146 results about "Flying probe" patented technology

The invention belongs to the technical field of PCB detection equipment, particularly relates to a flying probe test probe deviation compensation method, device and equipment and a medium, and provides a method for directly calculating and compensating deviation through a flying probe machine camera system. According to the method, the center of the driving end of the probe serves as a reference point, the probe is controlled to move in the preset direction till the visual center position coincides with the preset position of a target plate, related coordinates and distance values are obtained through a camera system, the motion compensation value of the probe to be compensated is calculated and determined, and finally the driving end is controlled to move to complete deviation compensation. According to the invention, external tools are not needed, rapid and accurate needle point deviation compensation is realized, and the test efficiency and precision of the flying probe machine are improved.

The invention relates to a four-probe flying probe test equipment path optimization method and device and a storage medium. The method comprises the steps that a task input module receives basic constraint conditions and test task information; if a fixed grouping mode is adopted, the four probes are fixedly divided into two groups according to basic constraint conditions, the distances of the two groups of probes from the current test task to the optional next test task are sequentially calculated, and the moving path of each group of probes is planned; if a variable grouping mode that the probes are allowed to change groups in the testing process of each step is adopted, an optimization objective function of each step of each probe is calculated in sequence, and a moving path of each probe is planned; and according to the planned moving path of each probe, the control execution module controls each probe to move in sequence to complete a test task. The constructed mathematical model more comprehensively and accurately reflects the actual situation of the four-probe flying probe test, provides a more reliable theoretical basis for path optimization, and is beneficial to improving the optimization precision of the test path.

The invention relates to the technical field of flying probe test machines, and particularly discloses an eight-axis linkage control system and method for a flying probe test machine, and the system receives a test instruction sent by an upper computer, and carries out the analysis of the instruction, so as to obtain the motion parameters of a detected PCB. Based on the motion parameters, motion tracks of the multiple motion axes are determined; executing corresponding actions based on the motion tracks of the plurality of motion axes, and monitoring motion data of the plurality of motion axes in real time; motion data of the multiple motion shafts are transmitted to a central processing unit; the central processing unit performs collaborative analysis on the motion data of the plurality of motion axes to obtain a control instruction; and transmitting the control instruction to a PID controller so as to control the rotating speed of the motor corresponding to the first motion shaft. Therefore, the complex nonlinear relation and dynamic change can be captured, and the internal relation among the motion axes can be disclosed, so that the dynamic behavior of the system can be accurately understood, and a finer and more intelligent control decision can be supported.

The invention belongs to the technical field of PCB flying probe detection equipment, and particularly relates to a flying probe compensation method and system based on PCB curved surface modeling, and the method comprises the steps: obtaining the size of a PCB, and carrying out the equilateral triangle grid division; in the visual alignment process, the laser distance measuring sensor is synchronously driven to carry out rapid non-contact height measurement on the vertex of the grid; based on the vertex three-dimensional coordinates, fitting triangular patches through a space plane equation and splicing the triangular patches into a three-dimensional curved surface model; performing bilinear interpolation on an area formed by adjacent patches in the model to smooth a curved surface; and finally, selecting an interpolation function according to the position of the test point to calculate the accurate height, and generating a Z-axis displacement compensation value of the probe. According to the high-precision measurement and self-adaptive compensation of the PCB warpage, the efficiency and precision of the flying probe test are considered, and the problem of poor contact or overvoltage damage of the probe caused by the board warpage is effectively solved.

The invention provides a circuit board test method and device based on a flying probe tester. According to the method, a test point set is determined by obtaining a design file of a circuit board, establishing an electrical connection model and identifying components and pins on the circuit board. And generating test combination set data by analyzing the conduction relationship between the test points, and further generating test scheme data. And based on the test scheme data, a test path is generated by using a path optimization algorithm, finally, the flying probe tester is used for testing, and a test report is generated according to a test result. The flying probe tester adopts the combination of an annular probe and a sharp needle probe, the annular probe is used for a pin connector to ensure accurate contact, and the sharp needle probe is used for other types of components to improve the test precision and adaptability. Compared with a traditional test method, the test scheme can be generated more efficiently, the test path can be optimized more efficiently, the test time is remarkably shortened, and the reliability and accuracy of circuit board testing are improved.

