The invention relates to an etching solution for a general resistance silicon product. The etching solution is composed of ammonium bifluoride, potassium nitrate, sulfuric acid, ammonium persulfate, polyethylene glycol, phosphoric acid and a propylene glycol block polyether aqueous solution. According to the characteristics of common resistance silicon products, the traditional etching solution prepared from high-concentration and high-corrosivity hydrofluoric acid, nitric acid, acetic acid and water is improved, a certain amount of HF can be generated according to a certain rate when ammonium bifluoride and sulfuric acid are properly proportioned, and a small amount of potassium nitrate, ammonium persulfate and phosphoric acid are proportioned for etching. The spots or chromatic aberration phenomena generated in incomplete or uneven etching are reduced. The reaction is uniform and mild, the roughness is consistent with that before etching, and the roughness is not increased.