745results about "Printed circuit testing" patented technology

The invention relates to the technical field of circuit boards, and discloses a circuit board interlayer connection detection method, device and equipment, and the method comprises the steps: carrying out the electrical characteristic parameter measurement of a multilayer flexible circuit board, and obtaining the characteristic parameter data of the circuit board; designing and arranging a multi-test-point detection structure on the multi-layer flexible circuit board, and performing signal excitation to obtain test point position information; applying a differential excitation signal, and collecting a differential response waveform between the test points to obtain a time domain reflection signal feature; impedance spectrum conversion and parameter extraction are carried out on the time domain reflection signal features, and an interlayer connection impedance distribution diagram is obtained; and establishing an interlayer connection defect characteristic model aiming at nickel-based alloy wire fracture, interface cracking and liquid metal fiber felt delamination in various bending states by utilizing the interlayer connection impedance distribution diagram, so that accurate classification of defect types and severity is realized, and interlayer connection faults and surface welding quality problems can be distinguished; and the misjudgment rate is greatly reduced.

The invention relates to a PCBA automatic testing system and method, and relates to the technical field of PCBA automatic testing, and the system comprises a multi-source data collection module which is used for collecting chip dynamic power consumption waveform, PCB interlayer temperature gradient, and multi-source data of signal loop impedance change, and eliminating the sampling delay error of a sensor through a synchronous collection time sequence alignment algorithm; transmitting the acquired multi-source data to a dynamic modeling engine; according to the invention, by dynamically fusing the multi-physical-quantity data and adaptively generating the test path, the system can detect the fault of the PCBA more comprehensively and accurately, the detection efficiency is improved, and the false detection rate is reduced; the thermal aging and faults of the PCB are predicted by using a dynamic modeling engine, so that potential failure risks can be found in advance, and a powerful guarantee is provided for quality control of the PCB; and the test path is automatically generated according to the dynamic modeling result and the data of the fault knowledge graph, so that the workload and error of manually planning the test path are reduced.

The invention relates to the technical field of circuit board performance detection, in particular to an intelligent test management system and method for a circuit board. The method comprises the following steps: continuously monitoring the current conduction amount of the hole site of the circuit board; when it is detected that the current conduction amount is lower than a preset current conduction amount threshold value, it is judged that the current conduction state of the hole site is abnormal, and abnormal state time and abnormal initial site coordinates are recorded; acquiring a circuit board hole site image according to the abnormal initial site coordinate; and identifying hole site internal characteristics of the circuit board hole site image, extracting a defect area of the hole site internal characteristics, and marking the defect area as a hole site potential defect area. Through the data processing technology, the laser scanning technology and the image detection technology, abnormal current conduction judgment on the hole site of the circuit board is achieved, the defect area image of the abnormal hole site of the circuit board is recognized, the defect optimization scheme of the circuit board is determined, and therefore the accuracy of circuit board testing is improved.

The invention belongs to the technical field of PCB testing, and discloses a performance testing method of an AI server PCB. Comprising the following steps: acquiring power-on operation temperature data of the PCB to construct a temperature distribution image, determining hot spot region characteristics based on the temperature distribution image to obtain heating test parameters, performing heating test on the PCB based on the heating test parameters, acquiring thermal resistance of each position of a hot spot region, drawing a thermal resistance characteristic curve, and analyzing the thermal resistance characteristic curve to obtain a thermal performance grade of the PCB. The bending rate of the bending test is determined according to the basic parameters of the PCB, the bending force is adjusted in real time according to the bending rate during the test, the test is stopped when the stress or the strain reaches a threshold value, the test data is analyzed to obtain the bending resistance grade of the PCB, and the PCB is divided into different grades by combining the thermal performance grade. According to the method, the efficiency and reliability of PCB testing are remarkably improved.