The invention belongs to the technical field of PCB (printed circuit board) detection equipment, and particularly relates to a dynamic adjustment system and method for uniform distribution of test points of a flying probe machine, and the system comprises a flying probe test machine, a camera alignment system, a data processing unit and a movement mechanism. The flying probe testing machine is provided with at least two guide rails, and flying probes are arranged on the guide rails and used for testing test points on the PCB. And the camera alignment system carries out at least two times of alignment with the PCB, and outputs alignment information. And the data processing unit receives the alignment information, loads PCB data, and determines the offset of the PCB according to the distribution of the test points and the alignment information. And the movement mechanism is connected with the PCB and responds to the offset to control the PCB to translate, so that the test points are uniformly distributed on the flying probe test machine. According to the invention, by dynamically adjusting the position of the PCB, the test efficiency of the flying probe tester is improved, the distribution uniformity of test points is ensured, and the test flow of the PCB is optimized.

The invention discloses a PCB double-sided four-flying-probe test path optimization method, and belongs to the technical field of path optimization, and the method comprises the following steps: importing double-sided PCB data containing a test network and test points; obtaining an initial matching scheme of a network internal test point corresponding to each test network through the matching strategy, and optimizing each initial matching scheme to obtain a network internal test point path; constructing an initial test sequence between test networks through a recent insertion heuristic algorithm, and then introducing a local search algorithm into an adaptive large-scale neighborhood search algorithm to carry out iterative optimization on the initial test sequence to obtain a test sequence between the networks; and combining the test point paths in the networks and the test sequence between the networks, and outputting a double-sided four-flying-probe test path. According to the PCB double-sided four-flying-probe test path optimization method, the problem that the overall moving cost is difficult to further reduce in an existing method is solved.

The invention discloses a semi-automatic resistance measuring instrument, which belongs to the technical field of chip resistor resistance measurement, and comprises a rack, a mounting platform, a driving mechanism and a measuring mechanism, the mounting platform is fixed on the rack, the driving mechanism is fixed on the mounting platform, and the measuring mechanism is arranged on a movable module of the driving mechanism and comprises a multi-path flying probe switching assembly and a resistor positioning and clamping device. The multi-path flying probe switching assembly is used for realizing adaptation and measurement of resistor substrates with different specifications by replacing flying probe groups, and is driven by the driving mechanism to move to a position above the detection station; the resistor positioning and clamping device is used for clamping and positioning a resistor substrate to be detected and is driven by the driving mechanism to move to a detection station; in the multi-path flying probe switching assembly, flying probes can move downwards to be in contact with a resistor substrate to be detected on the resistor positioning and clamping device, and detection is carried out. The method is mainly applied to the measurement of the resistance value of the chip resistor on the resistor substrate, and can meet the measurement requirements of miniaturization and high density.

The invention discloses a high-precision and high-frequency visual flying probe detection mechanism in the technical field of circuit board detection. The high-precision and high-frequency visual flying probe detection mechanism comprises a rotating unit, a linear driving unit, a visual monitoring unit, a detection probe unit and a guide connecting unit, wherein the linear driving unit and the visual monitoring unit are arranged on the rotating unit; the detection probe unit is arranged at the output end of the linear driving unit; according to the visual monitoring unit, the light path layout is simplified through the prism piece, the space layout is saved, meanwhile, the adjusting piece is arranged so that the image acquisition equipment can be rapidly and manually adjusted, the operation convenience and the adjusting precision are both considered, the single focusing time is shortened, meanwhile, circuit boards with different thickness ranges can be detected in a matched mode, and the use range is widened.

