Wafer testing system and method

Abstract

The invention discloses a wafer testing system and method. The system comprises a flying-probe tester and a carrier plate, the flying-probe tester is used for testing a wafer to be tested, the carrier plate is used for bearing the wafer to be tested on the flying-probe tester and providing an alignment mark corresponding to a clamping plate frame of the flying-probe tester and the domain of the carrier plate, the domain of the carrier plate and the domain of the wafer to be tested are matched to form a domain file to be tested, and after the domain file to be tested is led into a software operation system of the flying-probe tester, a testing figure file is formed. According to the wafer testing system and method, various pinboard wafers or wafers of passive integrated devices can be automatically tested through the flying-probe tester, an automatic probe table does not need to be bought for testing the wafer with different domains, corresponding expansive probe cards do not need to be customized according to the wafers to be tested with the different domains, the flexibility is improved, the cost is lowered, the period is shortened, and the industrialization process of the wafer pinboarrds such as TSV and TGV and an IPD technology is promoted.

Description

technical field [0001] The present invention relates to the field of electronic technology, in particular to a wafer testing system and a wafer testing method. Background technique [0002] With the rapid development of electronic products, the microelectronic packaging technology is developing towards the trend of multi-function, miniaturization, portability, high speed, low power consumption and high reliability. System-in-a-Package (SIP) can effectively reduce the chip area, power consumption and heat dissipation. The technology of making interposers and LCR devices on wafers, such as Through Silicon Via (TSV) Technology, through glass via wafer (TGV) technology and integrated passive device (Integrated Passive Device, IPD) technology are important technologies for SIP packaging, so they have received more and more attention. [0003] At present, there is no automatic test equipment specifically for wafer-type adapter boards, which has become one of the bottlenecks in re...

AI Technical Summary

Problems solved by technology

However, since the thinned wafer is only a few hundred microns thick, it is very fragile and fragile, and cannot be fixedly placed on the current flying probe tester.

At the same time, the sample to be tested on the flying probe testing machine is determined based on the copper frame on the rectangular substrate as the approximate reference position, which cannot be aligned with the reference position of the circular wafer to be tested.

In the existing technology, automatic probe stations need to be purchased for wafer testing, and different probe cards need to be customized for different wafer layouts. The testing is inflexible, costly, and has a long cycle, which is not conducive to the industrialization process of SIP technology.

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