31results about How to "Much is dissipated as heat" patented technology

A solid state lighting subassembly or fixture includes an anisotropic heat spreading material. A heat spreading layer may be placed between a light emitting diode (LED) and luminaire or reflector and serves to spread heat laterally away from the LED. Low profile, low weight heat spreading may be utilized both to retrofit existing light fixtures with. LEDs or to replace existing incandescent and fluorescent fixtures with LED based fixtures.

An LED lighting apparatus dissipating heat by fanless ventilation including a heat radiation housing that has a heat radiation frame provided around the body of the heat radiation housing and spaced apart from the body and also has linear heat radiation fins configured to minimize interference to air flow and to maximize the heat radiation area, thereby expanding the heat radiation area significantly and thus dissipating heat much more effectively through ventilation by natural convection without a blowing fan, and consequently, extending the life span of the LED lighting apparatus and improving its quality. The LED lighting apparatus comprises a light source part including at least one LED and a PCB used to mount the LED; and a heat radiation housing provided at the upper portion thereof with a terminal part, receiving and supporting the light source part and dissipating heat.

A light-emitting heat-dissipating device includes a substrate and at least a light-emitting package module capable of generating heat. The substrate includes at least a recess and at least one thermally conducting element disposed in the recess. The light-emitting package module is disposed on the thermally conducting element and electrically connected to the substrate of the substrate via solder joints. A manufacturing method of the light-emitting heat-dissipating device is also disclosed.

A direct contact steam injection heater is placed directly in line with a flow of stock through a pipe. The steam injection heater includes a Mach diffuser having a plurality of steam diffusion holes and an adjustable steam-plug cover that is positioned within a stationary diffuser tube to modulate the amount of steam added to the flowing stock by exposing a desired number of steam diffusion holes. The steam tube assembly includes an O-ring that forms a seal along the inner wall of the diffuser tube to prevent the flow of stock into the steam tube assembly when steam pressure is not present. Select areas of the steam injection heater, including the deflection plate, diffuser tube and heater body inner wall are coated with a wear coating such as tungsten carbide. Further, a pair of pressure ports are formed in the steam-plug cover to equalize the pressure between the open interior of the steam-plug cover to further facilitate rotation of the steam-plug cover.

A heat sink, wherein a plurality of heat radiation fins are mounted on a base plate to which an electron device is attached in a heat transmittable manner. The heat radiation fins are erected vertically and in parallel with each other on the reverse face of the base plate to which the electron device is contacted, and extended laterally from the base plate. The heat sink of the invention comprises a heat pipe for transporting heat between the extended portion of the heat radiation fins and the base plate.

A portable riser for supporting a laptop computer or other article at an angle to a supporting surface. The riser includes a base and lid attached to each other by a double hinge. Arc shaped legs deploy form the riser when the lid is moved from a closed position to an deployed position a position where the lid rests against the opposite side of the base. The legs are formed by deforming a sheet of flexible material that lies between the base and a cover plate. The lid and the sheet of flexible material are coupled to each other so that when the lid is moved from the closed to the deployed position, the sheet of material is deployed.

In at least one embodiment, a source driver of a film package type, includes: a film substrate; a semiconductor chip on a surface of the film substrate, the semiconductor chip having a plurality of terminals each of which is connectable to an external member, the plurality of terminals including input terminals, output terminals, and third terminals; an input terminal wiring region for receiving first wiring lines which are connected to the input terminals, respectively, the input terminal region being provided on the surface of the film substrate; an output terminal wiring region for receiving second wiring lines which are connected to the output terminals, respectively, the output terminal wiring region being provided on the surface of the film substrate; and sprocket portions at opposite ends of the film substrate, each of the sprocket portions having a copper foil on the surface, and a string of holes, the input terminal wiring region and the output terminal wiring region being provided so as to extend toward opposite ends having no sprocket portion, respectively, the source driver further including a heat conducting patterns for connecting the third terminals, each of which is connected to neither any one of the plurality of first wiring lines nor any one of the plurality of second wiring lines, to the copper foils of the sprocket portions, respectively, the heat conducting patterns being provided on the surface of the film substrate. This makes it possible to provide a source driver, a method for manufacturing the source driver, and a liquid crystal module, each of which can increase a heat dissipation amount.

