Resist adhesion improver and method for producing copper wiring line

Abstract

A resist adhesion improver which contains 1.5-20% by weight of an organic acid, 0.0007-0.73% by weight of chloride ions and 0.00003-3.7% by weight of ammonium ions, with the balance made up of water, and wherein the molar concentration ratio of the chloride ions to the ammonium ions is within the range of 0.1-10; and a method for producing a copper wiring line, wherein when a photosensitive resist film is formed on a copper film, the copper film surface is processed using the resist adhesion improver and then the photosensitive resist film is formed on the copper film. Consequently, adhesion of the photosensitive resist to the copper film surface is improved.

Description

technical field [0001] The resist adhesion improving agent and the copper wiring manufacturing method according to the present invention utilize the copper wiring formed from the copper film on the surface of the substrate in the manufacture of display devices such as liquid crystal displays (LCD) and electroluminescent (EL) displays. When forming a resist film on the surface of the copper film, the line step is suitable for surface treatment of the copper film to improve the adhesion between the resist film and the surface of the copper film. Background technique [0002] In high-performance LCD and EL displays, copper is beginning to be used as a wiring material instead of aluminum. The reason why copper is preferable is that it has a lower resistivity than aluminum and can miniaturize the wiring, so it has advantages such as wide design of openings and high-speed driving of switches. [0003] As a method of manufacturing copper wiring, the following method is generally u...

AI Technical Summary

Problems solved by technology

[0012] As a result of the study by the present inventors, it can be seen that when a photosensitive resist film is formed on a substrate after surface treatment of the copper film using such a cleaning solution, there is almost no difference in the amount of undercut during etching and when the surface treatment is not performed. Therefore, it does not help to improve the adhesion of the resist film on the copper surface

Images