The invention relates to the technical field of probe testing, in particular to a PCB flying probe test path optimization method based on electrical characteristics, which comprises the following steps: calculating accessibility scores of test points according to the distribution of board surface test points and elements to determine risk types of the test points; determining a risk area grade corresponding to the grid unit according to the accessibility score in combination with the potential shadow area; optimizing the test path of the probe according to the risk area grade corresponding to the grid unit, and adjusting the initial moving speed of the test path of the probe in different grid units; for the same moving time sequence of different probe groups, determining overlapped grids according to the initial probe angles and the test paths corresponding to the probes, and determining whether there is a collision risk between the probes in combination with the initial moving speeds of the probes in different grid units; and when a collision risk exists between the probes, corresponding adjustment measures are taken according to the number of the overlapped grids. According to the invention, the test path is optimized in combination with multi-dimensional design based on the electrical characteristics and testability of the board.

The invention belongs to the technical field of flying probe machines, and particularly relates to a dynamic self-adaptive adjustment method, system and equipment for the needle inserting height of a flying probe machine based on grid division and a medium. A PCB board is simplified into small plane grids through the grid division technology, and the needle inserting height of each grid bonding pad is calculated in combination with a space plane equation; and the self-adaptive adjustment of the bonding pads with different heights is realized. The system is especially suitable for detecting complex plate surfaces such as warped plates, can accurately identify and adapt to plate surface deformation, and ensures the needle inserting precision. Meanwhile, the system acquires height information in real time by using the needle tip sensor, plans the test speed in advance, and realizes high-speed and accurate flying probe test. According to the invention, the test cost is reduced, the test efficiency and universality are improved, and a powerful guarantee is provided for the quality control and production efficiency of the electronic manufacturing industry.

The invention belongs to the technical field of PCB detection, and particularly relates to a PCB deformation compensation method and system and a terminal.The method achieves efficient correction of PCB deformation through a two-point global linear compensation algorithm, and specifically comprises the steps that theoretical coordinates of two alignment points are obtained, and the theoretical distance is calculated; performing alignment through a visual system to obtain a mechanical position containing a probe angle parameter; calculating an actual deformation distance based on a kinematics formula, and determining a deformation proportion; and finally, uniformly compensating all the bonding pad coordinates. According to the method, the overall deformation compensation of the PCB can be completed only through two alignment points, compared with a traditional multi-area compensation method, the process is remarkably simplified, meanwhile, the positioning precision is improved by introducing probe motion parameters, the method can be widely applied to PCB detection equipment such as a flying probe detection machine and an automatic impedance testing machine, and the problem of test deviation caused by PCB deformation is effectively solved.

The invention relates to the technical field of flying probe testing, and discloses a probe deviation compensation method and device, electronic equipment and a storage medium, and the method comprises the steps: collecting the tip coordinates of a replaced probe corresponding to different angles after the probe of the flying probe testing is replaced; calculating an eccentric parameter of the probe based on the tip coordinate; calculating a target rotation angle of the probe based on the eccentricity parameter and the camera view center coordinate; calculating the total compensation displacement based on the camera view center coordinate, the tip center point coordinate and the target rotation angle; and controlling the probe based on the target rotation angle and the total compensation displacement amount. According to the method, after the probe is replaced, the target rotation angle and the total compensation displacement are respectively calculated by detecting the coordinates of the probe tip, and then the probe is compensated according to the target rotation angle and the total compensation displacement, so that manual adjustment is not needed, and the calibration efficiency of probe compensation and the precision of flying probe testing are improved.

The present application relates to four-probe flying probe test equipment path optimization method, device and storage medium, the method includes task input module receives basic constraint condition and test task information, if using fixed grouping mode, according to the basic constraint condition fixedly divide four probes into two groups, the distance of two groups of probes from the current test task to the selectable next test task is calculated in turn and the moving path of each group of probes is planned, if using the variable grouping mode that allows probe to change group in each step test process, the optimization objective function of each step of each probe is calculated in turn and the moving path of each probe is planned, according to the moving path of each planned probe, control execution module controls each probe to move in turn and completes test task. The mathematical model constructed more comprehensively and accurately reflects the actual situation of four-probe flying probe test, provides more reliable theoretical basis for path optimization, and helps to improve the optimization precision of test path.