A portable air compressor includes a box and a compressor unit accommodated in the box. The compressor unit includes a main frame, a cylinder fitted with a piston body, a motor, and a transmission mechanism. The motor drives the transmission mechanism to have the piston body conduct reciprocating motion in the cylinder to produce compressed air, which is transferred to an air storage container. The cylinder and the main frame are integrally formed of plastic. The cylinder defines an exit hole communicating with an inner space thereof. A metal seat is integrally formed at the cylinder. The central hole of the metal seat communicates with the exit hole of the cylinder. A plug is urged by a compression spring to seal the central hole of the metal seat. The metal seat can endure high temperature within the cylinder to ensure air-tightness between the plug and the metal seat.

A heat dissipating cavity includes a cavity made of high thermal conductive material having a plurality of heat dissipating fins on the outside thereof, and temperature equalizing elements including heat pipes and heat expansion plates, which can be used individually or collectively. The heat generated by the heating electronic elements inside the cavity is first effectively conducted to the temperature equalizing elements, wherefrom effectively and evenly conducted to the entire cavity, and finally released out of the system by the plurality of heat dissipating fins. The use of temperature equalizing elements increases the homogeneity of the cavity's overall temperature and greatly improves the efficiency of heat dissipation.

A server includes a chassis, processing units and an airflow generating device. The processing units are disposed inside the chassis for heat dissipation of the processing units. Each processing unit includes a motherboard, an electric heat source, a heat dissipation fin set and a stopping air bag. The electric heat source is disposed on the motherboard, the heat dissipation fin set is attached to the electric heat source and the stopping air bag including an air inlet opening is located at space between the heat dissipation fin set and one of the processing units which is adjacent to the stopping air bag. When the airflow generating devices are operated, air is blown into the stopping air bag through the air inlet opening so that the stopping air bag is inflated to occupy the space to stop an airflow from flowing through the space.

A cooling module for an LED lamp includes a thermostatic plate, a hollow column, and a plurality of cooling fins. The thermostatic plate has an evaporating segment and a pair of condensing segments extending from the evaporating segment. The outer surface of the hollow column has a pair of grooves corresponding to each other. The condensing segments of the thermostatic plate are buried in the grooves. The cooling fins surround and thermally contact the outer rim of the hollow column and the condensing segments.

A clip for fixing a heat sink on a retaining bracket includes an elastic supporter, an operating member, a movable fastener and a fixing bar. Two ends of the elastic supporter have a connecting portion and a first buckle portion, respectively. The operating member has a resisting portion, a pivot portion and an operating bar. The pivot portion pivots to the connecting portion. The movable fastener installs on the resisting portion and the connecting portion, and includes two sliding slots, a resisting surface and a second buckle portion. The resisting portion has an arc surface for resisting against the resisting surface. The distance between the apex of the arc surface and the pivot portion is the largest distance between the arc surface and the pivot portion. When the clip is locked, the junction of the resisting portion and the resisting surface excludes the apex of the arc surface.

A heat dissipating cavity of looped heat pipe structure includes a cavity made of high thermal conductive material having a plurality of heat dissipating fins on the outside thereof, and looped heat pipes. The heat generated by the heating electronic elements inside the cavity is first effectively conducted to the looped heat pipes, wherefrom to the entire cavity, and finally released out of the system by the plurality of heat dissipating fins. The use of looped heat pipes increases the homogeneity of the cavity's overall temperature and greatly improves the efficiency of heat dissipation.

A heat dissipation device includes a covering member, a heat pipe, and a heat dissipation unit. The covering member has a hollow C-shaped fitting portion, in which the heat pipe is fitted to tightly connect to the covering member. At least one first heat transfer portion is outwardly extended from a periphery of the C-shaped fitting portion of the covering member. The heat dissipation unit has a plurality of parallelly spaced heat radiation fins, each of which has a through hole formed thereon, and at least one first locating slot is outwardly extended from the through hole. When the C-shaped fitting portion and the first heat transfer portion are respectively extended through the through holes and the first locating slots, the covering member is connected to the heat dissipation unit. With the first heat transfer portion, the heat dissipation device can have enhanced heat transfer and dissipation effect.