hole forming method and sputtering method and has raised copper-plating and hole-metallizing efficiency, raised reliability and high fine circuit making capacity.

The invention discloses a method of manufacturing a thick copper foil PCB (Printed Circuit Board) and relates to a manufacturing technology of a PCB. The technical problem that thicker copper foil degree leads to bigger influence caused by obviously thinning surface of a copper foil circuit due to large lateral erosion amount in the etching process is solved. The method comprises the following steps of: 1) producing an anti-corrosion layer on a front surface of a copper foil according to a designed circuit diagram and applying the anti-corrosion layer on the back surface of the copper foil for protection; 2) etching the copper foil and stopping the etching when the depth of an etching area of the front surface is larger than 1/3 and is smaller than 2/3 the thickness of the copper foil; 3) removing the anti-corrosion layers on the front surface and the back surface of the copper foil and adhering the front surface to an insulating medium in a pressing manner; 4) forming an another anti-corrosion layer on the back surface of the copper foil again, wherein the anti-corrosion layer on the back surface of the copper foil is a mirror image of the circuit diagram on the front surface of the copper foil; and 5) etching the copper foil again and stopping the etching when the etching area of the back surface and the etching area of the front surface are etched to penetrate each other. The etching thickness of the copper foil can be increased by one time under the condition that the etching amount is reduced by 50% or the same lateral etching amount is required.

The invention relates to the technical field of PCB manufacturing, in particular to a fine-line PCB manufacturing method. The fine-line PCB manufacturing method sequentially comprises a press-fit step, a drilling step, a copper foil removal step, a copper deposition step, a step of transferring an outer layer image, a pattern plating step, a micro-etching step and a common back-end work procedure. Outer layer copper foil arranged on a multi-layer board in a press-fit mode is removed, copper deposition is carried out on a prepreg layer, pattern manufacturing and pattern plating are directly carried out on a copper deposition layer, and press-fit of a copper foil layer is omitted, so that a base copper layer is thin, a micro-etching mode is adopted in the outer layer etching process, and therefore the phenomenon of serious lateral erosion of the two sides of a line is avoided. The lateral erosion quantity of the two sides of the line is less than 1 micrometer and is reduced by ten times or more compared with that of the existing manufacturing process, and the manufacturing quality of a fine-line PCB is guaranteed. The smooth surface of the copper foil and the prepreg are bonded together in a press-fit mode, the binding force between the copper foil and the prepreg is reduced, the copper foil and the prepreg are poorly bonded, as a result, the hole collapse problem can be avoided in the drilling process, and the copper foil can be torn off after the drilling step.

The invention provides etching liquid and a method for etching fine lines of a flexible circuit board by using the same. The etching liquid takes water as a solvent, and comprises the following solutes by concentration: 130g/L-250g/L of copper chloride dehydrate, 100 mL/L-150 mL/L of 30% hydrochloric acid, 26.7g/L-128.4g/L of ammonium chloride, 0.5g/L-16g/L of banking agent and 2g/L-6g/L of secondary solvent, wherein the banking agent is a corrosion inhibitor; the secondary solvent is polyhydric alcohol. The etching liquid is an acid etching liquid which is high in dissolved copper and quick in etching velocity, does not contain hydrogen peroxide or sodium hypochlorite, is low in acid content, and is mixed with the secondary solvent and the banking agent to achieve a purpose of relieving lateral erosion while improving the etching velocity. The method for etching the fine lines of the flexible circuit board by utilizing the etching liquid disclosed by the invention is capable of completing etching more rapidly within short time, straight and flat in etched lines and high in etching factor, and therefore, the method can be used for processing the fine lines of the flexible circuit board.

