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84results about How to "Increased heat generation" patented technology

Corrosion resistant steel cords and pneumatic tires reinforced with same

InactiveUS6102095ALowering of resistance to corrosion fatigueHigh tensile strengthPneumatic tyre reinforcementsYarnSurface layerMetallurgy
PCT No. PCT/JP97/01338 Sec. 371 Date Nov. 24, 1997 Sec. 102(e) Date Nov. 24, 1997 PCT Filed Apr. 18, 1997 PCT Pub. No. WO97/39176 PCT Pub. Date Oct. 23, 1997A corrosion resistant steel cord for reinforcing rubber articles, particularly a belt and/or carcass of a pneumatic tire, has a residual compressive stress inside the twisting helix of each steel filament such that a ratio R1/R0 is less than one, where R0 is the radius of curvature of a helix in each helically formed steel filament obtained by untwisting of the cord and R1 is the radius of curvature of the helix after removal of a surface layer from the inside of the helix in the steel filament. The steel filaments have a tensile strength of 4,000-4,800 N/mm2. The cord does not have a wrapping wire around its outer peripheral surface and has either a single twisted construction obtained by twisting 3 to 6 steel filaments in an open structure having a space between adjacent filaments or a two-layer twisted construction obtained by surrounding a core of n=1-4 steel filaments with a sheath of n+(2-6) steel filaments in a rubber penetration structure having a space between adjacent filaments of the sheath or a three-layer twisted construction obtained by surrounding a core of a single steel filament with a first sheath of m=3-6 steel filaments and a second sheath of m+(2-6) steel filaments in a rubber penetration structure having a space between adjacent filaments of each sheath.
Owner:BRIDGESTONE CORP +1

Source driver, method for manufacturing same, and liquid crystal module

In at least one embodiment, a source driver of a film package type, includes: a film substrate; a semiconductor chip on a surface of the film substrate, the semiconductor chip having a plurality of terminals each of which is connectable to an external member, the plurality of terminals including input terminals, output terminals, and third terminals; an input terminal wiring region for receiving first wiring lines which are connected to the input terminals, respectively, the input terminal region being provided on the surface of the film substrate; an output terminal wiring region for receiving second wiring lines which are connected to the output terminals, respectively, the output terminal wiring region being provided on the surface of the film substrate; and sprocket portions at opposite ends of the film substrate, each of the sprocket portions having a copper foil on the surface, and a string of holes, the input terminal wiring region and the output terminal wiring region being provided so as to extend toward opposite ends having no sprocket portion, respectively, the source driver further including a heat conducting patterns for connecting the third terminals, each of which is connected to neither any one of the plurality of first wiring lines nor any one of the plurality of second wiring lines, to the copper foils of the sprocket portions, respectively, the heat conducting patterns being provided on the surface of the film substrate. This makes it possible to provide a source driver, a method for manufacturing the source driver, and a liquid crystal module, each of which can increase a heat dissipation amount.
Owner:SHENZHEN TOREY MICROELECTRONIC TECH CO LTD
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