The utility model relates to the technical field of shock -proof buffer structure, and disclose a kind of
laser internal circuit board shock -proof buffer structure, including connecting strip, the left side of the connecting strip is provided with shock -proof buffer mechanism, the top of the connecting strip is provided with limiting mechanism.The
laser internal circuit board shock -proof buffer structure, through the
aluminium foil layer and
silicon rubber layer of staggered laminated distribution, energy generated by vibration can be absorbed, and then realize the shock -proof buffer of circuit board, simultaneously utilize the characteristics that
aluminium foil layer can provide
high heat conduction path, can be discharged in the cooperation of heat
conduction channel formed by strip-shaped radiating groove and
honeycomb radiating groove, the energy of circuit board heat emission, while solve the limitation of existing rubber shock pad, no heat insulation phenomenon generated by poor heat
conductivity occurs, the heat of circuit board cannot be accumulated, and then avoid the material
accelerated aging of shock -proof buffer structure due to long-term high temperature, ensure that under long time use, shock -proof buffer effect will not be reduced.