504results about How to "Improve contact reliability" patented technology

Provided are an organic light emitting display device and a manufacturing method thereof. In the organic light emitting display device, after an auxiliary electrode having a multilayer structure including different kinds of metals different in etching speed is formed, a void is formed within the auxiliary electrode upon formation of an anode. The resulting structure is created by a simplified process, with contact reliability between a cathode and the auxiliary electrode being enhanced, while resistance of the cathode is reduced.

A stamp for micro-transfer printing includes a body and one or more posts extending from the body. At least one of the posts has a non-planar surface contour on the distal end of the post having a size, shape, or size and shape that accommodates a non-planar contact surface of a micro-transfer printable device.

A printed circuit board and a manufacturing method thereof are disclosed. Using a method of manufacturing a printed circuit board which includes forming a circuit pattern, which includes lands, on a first board; forming a paste bump on the land of the first board; and stacking an insulation on a surface of the first board such that the paste bump penetrates the insulation, where the paste bump is formed to cover the land of the first board, the areas of the lands can be reduced to manufacture a printed circuit board of high density, and the contact reliability can be increased due to the increase in contact area between the lands and paste bumps to improve the performance of the high-density printed circuit-board.

The present disclosure relates to an organic light emitting display device and a method for manufacturing the same. The present disclosure suggests an organic light emitting display device including an organic layer; a display element layer including a display area representing video data and a pad area extended from the display area, on the organic layer; film elements formed on the display element layer; a film type printed circuit board connected to the pad area; and a reinforcing adhesive filling a space between the film type printed circuit board and the film elements

The Present Disclosure relates to mold a micro SIM card connecting terminal and a micro SD card connecting terminal by means of an integrated terminal mold, so as to significantly reduce the whole length of the dual memory card socket and manufacturing method thereof. The Present Disclosure is formed by a structure manufactured by molding the micro SIM card connecting terminal and the micro SD card connecting terminal by means of an integrated terminal mold, and then separating them by a cutting process.

A connector capable of improving the durability and the contact reliability of a contact. In the contact, a pair of spring portions for pressing a contact portion against a card-type electronic component are formed continuous with the contact portion that is brought into contact with the card-type electronic component. A holding portion held by a housing is formed continuous with the spring portions A connection portion connected to a printed board is formed continuous with the holding portion. The spring portions are made elastically deformable independently of each other, and are bent such that part and the other part of each spring portion do not interfere with each other in a direction of height of the housing when the spring portion is elastically deformed.

In an ultrasound transducer arrangement comprising at least one piezoelectric body with a lower and an upper electrode and a coupling layer including a wafer on which the ultrasound transducers are disposed and are connected to the lower electrode, a conductor structure of uniform height is disposed on the wafer and is in contact with the lower electrode and any space between the piezoelectric body and the wafer is completely filled with a cement material.

The on-vehicle electronic control device includes a main power supply circuit fed with power from an on-vehicle battery through an output contact of a power supply relay and a main power supply terminal of a connector to supply a stabilized control voltage to a microprocessor. When contact failure occurs in the main power supply terminal, the main power supply circuit is fed with bypass power from the output contact through a first electrical load and a commutation diode to perform the one of the report of the abnormality and the storage of the abnormality occurrence history information. A bypass power fed state is detected when an input voltage to the main power supply circuit is lower than a power supply voltage of the on-vehicle battery.

A multilayered printed circuit board and a method of fabricating the printed circuit board are disclosed. The method of fabricating the multilayered printed circuit board can include: providing a core substrate, which has an outer circuit, and which has a thermal expansion coefficient of 10 to 20 ppm / ° C. at −60 to 150° C.; stacking a stress-relieving insulation layer, which has a thermal expansion coefficient of −20 to 6 ppm / ° C., on either side of the core substrate; and forming a metal layer on the insulation layer and forming at least one pad and electrically connecting the pad with the outer circuit. This method can provide high reliability, as the stress-relieving insulation layers can prevent bending and warpage, etc., in the board overall.

The invention provides a mobile terminal, including a shell, a PCB and antenna adaptive sheets. The shell comprises a main wall and a side wall, an antenna gap is arranged between the main wall and the side wall, a filler is arranged in the antenna gap, and an antenna connection point is arranged on the side wall. The PCB is provided with an antenna feed point which is opposite to the filler. The antenna adaptive sheets are used to connect the antenna connection point and the antenna feed point. The first antenna adaptive sheet is welded with the antenna connection point. The second antenna adaptive sheet is pressed against the surface of the filler. A connection part of the third antenna adaptive sheet and the fourth adaptive sheet is elastically crimped with the antenna feed point, so that electrical connection between the antenna feed point and the antenna connection point is formed. By the abovementioned mode, the antenna adaptive sheets are integrally formed and in bending connection, so that side-surface contact between the antenna feed point on the PCB and the antenna connection point on the side wall is changed to front-surface contact, the contact reliability is improved, and the assembly difficulty is reduced.

A connector has a base having insertion holes in parallel at a predetermined pitch, A connector has a base having insertion holes in parallel at a predetermined pitch, H-shape connecting terminals laterally inserted into the insertion holes, each connecting terminal having a support contact piece on a lower side of the connecting terminal, a manipulation contact piece on an upper side of the connecting terminal, and a coupling portion which couples the support contact piece and the manipulation piece, and a manipulation lever rotatably attached to a bearing portion of the support contact piece disposed on a first side of the base. A latching pawl, formed on a first end of the support contact piece, is latched on an edge portion of the base. A flexible board is inserted from an opening on a second side of the base. The manipulation lever manipulates the manipulation contact piece to bring an end portion of the manipulation contact piece into pressure-contact with the flexible board.