The invention relates to the technical field of circuit board production, in particular to a probe anti-breaking structure for a circuit board flying probe test, which comprises a probe, a connecting line is arranged at the upper end of the probe, and the outer end surface of the probe is recessed inwards to form a plurality of chutes; the straight tube is movably connected with the upper end of the probe; the guide cylinder sleeves the outer side of the probe, and the transverse part of the guide cylinder is in threaded connection with the lower end of the straight cylinder; the mounting piece is connected with the upper end of the straight cylinder; the guide plate is connected with the outer end of the probe and is slidably connected in the straight cylinder; the fourth elastic piece is connected with the upper end of the guide plate, and the other end is connected with the lower end of the mounting piece; and a plurality of guide members which are installed on the inner wall of the guide cylinder at equal intervals and are slidably connected to the outward ends of the plurality of sliding grooves respectively, so that elastic contact between the probe and the test position of the circuit board is realized, the probability of breakage and the like of the probe when the probe is in contact with the test position of the circuit board is effectively reduced, and the test efficiency is improved. The probability of damage of the test position of the circuit board is effectively reduced, and the test effect and quality are effectively ensured.

The present invention relates to the field of circuit continuity test clamping, and discloses a flying probe test fixture. The fixture includes a reference fixture and a detachable working fixture placed on the reference fixture; the reference fixture is used to provide a horizontal auxiliary clamping base surface; the working fixture is provided with a pressure surface, and when at least one group of workpieces to be tested is placed on the auxiliary clamping base surface, the pressure surface is perpendicular to the auxiliary clamping base surface, and the working fixture can clamp the workpieces to be tested on the pressure surface along the direction of the auxiliary clamping base surface. The present invention can press the workpieces to be tested of ceramic products on the pressure surface of the first substrate in the horizontal direction, and at the same time, the workpieces to be tested are placed horizontally on the auxiliary clamping base surface, and the posture correction of the workpieces to be tested can be completed in multiple directions to avoid tilting and offsetting, so as to ensure that subsequent continuity tests can be carried out smoothly.

The utility model discloses a flying probe testing machine four-wire tool bit needle seat assembly, which relates to the field of tool bit needle seats and comprises an assembly body, a connecting frame is mounted at one end of the assembly body, a pressure sensor is arranged in an inner cavity of the assembly body, a photoelectric adjusting plate is mounted on the side edge of the assembly body, and a sliding block is mounted at one end of the photoelectric adjusting plate. A reinforcing plate is installed on the outer wall of the sliding block, a first swing seat and a second swing seat are symmetrically installed on the two sides of the other end of the assembly body, blades are symmetrically installed on the tops of the first swing seat and the second swing seat, and a first baffle and a second baffle are symmetrically installed on the two sides of the bottom of the outer wall of the assembly body. According to the four-wire tool bit needle seat assembly of the flying probe testing machine, the pressure between the blade and the printed circuit board can be measured through the arranged pressure sensor, the printed circuit boards can be contacted more tightly during actual detection work, and the precision of test data can be effectively improved.

The application discloses a test fixture for electrical performance of FCBGA single product, and belongs to the field of electrical performance test of FCBGA single product. The FCBGA single product is in a rectangular structure. The fixture substrate is fixedly installed on an external flying probe test machine. A plurality of rectangular test sites are arranged on the fixture substrate and used for placing the FCBGA single product. The size of the test site is greater than that of the largest specification of the rectangular FCBGA single product. An L-shaped reference block is fixedly arranged at a first reference corner of the test site, and an inner corner is arranged on the L-shaped reference block. The inner corner is designed to be matched with a first corner and two side edges of the FCBGA single product. A strip-shaped stopper is arranged at a second reference corner of the test site. The first reference corner and the second reference corner are two opposite reference corners of the test site diagonal line. The first corner of the FCBGA single product is abutted against the L-shaped reference block, and the strip-shaped stopper is abutted against the second corner of the FCBGA single product. The first corner and the second corner are two opposite corners of the FCBGA single product diagonal line. Based on the above structure, the efficiency and quality of the flying probe test link are improved, and the test work on different size products is met.