The invention relates to the technical field of integrated circuit board finished product detection, in particular to a computing processing module finished product monitoring method and system, and the method comprises the steps: scanning a plurality of computing processing module finished products passing through a finished product conveying belt in real time through a linear array laser scanner disposed above the finished product conveying belt, and carrying out the real-time monitoring of the plurality of computing processing module finished products; further obtaining a spectrum pattern corresponding to each calculation processing module finished product; identifying local spectrum patterns corresponding to the plurality of chip assemblies in the spectrum pattern; and sequentially detecting whether each local spectrum pattern has a plane flaw, if so, evaluating the damaged surface of the plane flaw, and evaluating the damage degree of the damaged chip assembly based on the proportion of the damaged surface. According to the monitoring method, the spectral pattern representing the height information is generated in real time through the linear array laser scanner, the local areas of the multiple chip assemblies are accurately recognized in combination with the RGB color threshold value and the image feature extraction algorithm, interference caused by dense arrangement of the multiple assemblies is effectively avoided, and the positioning precision and the anti-noise capacity of plane defect detection are improved.

The invention provides a PCB positioning and multifunctional testing integrated device based on visual identification. The device comprises an integrated controller, an image processing unit, a visual identification unit, a PCB positioning unit, a PCB testing unit and a mechanical arm control unit. The image processing unit fuses the initial PCB images at different acquisition angles to obtain a fused PCB image; the visual identification unit determines the mark position of the positioning mark in the fused PCB image; the PCB positioning unit converts the initial attitude information and the initial position information to a world coordinate system according to a conversion relation between the image coordinate system and the world coordinate system to obtain target attitude information and target position information of the PCB in the world coordinate system; the PCB testing unit is used for carrying out multifunctional testing on the PCB; and the mechanical arm control unit conveys the PCB to the next process through the conveying belt. According to the invention, the positioning accuracy of the PCB and the testing efficiency of the PCB are improved.

The invention provides PCB deviation detection equipment and a detection method, and relates to the technical field of PCB detection, a feeding arm and a carrying arm are matched with a partition adsorption and pressing assembly to be matched with a detection platform and a feeding platform, so that the problem of uneven adsorption of an FPC is effectively avoided; the detection platform adopts the adsorption assembly with adjustable spacing, and the levelness is accurately regulated and controlled by combining with the jackscrew adjusting piece, so that the detection platform can adapt to the layout of components on the back of the PCB to avoid interference, and can guarantee the bearing stability and eliminate the positioning deviation. Meanwhile, the detection method supports the combination of PCBs and FPCs with different characteristics in a terminal area, and by calculating X and Y bidirectional deviation values, the adaptive range is widened, the detection precision is improved, and the missing detection and false detection rate is reduced.

The invention relates to a four-probe flying probe test equipment path optimization method and device and a storage medium. The method comprises the steps that a task input module receives basic constraint conditions and test task information; if a fixed grouping mode is adopted, the four probes are fixedly divided into two groups according to basic constraint conditions, the distances of the two groups of probes from the current test task to the optional next test task are sequentially calculated, and the moving path of each group of probes is planned; if a variable grouping mode that the probes are allowed to change groups in the testing process of each step is adopted, an optimization objective function of each step of each probe is calculated in sequence, and a moving path of each probe is planned; and according to the planned moving path of each probe, the control execution module controls each probe to move in sequence to complete a test task. The constructed mathematical model more comprehensively and accurately reflects the actual situation of the four-probe flying probe test, provides a more reliable theoretical basis for path optimization, and is beneficial to improving the optimization precision of the test path.

The invention relates to the technical field of PCB production, in particular to a detection method and control system for an MI process in PCB production and computer equipment. According to the method, PCB key performance indexes are obtained through material characteristic data, then a performance attenuation curve is obtained, the service life of the PCB is predicted in advance, the problem of time hysteresis of finished product inspection is solved, then process parameter compliance values and process defect information are obtained according to processing process data, and the former is used for quantitative evaluation in the process evaluation stage; the method comprises the following steps: providing data for comprehensive evaluation, mining potential defect risks of a machining process, dynamically coupling and analyzing an amplification effect of environmental stress on process defects by combining process defect information and application environment parameters, calculating a reliability index value of a PCB, and finally calculating a comprehensive evaluation value through a process parameter compliance value and the reliability index value. And the reliability of the MI process is judged by comparing the preset threshold, so that the detection accuracy is improved.