A probe for temporarily electrically contacting a solar cell for testing purposes, has at least one elastic, electrically conductive contact element for producing the electrical contact, at least one reference sensor for indicating a distance of the contact element to an external reference surface using an electrical signal of the reference sensor, and a mounting plane to which the tip of the contact element is oriented. The probe ensures a secure electrical contact of the solar cell in a testing station with minimal mechanical stress, and is also suitable for use in an industrial continuous production method.

The invention concerns a test element analytical system for the analytical examination of a sample, especially a body fluid, comprising at least one test element with one or more measuring zones and contact areas located on the test element, in particular electrodes or conductor paths, the sample to be examined being brought into the measuring zone to carry out an analysis in order to determine a characteristic measured quantity for the analysis, and an evaluation instrument with a test element holder for positioning the test element in a measuring position and a measuring device for measuring the characteristic change, the test element holder containing contact elements with contact areas which enable an electrical contact between the contact areas of the test element and the contact areas of the test element holder, characterized in that one of these contact areas is provided with an electrically conductive hard material surface.

The sheet with movable contacts comprises a first sheet formed by an insulating film, the first sheet having an adhesive surface formed by applying an adhesive to a lower surface of the first sheet, a plurality of domed, metallic, movable contacts whose upper surfaces are covered with and affixed to the adhesive surface of the first sheet, and a second sheet formed by an insulating film, the second sheet being affixed to the lower surface of the first sheet and having a plurality of receptacle holes for receiving the movable contacts therein, with an adhesive being applied to a lower surface of the second sheet, wherein the second sheet has connecting slots formed therein for connecting adjacent such receptacle holes with each other.

A stamp for micro-transfer printing includes a body and one or more posts extending from the body. At least one of the posts has a non-planar surface contour on the distal end of the post having a size, shape, or size and shape that accommodates a non-planar contact surface of a micro-transfer printable device.

Improved thin film transistor array panels are provided. In one embodiment, a panel includes a plurality of gate lines, data lines, and a plurality of switching elements connected to the gate lines and the data lines. An interlayer insulating layer is formed between the gate lines and the data lines. A passivation layer covering the gate lines, the data lines, and the switching elements is also provided having a plurality of first contact holes exposing portions of the data lines, wherein the switching elements and the pixel electrodes are connected through the first contact holes. A plurality of contact assistants are formed on the passivation layer and are connected to the data lines through a plurality of second contact holes in the passivation layer. A plurality of auxiliary lines are connected to the data lines through a plurality of third contact holes in the interlayer insulating layer.

The invention relates to a connection and junction box (1) for a photovoltaic solar module (24), which box in a mounting state, is put on the solar module (24) with open contact clamp(s) (22), and the contact clamps are actively closed for contacting the flexible flat conductor band(s) (28). Preferably, the actuating the contact clamp(s) (22) is automatically carried out by means of a device between two housing parts (2, 50), when putting on.

Provided is a printed circuit board (PCB) including a substrate that has a pad formed thereon; solder resist that is disposed on the substrate so as to expose the pad; a post that is disposed on the post; a surface-treatment layer that is disposed on the post; and a bump that is disposed on the surface-treatment layer.

The invention relates to a memory card adaptor which enables a small memory card to be used in a card connector for a large memory card that is larger than the small memory card. A connecting terminal 37 which is elastically displaceable is formed integrally on a conductive (metal-made) cover 30 that is one of components of the adaptor body 1. The connecting terminal 37 is contacted with plural grounding contacts 60d, 60i, and electrical connection is established between the grounding contacts 60d, 60i, and between the grounding contacts 60d, 60i and the cover 30. High contact reliability is ensured, and an electrostatic breakdown preventing function is surely maintained.

Example embodiments relate to a semiconductor device including a fin-type channel region and a method of fabricating the same. The semiconductor device includes a semiconductor substrate, a semiconductor pillar and a contact plug. The semiconductor substrate includes at least one pair of fins used (or functioning) as an active region. The semiconductor pillar may be interposed between portions of the fins to connect the fins. The contact plug may be disposed (or formed) on the semiconductor pillar and electrically connected to top surfaces of the fins.

Provided is a hybrid integrated circuit module and a manufacturing method thereof. The manufacturing method comprises the steps that a substrate, a heat radiator and a glass fiber plate with through holes arranged at preset positions are manufactured, and an insulating layer is covered on one of the surfaces of the substrate; the glass fiber plate and the heat radiator are arranged on the surface of the insulating layer; a circuit wiring layer is arranged on the surface of the glass fiber plate; power elements and non-power elements are respectively distributed on the heat radiator and the corresponding positions of the circuit wiring layer; and metal wires are connected between the circuit wiring layer, the heat radiator, the power elements and the non-power elements. Contact reliability of bonding points is enhanced, length of bonding wires is reduced and height difference of the bonding wires is reduced so that wire punching rate in molding can be effectively reduced, and thus qualified rate of manufacturing and long-term reliability of an intelligent power module are enhanced.

The press-fit type connector terminal includes a pin section having a U-shaped or quadrangular cross-section, and a contact section situated at a front end of the pin section. The contact section includes a contact piece surrounding an imaginary center line parallel to a longitudinal axis of the pin section, and a slit formed at a part of the contact piece and extending substantially parallel to the imaginary center line. The connector terminal is comprised of a single bent metal plate having elasticity.