The utility model relates to a circuit board assembly detection device, and relates to the circuit board detection technology field, the circuit board assembly detection device comprises a pedestal and a manipulator, the manipulator is arranged on the pedestal, the manipulator is provided with a flying probe, the manipulator is used for driving the flying probe to move, the pedestal is movably provided with a plurality of detection benches, and the detection benches are arranged on the pedestal. The base is provided with a moving assembly used for driving the detection table to move, the detection table is provided with a fixing assembly, and the fixing assembly is used for fixing the circuit board on the detection table. The method has the effect of improving the detection efficiency.

The invention relates to the field of circuit board detection, in particular to an automatic detection device for circuit board processing, which comprises a base, a flying probe detection mechanism and a visual sensor are fixedly mounted on the base, two symmetrically arranged telescopic support plates are fixedly mounted on the base, and an annular guide rail is arranged between the telescopic support plates on two sides. And two rotating rods are fixedly mounted on the side wall of the annular guide rail and are coaxially arranged. By arranging the linear guide rail and the annular guide rail, the limiting column and the pushing block can be flexibly adjusted according to circuit boards of different specifications. Meanwhile, the driving motor is matched to drive the rotating rod to rotate, so that the circuit board rotates, the flying probe can detect the complex circuit board by changing the angle direction of the circuit board, and meanwhile, the back face of the circuit board can be detected; and the detection efficiency of the circuit board is greatly improved while the application range of the detection device is ensured through mutual cooperative use of a limiting column and a pushing block.

The invention discloses a first workpiece detector for electronic component production, which comprises a first workpiece detector body and a detection flying probe hoisted in the first workpiece detector body through a three-axis moving frame, a positioning clamping mechanism is further arranged in the first workpiece detector body, a first conveying belt is arranged between the positioning clamping mechanism and the detection flying probe, and a second conveying belt is arranged between the first conveying belt and the detection flying probe. The two ends of the first conveying belt transversely penetrate out of the feeding port and the discharging port of the first workpiece detector body respectively, a second conveying belt is further arranged on the feeding end side of the first conveying belt, the second conveying belt is covered with a cleaning box, and a strip-shaped air nozzle is installed at the top in the cleaning box. The first conveying belt and the second conveying belt are arranged to drive a to-be-detected first workpiece to be conveyed into the first workpiece detector, the first workpiece is automatically positioned and locked under the action of the positioning and clamping mechanism to be detected, after detection is completed, the first workpiece can be automatically unlocked and conveyed out of the first workpiece detector, the manual participation degree is effectively reduced in the whole feeding and discharging process, efficiency is improved, and the labor intensity of workers is lowered. And the shutdown waiting time of the first workpiece detector is reduced.

The invention belongs to the field of printed circuit board testing, and particularly relates to a testing device suitable for multi-size printed circuit boards. The invention relates to a testing device suitable for printed circuit boards with multiple sizes, which can position and fix circuit boards with different sizes. The testing device comprises a shell and the like, a horizontal moving module is installed on the upper portion in the shell, the horizontal moving module is composed of an X-axis module and a Y-axis module, and a flying probe testing mechanism is installed on the horizontal moving module. According to the invention, the circuit is fixed in an adsorption mode, which is convenient and fast; the circuit board can be automatically loosened through the material ejecting assembly, and the equipment is more convenient to use; when the circuit board is detected, the clamping plates limit the circuit board in four directions, so that the circuit board does not displace in the detection process, and meanwhile, the sliding blocks do not limit the downward movement of the placing hole plate, so that the clamping plates can be suitable for fixing circuit boards with different sizes, and the device is high in universality.