The invention discloses a circuit board defect detection method and system based on multi-band impedance matching, and relates to the technical field of circuit board quality inspection, and the method comprises the steps: determining corresponding test bias voltages of a reconfigurable impedance matching network at a plurality of test frequency points according to a band bias voltage relation table; for each test frequency point, test bias voltage matched with the test frequency point is applied to each adjustable element, and a radio frequency signal is injected into the circuit board to be tested, so that a corresponding reflection coefficient is acquired through a test probe; based on the multi-frequency sparse dictionary and a compressed sensing algorithm, reconstructing a three-dimensional scattering image in the circuit board; and calculating negative logarithm likelihood distribution corresponding to the three-dimensional scattering image, and respectively solving a hierarchy anomaly score of the corresponding circuit physical layer by combining the spatial information of each circuit physical layer so as to screen at least one abnormal circuit physical layer. Therefore, signal feature reconstruction is used for replacing high-precision physical imaging, and hierarchical space identification of circuit board defects is realized.

The present disclosure relates to a circuit board that includes a first edge connector configured to communicatively couple the circuit board to a first connector of a second circuit board. The first edge connector extends from a side of the circuit board a first length. The circuit board also includes a second edge connector configured to communicatively couple the circuit board to a second connector of the second circuit board. The second edge connector extends from the side of the circuit board a second length that is different than the first length.

The invention discloses electronic detonator spot welding defect detection equipment which comprises a bottom bearing plate, a telescopic fixing structure is arranged at the upper end of the bottom bearing plate, a circulating feeding structure is arranged in the telescopic fixing structure, and a testing structure is arranged at the upper end of the telescopic fixing structure. The telescopic fixing structure comprises side supporting plates symmetrically and fixedly arranged on the top face of the bottom bearing plate. According to the electronic detonator spot welding defect detection equipment provided by the invention, the telescopic fixing structure is arranged, and two groups of transverse electric push rods which are symmetrically arranged drive clamping plates at the upper ends to get close to each other, so that electronic detonator control plates with different sizes on the surface of the top plate can be fixed; and meanwhile, a longitudinal electric push rod is matched to drive a test meter and a test needle head on the top to descend to be in contact with a welding spot on the surface of the control panel, so that whether the welding spot has pseudo soldering or not can be detected, compared with an existing detection device, the detection efficiency of the control panel can be effectively improved, and meanwhile higher adaptability is achieved for control panels of different sizes.

The invention relates to the technical field of PCBA testing devices, in particular to a production line PCBA full-automatic testing device which comprises a supporting box, a supporting frame, a pressing assembly, a detection assembly, a bearing plate and a display screen. The pressing assembly is arranged on one side of the top of the supporting frame, the detection assembly is installed on the lower side of the supporting frame, and the bearing plate is fixed to the other side of the bottom of the supporting frame. A U-shaped containing groove is formed in the bearing plate, pressing frames are arranged on the two opposite sides of the groove in a lifting mode, and pressing blocks are arranged at the four corners of the groove in an inward rotating mode. And the bottoms of the pressing frame and the pressing block are connected with a driving assembly for controlling the lifting of the pressing frame and the rotation of the pressing block. Through cooperative work of the linkage clamping mechanism and the U-shaped placement groove, rigid fixation and quick release of the PCBA board are synchronously realized in single operation, so that the offset risk caused by human force difference in the testing process is eliminated, the contact precision of a probe is ensured, an open type part taking channel is optimized, and the detection reliability and the operation practicability are improved.

The invention belongs to the technical field of PCB (printed circuit board) detection equipment, and particularly relates to a dynamic adjustment system and method for uniform distribution of test points of a flying probe machine, and the system comprises a flying probe test machine, a camera alignment system, a data processing unit and a movement mechanism. The flying probe testing machine is provided with at least two guide rails, and flying probes are arranged on the guide rails and used for testing test points on the PCB. And the camera alignment system carries out at least two times of alignment with the PCB, and outputs alignment information. And the data processing unit receives the alignment information, loads PCB data, and determines the offset of the PCB according to the distribution of the test points and the alignment information. And the movement mechanism is connected with the PCB and responds to the offset to control the PCB to translate, so that the test points are uniformly distributed on the flying probe test machine. According to the invention, by dynamically adjusting the position of the PCB, the test efficiency of the flying probe tester is improved, the distribution uniformity of test points is ensured, and the test flow of the PCB is optimized.

The invention discloses a fault detection method, device and equipment. The method comprises the steps of reading software corresponding to the head-up display system under the condition that an image projected by the head-up display system is abnormal; under the condition that the reading result of the software indicates that the FPC link in the head-up display system is abnormal, at least one assembly in the FPC link is determined, and the at least one assembly comprises a flexible circuit board, a printed circuit board and a connecting socket of the flexible circuit board and the printed circuit board; and determining a fault component with a fault in the at least one component and a fault point in the fault component. According to the embodiment of the invention, the accuracy of fault detection can be improved.

