96results about How to "Reduce insulation thickness" patented technology

A biosensor that detects a target substance contained in a liquid sample has an insulating base plate including a recess formed in a portion that is thinner than the surrounding part, a working electrode and a counter electrode, at least one of which is disposed in the recess, and a reaction reagent that is disposed in the recess and reacts with a specific substance in the liquid sample.

An auxiliary capacitance line and a terminal portion of a liquid crystal display device are made of an Al or Al alloy layer and an Mo layer. The edge portions of a lower auxiliary capacitance electrode and the terminal portion are sequentially coated with a first insulating film, a second insulating film that is thinner than the first insulating film, and a third insulating film. The lower auxiliary capacitance electrode is coated with the second insulating film, and an upper auxiliary capacitance electrode is laid on the surface of the second insulating film on the lower auxiliary capacitance electrode.

A miniaturized semiconductor device is provided by reducing the design thickness of a wiring line protecting film covering the surface of a wiring layer, and reducing the distance between the wiring layer and via plugs formed by a self-aligning process. Dummy mask layers extending in the same layout pattern as the wiring layer is formed above the wiring layer covered with a protecting film composed of a cap layer and side wall layers. In the self-aligning process for forming via plugs in a self-aligned manner with the wiring layer and its protecting film, the thickness of the cap layer is reduced and the design interval between the via plugs is reduced, whereby the miniaturization of the semiconductor device is achieved.

In a semiconductor device according to the present invention, an electrode layer and a recessed part are formed on a surface of a semiconductor substrate. Further, in the semiconductor substrate, a RESURF layer that is in contact with a bottom surface of the recessed part and the electrode layer is formed. In addition, an insulating film is formed on an upper surface of the semiconductor substrate so as to fill the recessed part. Moreover, a field plate electrode is formed on the insulating film above the recessed part.

An electric wire for an automobile has a core wire section and an outer circumferential wire section. The core wire section is formed by spirally winding six element wires around one element wire, where each element wire is made of stainless steel having elongation of 30% or more and tensile strength of 920 MPa or higher and the element wires have the same diameter in the range of 0.127 mm±10%. The circumferential wire section is formed by spirally winding twelve element wires around the core wire section, where the twelve element wires are wound close to each other in a single layer, each element wire is made of copper having tensile strength of 220 MPa or higher, and the element wires have the same diameter in the range of 0.127 mm±10%. The wire is light, small, strong and has good bending characteristics.

A heat exchange unit is constituted of a thermoelectric module and a heat exchanger. The thermoelectric module includes an upper electrode, a lower electrode, and a plurality of thermoelectric elements interposed between the upper electrode and the lower electrode, wherein the heat exchanger composed of aluminum or aluminum alloy having high thermal conductivity is attached to the upper electrode and/or the lower electrode via an insulating layer. The surface roughness of the heat exchanger adjoined to the insulating layer is controlled to be less than 4.7 μm and greater than 0.1 μm. This prevents cracks and fractures from being formed in the insulating layer, which is thus improved in adhesion with the heat exchanger. Thus, it is possible to demonstrate high heat-absorption/dissipation performance and high reliability in the heat exchange unit due to a reduced thermal resistance between the thermoelectric module and the heat exchanger.

A semiconductor display device comprising a pixel portion and a signal line driver circuit comprising a first circuit, a second circuit configured to control timing of the sampled serial video signals by the first circuit, and a third circuit configured to perform signal processing on the parallel video signals, wherein the second circuit comprises a first semiconductor element formed over a first substrate, the first semiconductor element including a first semiconductor layer, wherein the third circuit comprises a second semiconductor element formed over a second substrate, the second semiconductor element including a second semiconductor layer, wherein the pixel portion comprises a third semiconductor element formed over the second substrate, the third semiconductor element including a third semiconductor layer, wherein the first semiconductor layer comprises silicon or germanium, and wherein each the second semiconductor layer and the third semiconductor layer has a wider bandgap than the first semiconductor layer.

The invention comprises: a stator, a rotor and coil. The coil of said rotator and stator uses the copper flat wire made of the tong-ma epoxy glass mica and the non-coated Dacron glass copper flat wire. The capacity-increased modification technology comprises the stator modification technology and rotator medication technology. The F class stator coil insulation structure provided by the invention has an insulation layer made by means of integral hot-embossing, and its lower and upper edge is everted 90degree so as to reduce the space occupied by the coil; the thickness of the insulation between coil interturns is reduced.

An engine arrangement includes an engine, a charge air cooler connected to an engine inlet side of the engine, an air bypass for bypassing the charge air cooler, and including an EGR system connected between engine outlet side and an engine inlet side of the engine via one or more EGR lines. The air bypass enters the EGR system at an air-bypass port of an EGR line for mixing air with exhaust gas at the engine outlet side of the EGR system and/or upstream of an EGR cooler. An engine arrangement can also comprise an engine, a charge air cooler connected via an air line to an engine inlet side of the engine, an air bypass for bypassing the charge air cooler, and including an EGR system connected between an engine outlet side and an engine inlet side of the engine via one or more EGR lines. A control device is provided for controlling an engine inlet temperature of an air/exhaust gas mixture by controlling a ratio of cooled/uncooled air and/or cooled/uncooled exhaust gas in the air/exhaust gas mixture.

