140 results about "Test element" patented technology

A test element group (TEG) disposed adjacent to at least one memory chip on a wafer includes a ring oscillator configured to output a clock signal based on a direct current (DC) signal received through a first pad and from a test device, a first divider configured to divide the clock signal and to output a first divided signal, and a sequential circuit set configured to receive the clock signal and the first divided signal, to generate a test signal based on the clock signal and the first divided signal, and to output the test signal to the test device through a second pad. The sequential circuit set includes a sequential circuit having a configuration corresponding to at least one circuit included in the at least one die.

The invention provides a non-intrusive evaluation method for a current distribution eccentric state, and the method comprises the following steps: placing a segmented Rogowski coil at the peripheral side of a to-be-tested element, and measuring the output voltage of the segmented Rogowski coil after the to-be-tested element is electrified; integrating the induced voltage to obtain an intermediate voltage integral quantity; and constructing a proportional function relationship between the current of the to-be-measured element and the intermediate voltage integral quantity, and obtaining point location information of non-uniform current distribution in the to-be-measured element and corresponding current eccentric state information based on the proportional function relationship. According to the method, the current distribution state of the device is evaluated through mutual inductance between the sectional Rogowski coil and the element to be measured, the original packaging structure of the device does not need to be damaged, the leakproofness and insulativity of the device are guaranteed, meanwhile, compared with an existing non-intrusive measurement method, the method is more accurate in measurement result, and the measurement efficiency is improved. And the current distribution state can be evaluated.

The application provides a detection device, which comprises a shell and a carrier, the shell and the carrier are detachable, the shell is provided with a socket, the carrier is provided with a test element, the carrier can be inserted into the shell through the socket with the test element in the carrier; wherein, the shell is provided with a blocking structure and a locking structure, the blocking structure and the locking structure are integrated to form a locking component, when the carrier is inserted into the shell and the locking structure locks the position of the carrier, the carrier abuts against the blocking structure. The detection device is very convenient for the operator to install, insert and take out the test element. After the carrier is completely inserted into the shell, the carrier cannot shake, and the carrier is in the same position every time, which can ensure that the first electrode and the second electrode can always contact the mark area of the test element every time, and the detection result can be read every time. The detection device is convenient to assemble and has superior performance.

Insert (40) for a test contactor (1) for testing an electrically conductive test element (10), - wherein the insert (40) comprises several contact elements (8) which are designed to electrically contact the electrically conductive test element (10) in the test state of the test contactor (1), - wherein the insert (40) comprises a plurality of openings (67), wherein the openings (66) are arranged on an upper side of the insert (40) facing the test element (10) in the test state, - wherein in the test state at least one pin (68) is arranged in at least one opening (67) of the plurality of openings (67) such that the insert has a coding for a test element (10) corresponding to the coding.

Provided are a test element group (TEG) device and a cryogenic intrinsic characteristic analysis method for quantitatively assessing impact of a high-k-based passivation layer on an electrical characteristic of a device in a two-dimensional (2D) field effect transistor (FET) structure. Herein, to analyze a FET device that includes a channel of a 2D material and a passivation layer of a high-k material, a first FET device in which the passivation layer is arranged in a first direction with respect to the channel and a second FET device in which the passivation layer is arranged in a second direction different from the first direction with respect to the channel may be prepared. The first and second charge amounts trapped in the passivation layers in the first and second FET devices, respectively, may be compared to assess quantitative impact of the shape of the passivation layer on the FET device.

The present invention discloses a highly adaptable heat transfer test device, including a body, a heating element, and a fixed element. The body includes a controllable temperature module, a cold bridge structure, and a cold input module from top to bottom. The upper surface of the controllable temperature module is provided with a plurality of slots for placing test elements, and the lower surface is connected to the cold bridge structure. The upper surface of the cold input module is connected to the cold bridge structure; the heating element is attached to the upper surface of the controllable temperature module, and the fixed element is connected to the upper surface of the controllable temperature module by a thread for fixing the test element. By adjusting the fixed element, batch replacement of the test element can be achieved. The heat transfer device provided by the present invention forms a limited heat conduction path, so that the input of cold is more accurately controllable. The temperature of the measured temperature element can be kept within the target temperature range for a long time by coordinating and controlling the power of the heating element. It can be applied to test scenarios of heat transfer elements with different external dimensions, heat transfer temperatures, condensation section lengths, and quantities.