The invention relates to the field of flying probe testing, and discloses a five-cycle reference-locked four-terminal low-resistance data processing method, which comprises the following steps of: 1, acquiring continuous five-frame initial data of a flying probe machine four-terminal test, restarting cycle if single-frame data exceeds a preset tolerance, and screening to obtain effective reference data; 2, carrying out abnormal value elimination on the effective reference data, calculating a data mean value, completing benchmark calibration, and generating a calibration reference value of a target test point; 3, based on the calibration reference value, establishing a mapping relation between the probe contact parameter of the flying probe machine and a test resistance value, and compensating a resistance value error caused by contact deviation; and step 4, adjusting test parameters such as probe pressure and staying duration of the flying probe machine according to a deviation compensation result, and outputting an optimized test scheme. The method has the following beneficial effects that the test precision is obviously improved, the robustness is strong, the cost is low, the method is easy to land, the consistency is good, and the production efficiency is improved.

The invention discloses an intelligent test system and an intelligent test method for a gas meter circuit board, and belongs to the technical field of intelligent test of circuit boards. The intelligent test system for the gas meter circuit board comprises an automatic optical detection module which is used for collecting a circuit board image, identifying element missing and polarity errors and outputting a preliminary screening result; the function test module comprises an ICT test unit and a flying probe test unit and is used for performing electrical function and performance test on the circuit board; the control and analysis module is connected with the automatic optical detection module and the function test module and used for controlling the test process and analyzing test data; the data storage module is used for storing test historical data and a fault mode database; according to the invention, the problems of low efficiency, high misjudgment and poor adaptation of a traditional test can be solved, full-process intelligent detection and accurate fault diagnosis are realized, and the test reliability and economical efficiency are improved.

The utility model relates to the technical field of semiconductor testing, and provides a probe assembly used for a flying probe testing machine and capable of identifying a needle point in the vertical direction, which comprises a main support, a cantilever support arranged on the main support, a probe arranged on the cantilever support, and a camera identification assembly arranged horizontally and used for identifying the position of the needle point of the probe in the vertical direction. The camera identification assembly comprises a mounting bracket arranged on the main bracket, an identification camera arranged on the mounting bracket, a lens matched with the identification camera and a prism matched with the lens; the camera identification assembly and the probe are always in a relative static state, the problem of interference and shielding of image acquisition does not exist, the needle point position of the probe in the vertical direction can be accurately and clearly identified through the camera identification assembly, so that debugging alignment operation is accurately carried out, the problem of mutual interference and influence does not exist among a plurality of structures, and the debugging precision is improved. Therefore, small bonding pad testing work can be carried out, and the application range of the flying probe testing machine is expanded.

This application relates to a horizontal flying probe inspection device, belonging to the field of flying probe inspection technology. It includes a loading mechanism, a first inspection mechanism, a flipping mechanism, a second inspection mechanism, and an unloading mechanism. The loading mechanism includes a frame, a transport cart, a loading platform, a robotic arm, a suction cup, and a transfer assembly, used to load PCB boards to be inspected and transfer them to the first inspection mechanism. The transfer assembly is mounted on the frame, and the loading platform slides on the transfer assembly to carry the PCB boards to be inspected. The transport cart is used to transport the loading platform to the transfer assembly. The first inspection mechanism is used to inspect the front side of the PCB boards transferred by the storage assembly. This application has the following advantages: it realizes automated PCB board inspection and double-sided inspection of PCB boards, improving inspection efficiency while reducing manual intervention, lowering labor intensity and labor costs, and improving machine utilization efficiency. Furthermore, the horizontal inspection design also enables the inspection of batches of PCB boards.

