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Copper etching solution and method for manufacturing printed circuit board

A printed circuit board, copper etching technology, applied in the field of copper etching solution for preparing fine circuit patterns, can solve the problems of affecting appearance, hindering etching, high ammonia consumption, etc., and achieving the effect of reducing side etching phenomenon

Inactive Publication Date: 2015-04-29
GUANGDONG DANBOND TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Ammonia etching solution usually has the following problems: 1) deposits such as basic copper chloride are easily formed on the etching board surface to hinder the etching and increase side erosion; 2) ammonia consumption is very large, and the circuit board etching process is More than 50kg of ammonia escapes per ton of etching solution, and the waste etching solution after etching contains more than 100kg / t of ammonia and ammonium salts. A large amount of ammonia gas escapes during its production preparation, transportation, use and post-use treatment. The negative impact of the production workshop and the surrounding environment is very prominent
[0005] Using the acidic etching solution system of sulfuric acid and hydrogen peroxide, although a relatively flat etching surface can be obtained, the side etching is very serious, which affects the appearance. At the same time, this etching system is not recycled. As the etching progresses, the acid concentration decreases and is controlled. more troublesome

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0025] This embodiment adopts

[0026] Chloride ion: 3.7mol / L

[0027] Ethanolamine: 4.7mol / L

[0028] N-methyl-2-mercaptoimidazole: 0.10g / L

[0029] The concentration of copper ions is 70g / L, 80g / L, 90g / L, 100g / L, 110g / L to prepare five groups of copper etching solutions, and the use temperature of each group of copper etching solutions is 60°C, all adjusted by sodium hydroxide The pH is 9.0.

[0030] Adopt above-mentioned five groups of copper etching solutions to carry out copper etching, and measure the etching rate and the side erosion factor of aforementioned copper etching solutions by static hanging piece and dynamic spray etching method respectively, obtain: Static and dynamic etching rate are respectively 6 μ m / min and 21.2μm / min, and the side etching phenomenon is effectively reduced while etching, and a relatively regular rectangular line is obtained.

Embodiment 2

[0032] This embodiment adopts

[0033] Copper ion: 85g / L

[0034] Ethanolamine: 4.7mol / L

[0035] N-methyl-2-mercaptoimidazole: 2.0g / L

[0036] Chloride ion concentrations were 2.0mol / L, 2.5mol / L, 3.0mol / L, 3.5mol / L, 4.0mol / L, 4.5mol / L, and 5.0mol / L to prepare seven groups of copper etching solutions, and each group of copper The use temperature of the etching solution is 60° C., and the pH is adjusted to 9.0 with sodium hydroxide.

[0037] The copper etching solution of this embodiment was used to etch the copper on the circuit board, and the etching rate and side erosion factor of the aforementioned copper etching solution were measured by the static hanging piece and the dynamic spray etching method respectively.

Embodiment 3

[0039] The copper etching solution that present embodiment provides is as follows:

[0040] Copper ion: 85g / L

[0041] Chloride ion: 3.7mol / L

[0042] N-methyl-2-mercaptoimidazole: 2.0g / L

[0043] The concentrations of ethanolamine are 2.5mol / L, 3.0mol / L, 3.5mol / L, 4.0mol / L, 4.5mol / L, 5.0mol / L, and 5.5mol / L to prepare seven groups of copper etching solutions, and each group of copper etching The use temperature of the solution is 60°C, and the pH is adjusted to 9.0 with sodium hydroxide. The copper etching solution of this embodiment was used to etch the copper on the circuit board, and the etching rate and side erosion factor of the aforementioned copper etching solution were measured by the static hanging piece and the dynamic spray etching method respectively.

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PUM

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Abstract

The invention discloses a copper etching solution and a method for manufacturing a printed circuit board. The copper etching solution is used for carrying out copper etching on a flexible printed circuit board to form a circuit pattern and comprises the following components: 70-110g / L of copper ions, 2.0-5.0mol / L of chlorine ions, 2.5-5.5mol / L of a complexing agent and 0.1-2.0g / L of N-methyl-2-mercaptoimidazole, wherein the PH value of the copper etching solution is 7.5-9.5. The copper etching solution disclosed by the invention has the advantages that the phenomenon of lateral erosion can be effectively prevented in a circuit etching process, a regular rectangular circuit pattern is generated after etching, the open circuit condition among circuits is reduced and the etching velocity can be improved.

Description

technical field [0001] The invention relates to the field of manufacturing flexible printed circuit boards (FPC), in particular to a copper etching solution for preparing fine circuit patterns. Background technique [0002] Due to its excellent performance, flexible printed circuit boards have an increasing market share and a wider range of applications. Its initial raw material is a flexible copper clad laminate. After "exposure-development" of the photosensitive material, the pattern transfer is realized. The resist layer is left on the circuit pattern, and the non-circuit part is exposed. The formation of the circuit pattern is through the non-circuit part. It is obtained by selective dissolution (ie etching). Copper etching solution is a solution that can dissolve copper quickly and cleanly, but it cannot significantly dissolve the copper under the circuit pattern. If the copper in the circuit part is dissolved, it is called side etching (recessing). [0003] With the ...

Claims

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Application Information

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IPC IPC(8): C23F1/34
Inventor 张双庆胡钢
Owner GUANGDONG DANBOND TECH
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