The utility model discloses a power semiconductor device test circuit, relates to the technical field of semiconductor device test, and solves the technical problems of high cost and low test efficiency when a semiconductor device is tested in the prior art. The circuit comprises a driving module and a tested module, wherein the tested module is connected with the driving module; the tested module comprises a tested element Q22, a tested element Q21, an inductor L2 and a switch SW2; a grid electrode of the tested element Q22 is connected with the driving module, a source electrode of the tested element Q22 is grounded, and a drain electrode of the tested element Q22 is connected with the inductor L2; the inductor L2 is connected with the VCC; the grid electrode and the source electrode of the tested element Q21 are in short circuit, the drain electrode of the tested element Q21 is connected with the switch SW2 in series, and the tested element Q21 and the switch SW2 are connected to the two ends of the inductor L2 in parallel after series connection. According to the utility model, double-pulse testing and EAS testing can be carried out on the semiconductor device at the same time, the testing cost is saved, the testing efficiency is improved, and the testing accuracy can be ensured.

Since power consumption and distribution systems are equipped with a large number of combined devices, it is sometimes difficult to perform test procedures for the test elements specified for each individual device. Therefore, in the power consumption and distribution system, even if an attempt is made to assign each device to a test result, a test result from a large number of grouped devices cannot be assigned to every single device. According to the present disclosure, a test result of the power consumption and distribution system can be assigned to a test element of each device.

The invention provides a semiconductor device with a test element group and a test method of the semiconductor device. The test element group is arranged in a scribing groove in a substrate; n chips adjacent to the test element group share the test element group, and N is greater than or equal to 2; a test circuit is arranged in the test element group, and the test circuit comprises a phase decoder. According to the invention, a plurality of chip sharing test element groups based on phase identification can effectively distinguish sources or positions of a plurality of chips; and the test circuit selects a corresponding chip in the N chips according to the received phase signal, and tests the corresponding chip by using the test element group, and a dynamic identification and selection mechanism is adopted. The probe card is simplified, and the maintenance cost of the probe card is reduced. The number of test pads is reduced, wafer area waste is reduced, the test efficiency is improved, and the test circuit is automatically removed along with the cutting channel after the wafer is tested. The test circuit does not occupy the internal space of the chip, the test time is shortened, and interference and power consumption risks after packaging are reduced.

The embodiment of the invention provides a carbon dioxide convective heat transfer coefficient testing system and method. The testing system comprises a filling module, a circulation loop unit and a data module. The circulation loop unit comprises a main pipeline, a circulation pump, a first flow regulating valve, a flow meter, a pressure regulating valve, a first heating temperature controller, a micro-channel test assembly and a carbon dioxide cooler which form a loop; the micro-channel testing assembly comprises a testing element with a micro-channel, a second heating temperature controller arranged on the outer wall surface of the micro-channel of the testing element, a plurality of temperature detectors, a first pressure detector, a first temperature detector, a second temperature detector and a second pressure detector; the filling module is connected to an inlet of the main pipeline and used for boosting the carbon dioxide working medium and filling the carbon dioxide working medium into the circulation loop unit, and the data module is electrically connected with the circulation loop unit. The micro-channel convective heat transfer coefficient can be directly obtained, the system is simple, the cost is low, and the test precision is high.

A display device includes: a substrate including a display area and a test area located adjacent the display area; a pixel arranged in the display area on the substrate and including a pixel transistor and a light-emitting element connected to the pixel transistor; and a unit test element arranged in the test area on the substrate and including a test active pattern. The unit test element includes: a first test element including a test transistor which includes the test active pattern, and a first pad portion connected to the test transistor; a second test element including the test active pattern and a second pad portion and a third pad portion which are connected to the test active pattern; and a third test element including test active pattern and a fourth pad portion connected to the test active pattern. The first to third test elements share the same test active pattern.