The invention discloses a PCB double-sided four-flying-probe test path optimization method, and belongs to the technical field of path optimization, and the method comprises the following steps: importing double-sided PCB data containing a test network and test points; obtaining an initial matching scheme of a network internal test point corresponding to each test network through the matching strategy, and optimizing each initial matching scheme to obtain a network internal test point path; constructing an initial test sequence between test networks through a recent insertion heuristic algorithm, and then introducing a local search algorithm into an adaptive large-scale neighborhood search algorithm to carry out iterative optimization on the initial test sequence to obtain a test sequence between the networks; and combining the test point paths in the networks and the test sequence between the networks, and outputting a double-sided four-flying-probe test path. According to the PCB double-sided four-flying-probe test path optimization method, the problem that the overall moving cost is difficult to further reduce in an existing method is solved.

Described embodiments include a fault monitoring system comprising a fault logic circuit having a fault logic input adaptable to be coupled to sensor inputs, and first and second fault logic outputs. The fault logic circuit compares a plurality of data values provided by respective sensor inputs to respective fault thresholds, and provides respective fault signals at the first fault logic output responsive to a fault event in which a respective data value exceeds its respective fault threshold. A timer has a timer input coupled to the reset output, and a timer output. A data register has a first data register input coupled to the write control output, a second data register input coupled to the timer output, and a data register output. The data register receives fault data that includes an event identifier, a timer value, and a timer expiration indicator.

According to the impedance test method for the multi-layer and multi-order printed circuit board and the circuit board provided by the embodiment of the invention, the through hole is formed in the inner layer circuit board, the impedance of the inner layer circuit board is tested through the through hole, and the impedance of the inner layer circuit board is tested, so that the circuit board can work normally, and the performance and reliability of electronic equipment are improved. After a layer of outer layer circuit board is added on the outer layer circuit board, a blind hole is manufactured on the outer layer circuit board based on a through hole PAD, a test PAD is made by using the blind hole, and impedance test is performed on the added outer layer circuit board, so that the impedance of the current layer can be measured in time during layer addition, and the impedance can be measured without waiting for a finished product. The actual impedance of each layer can be measured, the rejection rate of the impedance of a final finished product is reduced, the production efficiency is improved, and the cost is reduced.

The invention discloses hardware detection equipment for electronic information engineering, and relates to the technical field of electronic hardware detection. The device comprises a detection table, a fixing mechanism is arranged above the detection table, the fixing mechanism comprises a clamping plate slidably connected to the upper portion of the detection table, the lower portion of the clamping plate is in threaded connection with a bidirectional threaded rod, the bidirectional threaded rod is fixedly provided with a first transmission wheel, and the first transmission wheel is in transmission connection with a second transmission wheel through a transmission belt; the second transmission wheel is fixedly installed on a threaded cylinder, the threaded cylinder is in threaded connection with an air rod, the air rod is fixedly provided with a piston, and the piston is slidably connected into the air cylinder. Through rotation of the bidirectional threaded rod, displacement of the clamping plate is controlled, the threaded cylinder is driven to rotate through the transmission wheel and the transmission belt, rotary motion is converted into linear motion of the air rod, the piston is pushed to reciprocate in the air cylinder to generate air flow, the air flow is sprayed out of the air spraying pipe through the splitter plate, and linkage of clamping and cleaning is achieved; dust or chippings on the surface of the electronic hardware are effectively removed, and the detection precision is ensured.

The invention discloses a full-automatic test device and method for a main control board, and belongs to the technical field of circuit board detection. The left end of the base frame is provided with a continuous feeding mechanism used for continuously conveying the center control plate to the tool plate. The tool plate is provided with an automatic positioning mechanism, the rear side of the upper end of the base frame is provided with a continuous detection mechanism, and the continuous detection mechanism comprises a rotary horizontal maintaining and supporting mechanism and a detection mechanism. A central control plate on a tool plate is clamped and positioned through an automatic positioning mechanism, the central control plate is photographed and detected through a visual detection device, and a rotary horizontal keeping and supporting mechanism controls a detection mechanism to do circular motion while keeping a horizontal posture. The detection mechanism can detect the central control board on the tool plate in the moving process of the tool plate, and continuous and efficient detection operation of the central control board is achieved.

