61 results about "Probe tester" patented technology

To prevent breakage of a membrane probe during a probe test using a probe card having the membrane probe, appearance of a main surface of a wafer as a test object is tested by an appearance tester 51, and results of bad appearance such as adhesion of a foreign substance to the main surface of the wafer and abnormality in shape of bump electrodes over the main surface of the wafer are collected as wafer map data according to arrangement of respective chips in a plane of the wafer, then the wafer map data are transmitted to a probe tester 53 via a server 52, and the probe tester 53 omits the probe test for chips in which bad appearance was detected, and concurrently performs the probe test to other chips in which bad appearance was not detected, based on the wafer map data.

An inspection device inspects a humidity sensor having a sensor portion and a circuit portion, which are integrated into one chip. The inspection device includes: an inspection chamber for accommodating a wafer, in which a plurality of humidity sensors are disposed as a sensor chip in a wafer state; a probe for contacting an electrode pad of the circuit portion; a tester electrically connected to the probe for inspecting electric properties of the humidity sensor; and a temperature-humidity control portion for controlling a temperature and a humidity in the inspection chamber.

The invention discloses a wafer testing system and method. The system comprises a flying-probe tester and a carrier plate, the flying-probe tester is used for testing a wafer to be tested, the carrier plate is used for bearing the wafer to be tested on the flying-probe tester and providing an alignment mark corresponding to a clamping plate frame of the flying-probe tester and the domain of the carrier plate, the domain of the carrier plate and the domain of the wafer to be tested are matched to form a domain file to be tested, and after the domain file to be tested is led into a software operation system of the flying-probe tester, a testing figure file is formed. According to the wafer testing system and method, various pinboard wafers or wafers of passive integrated devices can be automatically tested through the flying-probe tester, an automatic probe table does not need to be bought for testing the wafer with different domains, corresponding expansive probe cards do not need to be customized according to the wafers to be tested with the different domains, the flexibility is improved, the cost is lowered, the period is shortened, and the industrialization process of the wafer pinboarrds such as TSV and TGV and an IPD technology is promoted.

A semiconductor substrate, probe card, and methods for stressing and testing dies on a semiconductor substrate are provided. The semiconductor substrate, typically a semiconductor wafer, comprises dies disposed thereon and a redistribution layer (RDL) for routing signals from a test circuit into dies on the substrate that are not currently under probe. The RDL includes look-ahead contacts associated with a first die set that are electrically connected by traces to dies of a second die set. Upon contact of elements of the probe tester with the look-ahead contacts, required Vcc power, GND ground potential and signals from the probe tester are routed through the traces to the die of the die set not currently under probe. The dies can comprise a built-in self-stress (BISS) circuit and / or a built-in self-test (BIST) circuit for implementing a stress or test sequence. The look-ahead contacts allow for overlapping or substantially simultaneously stressing and / or testing dies of dies of a die set currently under probe and dies of a second die set located prior to or after the current probe head position (i.e., not under probe).

The invention discloses an FCT probe testing instrument, which comprises a control box, a movable plate and a carrying plate. The carrying plate and the movable plate are positioned above the controlbox. The movable plate and the carrying plate are located on the two opposite sides of the upper surface of the control box respectively. A left positioning block and a right positioning block which are matched with the left side and the right side of an ECU box are arranged above the carrying plate. The two positioning blocks get closer to each other or get further away from each other through aclamping and driving mechanism so as to clamp or loosen the ECU box. The direction of the movable plate relative to the carrying plate is defined as front. The movable plate is provided with a movabledriving mechanism for driving the movable plate to move back and forth. A needle plate is arranged above the movable plate, and lifting driving mechanisms for driving the needle plate to ascend or descend are arranged on the left side and the right side of the needle plate. According to the invention, a probe and the interface of an ECU box can be automatically connected and detected, so that thedetection efficiency is improved. ECU boxes with different sizes and interfaces at different positions on ECU boxes can be detected by the FCT probe testing instrument without the replacement of theprobe, so that the detection cost is reduced.

The present invention allows non-wafer form devices to be tested on a standard automatic wafer-probe tester or other automated test or measurement device commonly employed in semiconductor or allied industries (e.g., flat panel display, data storage, or the like) processes. The present invention accomplishes this by providing a low-profile carrier for temporarily mounting a non-wafer form device. The low-profile carrier holds the non-wafer form device (e.g., an integrated circuit chip, a thin film head structure, one or more molded array packages, etc.) magnetically into recesses which are machined or otherwise formed in the low-profile carrier.