The utility model relates to the related technical field of electronic component testing, in particular to a batch tester for discharge tubes, which comprises a detection table, a test element is embedded on one side of the detection table, a combined mechanism is arranged on one side of the surface of the detection table, and a fixing mechanism is arranged at one end of the detection table. According to the batch tester for the discharge tubes, through the arrangement of the combined mechanism, when detection needs to be carried out and after a test element is installed, the test element is connected with an external detection device through a connector surrounding a connecting line, and then the two ends of a first pneumatic pump and the two ends of a second pneumatic pump are connected to the test element; and the processor is connected with an external power supply, so that an operator can send a control instruction to the processor through the first button and the second button so as to drive the first pneumatic pump and the second pneumatic pump to start at the same time to finish the test, and meanwhile, a test result is transmitted to an external detection device through the surrounding connecting line.

A test panel includes: a pixel; a first test element connected to the pixel, the first test element including a gate electrode, a semiconductor layer, a first electrode, and a second electrode connected to the pixel; a test pad spaced apart from the first test element; a first connecting line connected to the first test element and the test pad; and a first resistive layer in a same layer as the semiconductor layer and connecting the first electrode and the first connecting line spaced apart from each other.

The invention discloses a thermal sensitive element jump judgment device for a dynamic thermal test of a fire-fighting sprinkler head, relates to the technical field of fire-fighting part detection equipment, and is used for testing the response performance of the fire-fighting sprinkler head. The device comprises a shell, a test piece mounting seat, a jump judgment mechanism and a plunger, the jump judgment mechanism comprises an elastic pressure applying assembly and a conductive detection assembly, a ceramic insulation ejector rod is sleeved with a stainless steel compression spring, after a test element is mounted, the spring is compressed to apply a preset load, and meanwhile high-temperature electric leakage is avoided; the conductive detection assembly forms a loop through the wire lug, the switch nut and the conductive material part, and the spring resets to trigger the loop to be conducted after the element jumps. The test piece mounting base is detachable and adapts to fire sprinkler heads of different specifications, the device is compact in structure, jumping judgment is accurate and free of lag, the problems that manual observation lags and recording errors are large in a traditional device are effectively solved, and the device is suitable for static action temperature testing of the fire sprinkler heads.

The utility model discloses a detection phantom, and relates to the technical field of model moulds, the detection phantom comprises a housing, a test element, an elastic member and a movable member, the housing is provided with a mounting cavity arranged along a first direction opening; a test element is placed in the mounting cavity; the elastic piece is arranged at the bottom of the mounting cavity, abuts against one side of the test element in the first direction and is used for applying elastic force to the test element in the opening direction of the mounting cavity; the movable part is detachably installed at the opening position of the installation cavity, one end of the movable part in the first direction abuts against the other side of the test element in the first direction, and the movable part has a moving stroke in the first direction. According to the technical scheme provided by the utility model, the detection element is moved to a desired to-be-detected position through position adjustment of the movable part, and then the detection element is fixed through common clamping of the elastic part and the movable part, so that the stability of the die body is improved.

The invention relates to a method for assigning an address to a bus participant connected to a data bus, wherein the bus participant is electrically and in particular also mechanically coupled to a corresponding substrate, the substrates each comprising an electrical test element; the substrates are electrically connected to adjacent substrates along a row, the substrates forming a test circuit in which the test elements are connected in series; a central unit is connected to the test circuit; a test current is applied to the test circuit; at least one bus participant, in particular a bus participant without a bus address, makes a change to the test circuit; the change to the test circuit is measured by the central unit; and based on the change to the test circuit, the position of the bus participant making the change or the position of the bus participant with the bus address is determined, and the bus address is assigned to the bus participant making the change or to the bus participant without the bus address.

A test panel includes: a pixel; a first test element connected to the pixel, the first test element including a gate electrode, a semiconductor layer, a first electrode, and a second electrode connected to the pixel; a test pad spaced apart from the first test element; a first connecting line connected to the first test element and the test pad; and a first resistive layer in a same layer as the semiconductor layer and connecting the first electrode and the first connecting line spaced apart from each other.