The invention discloses a circuit board functional defect positioning method based on dynamic signal feature extraction, which belongs to the technical field of electronic equipment detection, and comprises the following steps: S10, acquiring normal signal data of key nodes of a circuit board, the key nodes comprising a power supply input end, a signal input end and a signal output end; the normal signal data comprises a voltage signal and a current signal; constructing a database about normal signal data; s20, voltage signals and current signals of key nodes of the circuit board are collected, the change rules of the voltage signals and the current signals are analyzed, and the change rules are compared with the database. According to the circuit board fault diagnosis system and method, more comprehensive, accurate and reliable fault diagnosis can be carried out on the circuit board by comprehensively applying methods of signal acquisition, data analysis, fault diagnosis and the like, and the detection quality and reliability of functions of the circuit board are improved.

The invention discloses feeding and discharging equipment of a chip carrier and a chip testing system, and relates to the technical field of semiconductor chip testing, and the feeding and discharging equipment comprises a rack, a positioning mechanism, a material box and a transfer mechanism; feeding and discharging stations are arranged on the two sides of the machine frame. The positioning mechanism is arranged at the top of the rack; the material box is arranged at the top of the positioning mechanism; the transfer mechanism is installed on the rack, a plurality of sensors are arranged on the transfer mechanism, and the plurality of sensors are used for obtaining the number information and the position information of the chip carriers placed in the material box; the transferring mechanism is used for taking out the chip carrier in the material box, transferring the chip carrier to the positioning mechanism for positioning, and transferring the positioned chip carrier to a feeding and discharging station; the transferring mechanism is further used for transferring the chip carriers on the feeding and discharging station to the positioning mechanism to be positioned, and the positioned chip carriers are placed in the material box. The loading and unloading equipment can realize automatic loading and unloading of the two external probe testing machines, and is higher in efficiency.

The invention discloses a computer mainboard voltage multi-point detection device and a detection method thereof, and belongs to the technical field of computer mainboard voltage detection.The computer mainboard voltage multi-point detection device comprises a base, supporting legs are arranged at the corners of the lower end of the base, a controller is arranged on the outer side of the base, supporting rods are arranged at the corners of the upper end of the base, and a top plate is arranged at the upper ends of the supporting rods; according to the computer mainboard detection device, the computer mainboard positioning and fixing mechanism is arranged, the positioning and fixing mechanism can ensure that a mainboard is kept stable in the detection process, inaccurate detection data caused by movement or vibration of the mainboard is avoided, the detection accuracy is improved through automatic limiting and positioning functions, and the detection efficiency is improved. The detection device can quickly place the mainboard in a detection area, the time and energy of manual adjustment are reduced, the positioning and fixing mechanism can ensure that the contact between the detector and the mainboard is more accurate, and misjudgment caused by position deviation is avoided.

The invention discloses a PCB detection method and device based on artificial intelligence. According to the scheme, a multi-view original image set of the PCB is obtained; processing the target level PCB image by adopting an adaptive region generation network to generate a candidate region set containing potential defects; performing multi-scale context enhancement processing on the candidate region according to impedance change characteristics inside and outside the candidate region; carrying out feature extraction on the enhanced candidate region to extract defect features with spatial perception capability, and carrying out multi-dimensional embedded coding processing on position information of the enhanced candidate region and a panel layer identifier to generate position features with process relevance; performing cross-modal fusion processing on the defect features and the position features to generate fusion features with process context perception; and performing defect detection processing on the PCB according to the fusion features to obtain the defect type of the PCB and the associated process link information. The accuracy and reliability of PCB detection can be improved.

The invention relates to the technical field of probe testing, in particular to a PCB flying probe test path optimization method based on electrical characteristics, which comprises the following steps: calculating accessibility scores of test points according to the distribution of board surface test points and elements to determine risk types of the test points; determining a risk area grade corresponding to the grid unit according to the accessibility score in combination with the potential shadow area; optimizing the test path of the probe according to the risk area grade corresponding to the grid unit, and adjusting the initial moving speed of the test path of the probe in different grid units; for the same moving time sequence of different probe groups, determining overlapped grids according to the initial probe angles and the test paths corresponding to the probes, and determining whether there is a collision risk between the probes in combination with the initial moving speeds of the probes in different grid units; and when a collision risk exists between the probes, corresponding adjustment measures are taken according to the number of the overlapped grids. According to the invention, the test path is optimized in combination with multi-dimensional design based on the electrical characteristics and testability of the board.