The invention belongs to the technical field of PCBA board detection, and particularly relates to an automobile PCBA board detection device which comprises a detection machine body, a gantry sliding table installed in the detection machine body and used for adjusting the detection position, and a flying probe detection head installed on the surface of the gantry sliding table and used for detection. And the conveying assembly comprises two groups of conveying frames which penetrate through the interior of the detection machine body and are oppositely arranged on the bottom side of the flying probe detection head, and conveying mechanisms which are respectively arranged on the inner sides of the two conveying frames. PCBA boards are sequentially arranged and placed on the surface of a conveying roller of the conveying assembly according to a fixed angle through the suction cup mechanical arm, then automatic conveying of the PCBA boards can be achieved through the arrangement of the conveying assembly, a second telescopic rod operates when the conveying assembly drives the PCBA boards to move to the bottom side of a flying probe detection head, the second telescopic rod drives a clamping mechanism to move upwards when extending, and the PCBA boards are clamped through the clamping mechanism. And then the PCBA board is clamped and fixed through the arrangement of the clamping mechanism, so that the intelligence of the device can be improved, and the detection efficiency of the PCBA board can be improved.

The invention discloses a PCB flying probe testing device which comprises a left elastic sheet baffle and a right elastic sheet baffle, a left metal auxiliary seat is arranged on the outer side of the lower portion of the left elastic sheet baffle, and a right metal auxiliary seat is arranged on the side, close to the left metal auxiliary seat, of the right elastic sheet baffle in the same direction. And a left mounting mechanism is arranged between the left metal auxiliary seat and the top end of the left elastic sheet baffle plate and comprises a third metal elastic sheet, a fourth metal elastic sheet and a left probe. Compared with plastic, the metal is more stable, not prone to deformation caused by temperature influence and beneficial to long-time storage and long-distance transportation, the high elasticity of the metal is utilized, the elasticity more excellent than that of the plastic can be shown without high-grade metal, the upgrading space is larger, high-end engineering plastics such as PEEK and PAI are used for the plastic at present, and the application range is wide. And the metal elastic sheet only needs to use common elastic metal such as spring steel or beryllium copper, so that the manufacturing cost can be saved.

The invention provides a rigid-flex board and a multilayer flexible board stacking process, and belongs to the technical field of circuit board preparation. The stacking process of the rigid-flex board and the multi-layer flexible board comprises the steps of drilling, electroplating, inner-layer circuit etching, protective glue curing, p < l > asma plasma surface roughening, flexible board ink printing, chemical gold, flying probe testing, flexible board laser processing, P film false connection, P film rapid pressing, flexible board and rigid board combination, rigid-flex pressing, drilling, p < l > asma plasma glue removal, electroplating, outer-layer circuit, solder mask, pre-forming, reinforcement pressing, chemical gold and character. Forming, laser cutting, uncovering, flying probe testing, flexible board appearance laser cutting, P I film tearing, Array forming, visual inspection, packaging and warehousing are carried out. According to the stack-up process of the scheme, by changing the press-fit structure, no indentation exists between the flexible boards, the inner-layer ink does not crack or fall off, the circuit does not deform, and the risk of copper wire fracturing in the circuit is reduced; the product yield is further improved, and the product competitiveness in the fields of multi-layer flexible boards and rigid-flex boards is improved.

The utility model relates to the PCB automatic positioning detection field, and discloses a PCB automatic positioning detection tool comprising a box body, the top side of the box body is provided with an ejector plate, the top side of the ejector plate is provided with a tray, the top side of the tray is provided with a lower pressing plate, the inner wall of the lower pressing plate is provided with a protection baffle plate, and the inner wall of the lower pressing plate is provided with a baffle plate. A mainboard to be tested is arranged on the inner wall of the lower pressing plate. According to the utility model, the test frame adopts a modular design and comprises a mechanical transmission part, an electrical parameter measurement system, a field data test system and a heat dissipation control system, a contact part adopts a flying probe test, and the test frame has the key points that the flexibility is high, a plurality of test points are designed, wide test coverage is provided, and rapid and comprehensive test can be realized; the PCB testing device is especially suitable for large-batch and standardized production of PCBs, and through the design of trays and limiting columns in four directions and a pressing assembly sliding in the height direction, rapid positioning of the PCBAs is achieved, and efficient testing of power panels is achieved.