The utility model provides a test device and system. The test device comprises a vector unit, a switching controller, a first clock controller and a plurality of logic gates, the vector unit is used for being connected to test vector generation equipment to obtain a test vector and outputting an enable vector based on the test vector; the switching controller is connected to the vector unit, and the switching controller is configured to provide a switching signal to the vector unit; the input ends of the logic gates are connected to the vector unit and the first clock controller, and the output ends of the logic gates are respectively connected to a plurality of partitions of a to-be-tested element; and the plurality of logic gates provide second clock signals for the plurality of partitions of the to-be-tested element based on the enable vector and a first clock signal output by the first clock controller, so that a register in the to-be-tested element is selectively overturned based on the second clock signal. According to the scheme, the effects of reducing the test power consumption and improving the coverage rate and the test efficiency are achieved.

A pet drinking water dispenser characterized in that it comprises a drinking water dispenser body, wherein the drinking water dispenser body includes a housing, a battery arranged on the housing, a water pump arranged in the housing, a filter insert arranged in the housing, a main board electrically connected to the battery and the water pump respectively, a test board electrically connected to the main board, a test element arranged on the test board and projecting outwards, a test connection structure connected between the test board and the main board, a power supply connection structure connected between the battery and the main board, and a water supply connection structure connected between the main board and the water pump.

A material testing machine, including a machine body, a first fixing element, a second fixing element and a detection assembly; the first and the second fixing elements are mounted to the machine body, the first fixing element is configured to mount a first testing element, and the second fixing element is configured to mount a second testing element; in a first state, the first and the second testing elements are in sliding contact; in a second state, the first fixing element drives the first testing element to collide with the second testing element; the detection assembly is configured to detect a target parameter, and in the first state, the target parameter includes a friction force and / or, a friction sound between the first and the second testing elements; and in the second state, the target parameter includes a collision force received by the first or the second testing element.

The invention provides a test element group, a display panel, a preparation method of a display panel and a display device, relates to the technical field of display, and solves the problem that the lap joint condition of a cathode of a display product cannot be determined in the prior art. The test element group comprises a substrate, a leading-out structure, a supporting structure, a plurality of isolation structures and a test electrode, the leading-out structure is located on one side of the substrate, and the supporting structure is located on one side, deviating from the substrate, of the leading-out structure; the plurality of isolation structures comprise a first isolation structure and a second isolation structure which are arranged on the side, away from the substrate, of the supporting structure and are arranged at intervals, and the first isolation structure and the second isolation structure are electrically connected with the leading-out structure; each of the first isolation structure and the second isolation structure comprises a first part and a second part; the first part comprises a first side wall and a second side wall, the orthographic projection of the first side wall on the substrate is located in the orthographic projection of the supporting structure on the substrate, and the second side wall protrudes out of the supporting structure; the test electrode is in lap joint with the first side wall and is separated from the second side wall.

The application discloses a component performance test method and system, and relates to the technical field of automatic test. Theoretical parameter intervals of target test components are predicted according to target output voltage intervals and other related parameters. If actual parameters of the target test components exceed the theoretical parameter intervals during the test, it is determined that the performance of the target test components is poor. Therefore, the cause of substandard test data can be quickly determined, time wasted in repeated parameter adjustment and retest is saved, and test efficiency is improved.

Embodiments of the present invention relate to semiconductor test devices and semiconductor test methods. A semiconductor test device comprises: a semiconductor substrate, a first internal interconnect structure, a second internal interconnect structure, a connecting metal layer, a redistribution layer structure, a first terminal, and a second terminal. The first internal interconnect structure and the second internal interconnect structure are arranged on the semiconductor substrate and are electrically isolated from the semiconductor substrate. The connecting metal layer electrically connects the first internal interconnect structure and the second internal interconnect structure and is electrically isolated from the semiconductor substrate. The redistribution layer structure is electrically connected to the first internal interconnect structure and the second internal interconnect structure. The first terminal and the second terminal are electrically connected to the first internal interconnect structure and the second internal interconnect structure, respectively, through the redistribution layer structure.

Provided in the present invention are a test device, a toilet and a test method. The test device comprises a test module, and further comprises a container body used for storing the test module. The interior of the container body is provided with a plurality of mutually independent accommodating channels; the test module comprises a test element, and a liquid under test is tested by means of the test element; several test modules are provided and mounted in the accommodating channels respectively, and each test module can independently extend out of the corresponding accommodating channel. By mounting the test modules in the plurality of independent accommodating channels, the test modules are separated and used alone without contaminating each other, and the test device does not need to be replaced frequently and is convenient and hygienic to use.

