Method for manufacturing negative film circuit board with stepped circuit

A manufacturing method and a technology of circuit boards, which are applied in the manufacture of printed circuits, removal of conductive materials by chemical/electrolytic methods, printed circuits, etc., can solve the problems that circuit boards with stepped circuits cannot be produced, and negative film processes cannot produce stepped circuits. , to achieve the effects of ensuring the bonding force and exposure accuracy, optimizing the process parameters of the film, and optimizing the process parameters

Inactive Publication Date: 2019-12-20
JIANGMEN SUNTAK CIRCUIT TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] The present invention aims at the problem that the conventional negative process cannot be used to manufacture circuit boards with stepped circuits, and provides a method for manufact

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Example Embodiment

[0022] Example 1

[0023] This embodiment provides a method for manufacturing a negative circuit board with a stepped circuit. The outer circuit on the negative circuit board includes a thin copper circuit and a thick copper circuit. The copper thickness of the thick copper circuit is 2oz, and the copper of the thin copper circuit The thickness is 1oz, the line width and line gap are 4mil / 4mil, and the tolerance of the line width and line gap is ±3μm. Specific steps are as follows:

[0024] (1) Cutting: The core board is cut out according to the size of the panel 520mm×620mm, the thickness of the core board is 0.5mm, and the thickness of the copper layer on both surfaces of the core board is 0.50Z.

[0025] (2) Inner layer circuit production (negative film process): inner layer pattern transfer, use a vertical coating machine to coat the photosensitive film, the film thickness of the photosensitive film is controlled to 8μm, using a fully automatic exposure machine, with 6-8 grid ex...

Example Embodiment

[0043] Example 2

[0044] This embodiment provides a method for manufacturing a negative circuit board with a stepped circuit. The outer circuit on the negative circuit board includes a thin copper circuit and a thick copper circuit. The copper thickness of the thick copper circuit is 2oz, and the copper of the thin copper circuit The thickness is 1oz, the line width and line gap are 4mil / 4mil, and the tolerance of the line width and line gap is ±3μm. The specific steps are basically the same as those in Example 1, except that the pressing parameters used in step (9) of the outer layer pattern 2 are the pressing parameters for bonding the dry film to the production board by fast pressing: The temperature is 120℃, the pressure is 0.5MPa, and the speed is 1.0m / min.

[0045] In the same batch of circuit boards (50 sheets in total) prepared by the method of this embodiment, 5 circuit boards have problems such as open circuits and circuit gaps due to the penetration of the etching solu...

Example Embodiment

[0046] Example 3

[0047] This embodiment provides a method for manufacturing a negative circuit board with a stepped circuit. The outer circuit on the negative circuit board includes a thin copper circuit and a thick copper circuit. The copper thickness of the thick copper circuit is 2oz, and the copper of the thin copper circuit The thickness is 1oz, the line width and line gap are 4mil / 4mil, and the tolerance of the line width and line gap is ±3μm. The specific steps are basically the same as those of Example 1, except that the etching in step (10) is as follows: acid etching the production board to remove the copper layer on the exposed copper surface, and then stripping the film to obtain the outer layer circuit; acid etching The parameters used are: acidity 2.0-3.0N, Cu 2+ The concentration is 110-150g / L, NaClO 3 The CAP value is 20-60, the temperature is 50±2℃, the etching speed is 2.0-7.0m / min (the transmission speed of the production board in the etching cylinder, the l...

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Abstract

The invention relates to the technical field of printed circuit boards, in particular to a method for manufacturing a negative film circuit board with a stepped circuit. The method manufactures a circuit board with a stepped circuit by a negative film process by performing full-board electroplating twice, making a circuit pattern by using dry film exposure development, and removing the copper layer in the non-circuit area by acid etching, and solves the problem that the existing negative film process cannot produces the stepped circuit. In addition, the method uses a vacuum laminator and an LDI exposure machine to perform the corresponding lamination and exposure processes when making outer layer circuit pattern, optimizes the lamination process parameters to ensure the bonding force between the dry film and the board surface and the exposure accuracy, and by optimizing the process parameters during the acid etching, satisfies the protection performance requirements of the outer layerpattern on a production board during the etching process, avoids the quality problems such as open circuits and gaps caused by the infiltration of an etching solution into the outer layer pattern, reduces side etching, and avoids a large line width and line gap tolerance due to side etching.

Description

technical field [0001] The invention relates to the technical field of printed circuit boards, in particular to a method for manufacturing a negative circuit board with ladder lines. Background technique [0002] The printed circuit board can be divided into positive board and negative board according to the manufacturing process of the outer circuit. The so-called negative board refers to the use of dry film exposure and development technology to make circuit patterns on the board surface when making the outer circuit. The copper surface of the circuit is formed and the other copper surfaces are exposed, and then a type of circuit board product is produced by using the same acid etching process as the inner layer circuit for etching. The conventional production process includes: cutting → inner layer pattern → Acid etching→inner layer AOI→browning→pressing→drilling→immersion copper→full plate plating→outer layer graphics→acid etching→outer layer AOI→solder mask, characters→...

Claims

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Application Information

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IPC IPC(8): H05K3/02H05K3/06
CPCH05K3/022H05K3/06
Inventor 寻瑞平高赵军白亚旭钟君武张雪松
Owner JIANGMEN SUNTAK CIRCUIT TECH
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