The invention discloses a copper seed etching solution used for wafer level package. The etching solution comprises the following components, 40-60g/L of hydrogen peroxide, 5-35g/L of inorganic acid,5-35g/L of organic acid, 1-30g/L of copper ions, 1-2g/L of chloride ions and 1-2g/L of surface active agents according to the concentration proportion. The components are mixed in proportion, the mixing reaction temperature is between 30 DEG C and 50 DEG C, the reaction time is 1s-400s, and the copper seed etching solution is formed after mixing. Chelating agents formed by mixing the hydrogen peroxide and the inorganic acid and the copper ions can be subjected to chelation to form water-soluble complexes, so that equilibrium is reached; and the chloride ions play a role in maintaining the PH value of a system in the solution, maintains charge balance of the system in the etching process and prolongs the service life of the etching solution. The copper seed etching solution has the characteristics of being stable in performance, suitable for superfine circuits, small in lateral erosion and hardly corrosive to copper and aluminum.

The invention belongs to the technical field of semiconductor machining and relates to copper etching liquid with little lateral etching. According to a formula, the copper etching liquid comprises 1-15 wt% of hydrogen peroxide, 1-25 wt% of inorganic acid, 1-20 wt% of organic acid, 1-30 wt% of salts, 0.5-2 wt% of a surface active agent and the balance deionized water. The surface active agent is one of polydimethylsiloxane, methoxypolyethylene glycol, polyoxyethylene polyoxypropylene, polyoxyethylene poly(propylene oxide alkyl ether) and tetramethyl decynediol. The copper etching liquid is even in etching, the lateral etching phenomenon is reduced, foam is avoided, and the stability is good.

The invention relates to a PCB manufacturing method. The method comprises the steps of S1, performing cutting, drilling, electroless copper plating and full-board electroplating; S2, brushing and processing cinerite through non-woven fabrics; S3, pattern transfer; S4, pattern nickel gold electroplating; S5, outer layer etching. By the aid of the method, the PCB bonding tension value can reach 9N, compared with the prior art, the bonding tension value is improved greatly, the problems of bonding de-soldering, bonding deviation, poor bonding recognition and the like are solved effectively, and accordingly, the PCB quality is improved greatly.

The invention discloses a copper etching solution and a method for manufacturing a printed circuit board. The copper etching solution is used for carrying out copper etching on a flexible printed circuit board to form a circuit pattern and comprises the following components: 70-110g/L of copper ions, 2.0-5.0mol/L of chlorine ions, 2.5-5.5mol/L of a complexing agent and 0.1-2.0g/L of N-methyl-2-mercaptoimidazole, wherein the PH value of the copper etching solution is 7.5-9.5. The copper etching solution disclosed by the invention has the advantages that the phenomenon of lateral erosion can be effectively prevented in a circuit etching process, a regular rectangular circuit pattern is generated after etching, the open circuit condition among circuits is reduced and the etching velocity can be improved.

The invention provides a lamination technology of a precise circuit board. Brown oxidation is carried out on the smooth surface of a copper foil, the copper foil is laminated with a core plate with the smooth surface facing a prepreg, and a rough surface copper foil at the external layer of the circuit board is polished to obtain a flat copper surface. The lamination technology has the advantages that the etching time of the circuit board is reduced, the etching amount of the circuit side is reduced, and the line width precision of the circuit board is ensured.

Disclosed is a shadow mask having a fine slit that can improve precision and resolution of a pattern by reducing side etching during an etching process of a mask substrate, and a manufacturing method thereof. The shadow mask includes a mask substrate, a slit region formed by penetrating through the mask substrate, the slit region having a plurality of undercut portions at respective sides thereof, each undercut portion having a unit thickness, and a shadow region provided in the mask substrate, the shadow region corresponding to a region other than the slit region.

The invention relates to a preparation method of a super-hydrophobic coating. According to the etching method, three different steeping liquors are correspondingly used for steeping for some time, inthis way, the etching rate is increased by using the different steeping liquors for steeping, the etching rate is increased by adopting the specific steeping liquor proportion, the side etching amountand bulges are reduced by increasing the etching rate, the micro-nano shape formed on the surface of a copper sheet is more complicated, and the hydrophobicity, the friction resistance and the fracture resistance of the super-hydrophobic coating are improved. Fluoroalkyl silane and silane with the boiling points being similar are selected to be better deposited on the surface of matrix copper etched well, so that the coating has the very low surface energy, the quality of the coating is relatively stable, the good hydrophobic effect is reached, the corrosion resistance and cleanness of the copper are better, and the service life is longer.