The invention discloses a test carrier plate and a test method. The test carrier plate comprises a first lead, a second lead, a third lead, a slot and a switch. The first wire transmits a first test signal. The second wire transmits a second test signal. The third wire transmits a sensing signal. The slot is used for arranging a to-be-tested element. The switch provides a first test signal or a second test signal to the element to be tested, and comprises a first pin and a second pin. The first pin is electrically connected with the first wire. The second pin is electrically connected with the second and third wires.

This test device may comprise: a power supply unit connected to first and second terminals of a test element; a protection circuit connected between the test element and the power supply unit; and a test circuit connected to a third terminal of the test element. The protection circuit may comprise: a first switch connected between the first terminal of the test element and one side of the power supply unit; a second switch connected between the first and second terminals of the test element; and a capacitor connected in parallel to the second switch.

The utility model provides a multipath switching acquisition test monitoring system, which comprises a test element and a test cavity, the test element is fixed in the test cavity, the outer end of the test cavity is provided with eight pin interfaces, the outer ends of the eight pin interfaces are respectively connected with lead interfaces, the outer ends of the eight lead interfaces are connected with a first circuit board, and the outer ends of the eight lead interfaces are respectively connected with a second circuit board. The first circuit board is connected with a first power meter, the outer end of the first circuit board is provided with a second circuit board, the outer end of the second circuit board is connected with a second power meter, the first power meter is connected with a stability test module, the second power meter is connected with an air tightness test module, and the first circuit board and the second circuit board are both connected with a display and a 2450 collector through circuits. According to the application, the labor cost is greatly saved in a mode of matching a test instrument with an automatic program, the elements are tested in batches more efficiently and quickly, and meanwhile, in order to enable the tests of different test elements not to interfere with each other, automatic switching circulation is realized by utilizing a relay switch, and the test can be more accurate.

The invention provides a load loading device, a load test device, a load test method, a controller and a control system. The load loading device comprises a bottom plate, a loading tool and a loading mechanism, the bottom plate is used for placing a test element, and the loading tool is connected with the test element; the loading mechanism comprises an X-direction loading assembly, a Y-direction loading assembly and a Z-direction loading assembly; the X-direction loading assembly is connected with the first end of the loading tool and is used for applying an X-direction load to the test element; the Y-direction loading assembly is connected with the second end of the loading tool and is used for applying a Y-direction load to the test element; and the Z-direction loading assembly is connected with the third end of the loading tool and is used for applying a Z-direction load to the test element. According to the invention, the loading loads in the X direction, the Y direction and the Z direction can be conveniently regulated and controlled, so that the loading forces in the three directions can be simultaneously loaded on the loading tool, and the collected real load of a test element can be accurately reproduced.

The utility model relates to an XY bidirectional clamping carrier and a clamping device in the technical field of test carriers. The XY bidirectional clamping carrier comprises a cavity seat, two X-axis clamping plates, a Y-axis clamping plate, a supporting assembly, an inclined embedded block, a Y-axis spring, a drag hook and a traction assembly, wherein the X-axis clamping plates and the Y-axis clamping plate are arranged at two ends of the cavity seat in parallel and are used for clamping an element to be detected; the supporting assembly is arranged between the X-axis clamping plates; and the traction assembly is used for enabling the Y-axis clamping plate to be far away from the element to be detected. The X-direction clamping function and the Y-direction clamping function are integrated on the same clamping carrier, occupied space can be greatly reduced, the structure is simple, and cost is low. The inclined embedded block is driven by external force to drive the supporting assembly and is connected with the drag hook to drive the traction assembly, and clamping and releasing of the to-be-tested element in the X direction and the Y direction can be achieved. And in cooperation with the material taking and placing mechanism and the carrier air cylinder, the CT time of the clamping device can be remarkably shortened, and the element detection efficiency is improved.

A test circuit of a semiconductor apparatus includes a first resistor, a second resistor and a feed-back loop circuit. The first resistor is coupled between a pad and a test element. The second resistor is coupled to the first resistor in a parallel manner. The feed-back loop circuit is configured to feed a result back to the second resistor, the result being one of comparing a first voltage and a second voltage with each other, the first voltage and the second voltage being applied respectively to the first resistor and the second resistor.