Silver thin film etching liquid composition, etching method using same, and metal pattern forming method

An etching solution and composition technology, applied in the field of silver thin film etching solution composition, can solve the problems of silver re-adsorption, wiring bite, performance degradation, etc., and achieve the effects of reducing side etching amount, maintaining etching performance, and improving etching efficiency

Pending Publication Date: 2021-11-16
DONGWOO FINE CHEM CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, since the etchant disclosed in this patent document does not produce an etch stop (Etch Stop) phenomenon, there is a problem as follows: with the increase of the etching time (Etching Time), not only the side etch (Side Etch) continues to increase and wiring occurs In addition, when evaluating the number of treatments, a large amount of re-adsorption of silver is caused due to performance degradation

Method used

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  • Silver thin film etching liquid composition, etching method using same, and metal pattern forming method
  • Silver thin film etching liquid composition, etching method using same, and metal pattern forming method

Examples

Experimental program
Comparison scheme
Effect test

experiment example

[0087] 1. New etchant and old etchant

[0088] The state just prepared of the silver thin film etchant compositions of Examples 1 to 3 and Comparative Examples 1 to 4 is called a new etchant, and the etchant has been subjected to a long-time etching process in order to assume that the etching solutions of Examples and Comparative Examples And the state after artificially dissolving 1000ppm silver powder (assessment of processing quantity) is called old etching solution.

[0089] Etching characteristics were evaluated by the following methods 2 to 5 using the new etchant and the old etchant, respectively.

[0090] 2. Side erosion measurement

[0091] After forming the ITO / silver / ITO trilayer film on the substrate, photoresist patterning was carried out on the trilayer film.

[0092] The silver thin film etchant composition of embodiment 1 to 3 and comparative example 1 to 4 is put into the experimental equipment (model: ETCHER (TFT), SEMES company) of spray type etching metho...

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Abstract

The present invention relates to a silver thin film etching liquid composition, an etching method using the same, and a meta pattern forming method. The silver thin film etching liquid composition comprises: (A) nitric acid; (B) an alkyl sulfonic acid having 1 to 3 carbon atoms; (C) an organic acid other than an alkyl sulfonic acid having 1 to 3 carbon atoms; (D) sulfate; (E) an iron-containing ternary metal salt; and (F) water.

Description

technical field [0001] The present invention relates to a silver thin film etchant composition, an etching method using the composition and a method for forming a metal pattern. Background technique [0002] Flat panel display devices such as OLEDs tend to be rapidly applied to small display markets such as portable devices and also to large displays such as TVs in recent years because the devices themselves emit light and can be driven at low voltage. [0003] On the other hand, metal thin films containing aluminum (Al) have been used in the past for the wiring of OLEDs or LCDs, reflectors, and electrodes of color filters, but recently have begun to use metal films that have a lower density than metals such as aluminum. A silver (Ag: resistivity of about 1.59 μΩcm) film, a silver alloy, or a multilayer film including the same with higher resistivity and higher brightness. [0004] For example, wiring and / or patterns are formed by etching a silver film, a silver alloy, or a...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C23F1/30C23F1/02
CPCC23F1/30C23F1/02H01L21/32051H01L21/32134
Inventor 南基龙尹暎晋李昔准李原昊权五柄
Owner DONGWOO FINE CHEM CO LTD
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