The invention relates to the technical field of printed circuit boards, in particular to a method for manufacturing a negative film circuit board with a stepped circuit. The method manufactures a circuit board with a stepped circuit by a negative film process by performing full-board electroplating twice, making a circuit pattern by using dry film exposure development, and removing the copper layer in the non-circuit area by acid etching, and solves the problem that the existing negative film process cannot produces the stepped circuit. In addition, the method uses a vacuum laminator and an LDI exposure machine to perform the corresponding lamination and exposure processes when making outer layer circuit pattern, optimizes the lamination process parameters to ensure the bonding force between the dry film and the board surface and the exposure accuracy, and by optimizing the process parameters during the acid etching, satisfies the protection performance requirements of the outer layerpattern on a production board during the etching process, avoids the quality problems such as open circuits and gaps caused by the infiltration of an etching solution into the outer layer pattern, reduces side etching, and avoids a large line width and line gap tolerance due to side etching.

The invention discloses a laser-assisted precise circuit manufacturing method, which comprises the following steps that a production board is provided, and circuits needing to be manufactured on the production board comprise a thick circuit with the circuit distance larger than 50 microns and a precise circuit with the circuit distance smaller than or equal to 50 microns; a film is pasted on the production board, exposure treatment is carried out, exposure of the coarse lines and the precise lines is completed, and all gap parts between the precise lines are exposed; developing and etching the production board, wherein the etching amount during etching is controlled to be greater than half of the copper thickness of the circuit, and the bottom layer base material is not exposed; ablating a gap part between the precision circuits by adopting laser to remove a film and a part of copper layer at the gap of the precision circuits; and carrying out etching treatment and film stripping on the production board again, and forming a thick circuit and a precise circuit on the production board. According to the method, the technological process is optimized, the laser ablation and chemical etching combined copper removal mode is adopted in sequence, manufacturing of the precise circuit with the distance smaller than or equal to 50 micrometers can be achieved, the material and machining cost is low, and the technological process is simple.

The invention relates to an etching solution for processing an N-type silicon microchannel array by a photon-assisted electrochemical etching method, which belongs to the technical field of silicon micro-processing. In the prior art, the etching solution for processing an N-type silicon microchannel array by a photon-assisted electrochemical etching method is made by adding ethanol or p-octyl polyethylene glycol phenyl ether, which is used as a surfacetant, into hydrofluoric acid electrolyte, and the etching solution can result in severe lateral erosion in the etching process. The etching solution of the invention is prepared from hydrofluoric acid and ethanol water solution, wherein the concentration of the hydrofluoric acid is 1-10 wt%, and the concentration of the ethanol is5-10 wt%. In addition, an anionic surfactant is added, and the amount of the anionic surfactant is 0.1-1% of the hydrofluoric acid and ethanol water solution by volume. The invention is used for processing N-type macro-pore silicon microchannel arrays.

The invention relates to the field of semiconductor wafer packaging, in particular to a hydrogen peroxide system copper etching composition used in a wet etching process, and particularly relates to a thick copper etching composition and application thereof. The thick copper etching composition at least comprises the following components in percentage by weight: 1-20wt% of a component A, 1-30wt% of a component B and a component C, the component A is an oxidizing agent; the component B is inorganic acid and/or organic acid; and the component C is deionized water. The etching composition provided by the invention has the advantages of high stability, long etching life and large sheet running amount, the utilization rate of the etching composition is effectively improved, and only copper can be selectively etched; in addition, the etching composition also has the advantages of extremely low lateral erosion amount, good etching selection ratio, excellent etching uniformity, relatively high etching stability, relatively high etching rate stability, relatively long service life and the like.