A non-reciprocal circuit element for transmitting a high-frequency signal of microwave band in one direction. The electrical characteristics of the non-reciprocal circuit element have been improved by using an insulating sheet having a thickness within a specific range thereby to regulate the distance between vertically adjacent strip electrodes within a specific range. Also, the product-to-product variation in the electrical characteristics of the non-reciprocal circuit element has been minimized by shaping the end portion of the strip electrode so as to extend in coplanar relationship to the top surface of the capacitor to be connected.

The invention discloses a 6 kilovolt level high-voltage motor insulation structure and a manufacturing method of the insulation structure. The insulation structure comprises an electromagnetic coil provided with a guide line insulating layer, and a main insulating layer manufactured on the electromagnetic coil in a winding mode. Epoxy acid anhydride type impregnating resin condensates are arranged in a gap between the guide line insulating layer on the electromagnetic coil and the main insulating layer. The 6 kilovolt level high-voltage motor insulation structure and the manufacturing method of the insulation structure have the advantages that insulating strength of the guide line insulating layer and the main insulating layer are both greatly promoted, but insulating thickness of the guide line insulating layer and the main insulating layer are obviously thinned.

The invention discloses a less-resin mica tape used for a high voltage motor and a preparation method thereof. The less-resin mica tape comprises a mica paper layer, a reinforced material layer, and an adhesive layer. The mica paper layer is formed by a piece of prepared mica paper. The preparation method comprises steps that step1, the prepared mica paper, the adhesive, and the reinforced material are selected; step2, uniform printing, spraying, or frictioning of solvent-free solid adhesive or semi-solid resin adhesive on the prepared mica paper or the reinforced material is carried out; step3, the hot pressing synthesis of the prepared mica paper and the reinforced material is carried out to form a mica tape blank material; step 4, cure accelerator prepared into solution is sprayed on the mica tape blank material, and permeates in the mica tape blank material. The less-resin mica tape has advantages of enhanced electrical intensity, excellent electrical aging performance, electrical performance uniformity, and ability of satisfying requirements of advanced less-resin VPI technology on permeability of mica tapes.

The present invention provides a high-low-voltage conversion star multi-phase variable-frequency drive system and relates to a high-voltage high-power motor and drive control thereof. The variable-frequency drive technical solution which is commonly used at present mainly has the disadvantages that a frequency converter is added to a common motor, the insulation life of the motor is short and the heat dissipating ability of the motor is poor. The system comprises a phase-shifting transformer, rectifying circuits, inverter circuits, a multi-phase motor, and a control circuit connected with the phase-shifting transformer, the rectifying circuits, the inverter circuits and the multi-phase motor, wherein primary windings of the phase-shifting transformer are connected with an alternating-current power source, and secondary windings of the phase-shifting transformer are connected with the rectifying circuits; and is characterized in that the number of the secondary windings is the same as the number of the rectifying circuits, one secondary winding is connected with one rectifying circuit, all rectifying circuits are in common-ground connection to form a common-ground direct-current power source, and output ends of the rectifying circuits are connected with the inverter circuits. By adopting the technical solution, high voltage and large currents are realized, simultaneously the structure is simple, the insulation requirement is lowered, the heat dissipating ability of the motor is improved and the power density is increased.

The invention discloses a single coil VPI process so as to solve the problem that a large water power generator carries out the VPI process difficultly in the prior art. The single coil VPI process sequentially comprises the following steps that VPI and baking are carried out on a single coil, and the coil is embedded. According to the scheme, the single coil VPI process has the advantages that the whole machine coil embedding is carried out after the single coil is manufactured in a VPI mode, the size of an iron core is large, operation is not easy, the insulation thickness can be decreased, the product cost is lowered, and the insulation quality of a motor is promoted to be a high level, the service life of the motor is prolonged, and the difficult problem of manufacturing of a stator coil in a medium-type water power generator is solved.

A magnetic field sensing device and a fabrication method of the same featuring an easy planarization profess for a substrate and a simplified procedure by the benefit of a slim planarizing substance. The magnetic field sensing device includes a substrate with a well of a predetermined depth and a plurality of grooves being formed thereon and a magnetic substance formed on an inner surface of the well to be located on an upper portion of the grooves. A first coil is formed in the grooves, a second coil is formed on an upper portion of the magnetic substance and is electrically connected to the first coil and insulating films are interposed between the first and the second coil and the magnetic substance for insulating the first and the second coil from the magnetic substance.

The invention provides a motor forming coil insulation thinning method comprising the following steps: selecting an insulating material to wrap a copper flat wire to make a coil; half-lapping the coil with an insulating tape to form a coil mica insulation; binding up an insulating protective tape outside the coil mica insulation to form a protective insulation; sealing and binding up the end of the coil; and placing the coil bound up tightly on a lacquer dipping tool, taking solvent-free impregnating resin as impregnating resin, removing the seal and bandage at the end of the coil after the coil is impregnated at vacuum pressure, baked and cured, carrying out winding stator line embedding and arranging work, and after that, impregnating the winding-containing stator core at vacuum pressure and baking and curing the stator core. The coil mica insulation and the protective insulation constitute a coil main insulation of which the single-side thickness is less than or equal to 0.98mm. Through the method provided by the invention, the insulation thickness of the motor forming coil is reduced. The motor size is reduced under the condition of same power, and the power is increased and energy saving and consumption reducing are achieved under the condition of same size.