The invention discloses a maintenance and detection platform for an aviation airborne electronic product, and relates to the technical field of aviation electronic test.The maintenance and detection platform comprises the steps that firstly, a plurality of functional areas to be tested are established through an auxiliary deep maintenance unit according to a target single board of the aviation airborne electronic product, and Mark point coordinates input and output by the functional areas to be tested are marked and positioned; therefore, based on the Mark point coordinates, a user is guided to connect the probe-type excitation injection unit and the probe-type high-speed acquisition unit with the input and output pins of the to-be-tested functional area through the universal columns, so that a standard excitation source is applied to the to-be-tested functional area of the target single board for fault test, and a response signal of the functional area of the target single board in the fault injection test is acquired. Therefore, the functional area with the fault of the target single board is positioned according to the response signal, and the fault reason is further determined according to the mechanism of the functional area to be detected and the fault form. The fault can be isolated and positioned to the combination of a plurality of functional areas of the single board, and the maintenance and detection period of aviation equipment is shortened.

The invention provides a substrate withstand voltage test device and test system, and belongs to the technical field of intelligent measurement and control, the device comprises a simulation module, a quantum control module, an energy system execution module and an emergency linkage module, the simulation device collects substrate electric field data in real time to generate a dynamic three-dimensional model; the quantum control device calculates high-precision boundary conditions based on the model; the energy system executes rapid charging and discharging or protection action according to conditions; the emergency linkage device positions a breakdown point, predicts a defect type and evaluates reliability through multiple sensors, a simulation-control-protection-diagnosis closed loop is formed, the measurement precision is increased, the efficiency of determining the breakdown point is improved, breakdown diffusion is prevented, and the misjudgment rate is reduced.

A tester apparatus is described. Various components contribute to the functionality of the tester apparatus to facilitate movement of a wafer pack holding a vacuum without human oversight. These functionalities include a latch system to keep the wafer pack intact and a pressure sensing system to detect and relay a pressure in the wafer pack.

The invention relates to the technical field of test fixtures, in particular to a radio frequency power amplifier board test fixture which comprises a fixed seat, telescopic guide rods which are symmetrical to each other are fixedly connected to one side of the top of the fixed seat, a pressing plate is fixedly connected to the top ends of the telescopic guide rods, and an electric push rod is fixedly connected between the fixed seat and the pressing plate. A placing groove is formed in the top of the fixing base, a plurality of elastic probe pieces are installed on the pressing plate, the pressing plate which is pressed downwards can drive the elastic probe pieces to move and move towards a radio frequency power amplifier board placed in the placing groove, the elastic probe pieces are made to make contact with the radio frequency power amplifier board, and the radio frequency power amplifier board is placed in the placing groove through elastic components in the elastic probe pieces. The elastic probe piece can be in contact with each element on the radio frequency power amplifier board, so that the phenomenon that the elastic probe piece is not in contact with the element in place is reduced, the test error caused by the fact that the elastic probe piece is not in contact with the element is eliminated to the maximum extent, and the test accuracy of the radio frequency power amplifier board is improved.

The invention belongs to the technical field of ultra-high voltage direct current power transmission, and discloses a test system and method of a converter valve thyristor voltage detection board card, and the test system comprises a test cabinet and a test tool. An industrial control system is integrated in the test cabinet to set test parameters and criteria, an electric control unit loads an excitation source, an acquisition display unit acquires test data and presents the test data in an oscillogram, and a test tool fixes a tested board card. The industrial control system outputs a control instruction to drive the electric control unit to apply system test excitation, the actual working condition of the thyristor is simulated, and meanwhile, the acquisition and display unit automatically captures multichannel signal data; data are transmitted to the industrial control system through the electric control unit, and the board card performance is automatically analyzed and a test report is generated in combination with a preset criterion. By adopting the system, the problems of insufficient function verification, low test efficiency, vulnerable equipment, poor data accuracy and large manpower occupation are solved, efficient and lossless automatic test is realized, the test reliability is improved, and the operation process is simplified.