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49results about How to "Utilization area" patented technology

Method for filtering blood or blood components using leukocyte-removing filter and filter device

An object of the present invention is to provide a method and device for filtering blood or blood components which simultaneously attains 1) efficiently increasing leukocyte removal capability and 2) effectively utilizing the filtration area by preventing nonuniform flow, when blood is filtered by being fed to a leukocyte-removing filter comprising flexible containers by being pressurized using a pump or the like. The method comprises providing a leukocyte-removing filter having a thickness of 9.0 mm to 9.4 mm, an air permeability pressure drop of 300 Pa to 700 Pa, and effective filtration area of 50 cm2 to 70 cm2 which comprises a flat and flexible container having an inlet port and an outlet port and a sheet-like leukocyte-removing-filter material with a thickness of 8.2 mm to 8.6 mm disposed to divide the container into an inlet-port side chamber and an outlet-port side chamber, providing a pair of volume restriction boards disposed outside of the inlet port side external surface and the outlet port side external surface of the flexible container, having the distance between the volume restriction boards at the portion where the volume restriction boards facing each other sandwich the leukocyte-removing filter being in a range from [thickness of leukocyte-removing filter+0.5 mm] to [thickness of leukocyte-removing filter+2.5 mm], and filtering blood or blood components through the leukocyte-removing filter under a pressure of 30 kPa to 50 kPa while restraining expansion of the flexible container occurring during filtration by means of the volume restriction boards.
Owner:ASAHI KASEI MEDICAL CO LTD

Method of manufacturing 3-d semiconductor device

A method of manufacturing three-dimensional semiconductor device, comprising the steps of: a) forming a device unit on a substrate, the said device includes a plurality of stack structures composed of the first material layer and the second material layer stacked along a direction perpendicular to the substrate surface; b) forming a contact lead-out region around the said device unit, the contact lead-out region comprises a plurality of sub-partitions, each of the sub-partitions respectively exposes a different second material layer; c) forming a photoresist on said substrate, covering said plurality of sub-partitions, exposing a portion of said second material layer; d) using the photoresist as a mask, simultaneously etching the portion of the second material layer exposed by said plurality of sub-partitions, until another second material layer beneath said second material layer is exposed; e) slimming the size of the photoresist to expose a portion of said another second material layer; f) repeating said steps d and step e, until all of the second material layers are exposed; g) forming contact leads, connecting each of the plurality of the second material layers. In accordance with the method of the present invention, the total number of etching process steps is reduced dramatically and the area utilization is improved effectively by selectively etching each of the sub-partitions.
Owner:INST OF MICROELECTRONICS CHINESE ACAD OF SCI

Method of manufacturing 3-D semiconductor device

A method of manufacturing three-dimensional semiconductor device, comprising the steps of: a) forming a device unit on a substrate, the said device includes a plurality of stack structures composed of the first material layer and the second material layer stacked along a direction perpendicular to the substrate surface; b) forming a contact lead-out region around the said device unit, the contact lead-out region comprises a plurality of sub-partitions, each of the sub-partitions respectively exposes a different second material layer; c) forming a photoresist on said substrate, covering said plurality of sub-partitions, exposing a portion of said second material layer; d) using the photoresist as a mask, simultaneously etching the portion of the second material layer exposed by said plurality of sub-partitions, until another second material layer beneath said second material layer is exposed; e) slimming the size of the photoresist to expose a portion of said another second material layer; f) repeating said steps d and step e, until all of the second material layers are exposed; g) forming contact leads, connecting each of the plurality of the second material layers. In accordance with the method of the present invention, the total number of etching process steps is reduced dramatically and the area utilization is improved effectively by selectively etching each of the sub-partitions.
Owner:INST OF MICROELECTRONICS CHINESE ACAD OF SCI
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