Method of testing unloaded, large-area printed circuit boards with a finger tester

A technology for circuit boards and testers, which is applied in printed circuit testing, electronic circuit testing, non-contact circuit testing, etc., and can solve problems such as the development, production and operation of super-large probe testers, which are expensive and the number of testers is limited.

Inactive Publication Date: 2008-06-11
ATG LUTHER & MAELZER GMBH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Due to the limited number of said testers, these very large probe testers are very expensive to develop, produce and operate

Method used

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  • Method of testing unloaded, large-area printed circuit boards with a finger tester
  • Method of testing unloaded, large-area printed circuit boards with a finger tester
  • Method of testing unloaded, large-area printed circuit boards with a finger tester

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Embodiment Construction

[0027] The method according to the invention for testing large, non-componentized circuit boards with conductor paths is carried out by means of a probe tester. The probe tester has several test electrodes 1 which can be brought into contact with the circuit board test points of the conductor paths 2 of the circuit board 3 (FIGS. 1, 2). Each test electrode 1 is integrated in a contact probe 4 . In this example, the probe tester contains a composite probe system, the composite probe system contains 12 contact probes 4 in total, and every 6 contact probes are placed on one side of the circuit board 3 to be tested on the side. EP0468135A1 discloses a pointer probe in which contact probes are independently movable relative to further contact probes. The contact probes 4 are movable parallel to the surface of the circuit board 3 so that the test electrodes 1 can be brought into contact with specific circuit board test points of the conductor paths. Each of said contact probes 4 ...

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PUM

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Abstract

The invention relates to a method of testing unloaded, large-area printed circuit boards having conductor tracks with a finger tester. According to the method according to the invention, the printed circuit boards are tested when subdivided into a number of segments, conductor tracks that extend beyond one segment being tested by means of capacitive measurement of the end points located in the respective segment, an interruption of the conductor track being established if one measured value of the capacitive measured values belonging to one conductor track differs significantly from other measured values.

Description

technical field [0001] The present invention relates to a method of testing large unassembled circuit boards with conductor paths using a probe tester. Background technique [0002] Apparatuses for testing non-componentized circuit boards can be roughly divided into two groups, namely probe testers and parallel testers. [0003] A parallel tester is a test device for testing through a contact structure, typically represented by an adapter, which simultaneously contacts all or at least most of the contact points of the circuit board to be tested. The parallel tester is preferably used for testing non-componentized circuit boards because the parallel tester can be used to quickly and reliably scan a large number of circuit board test points. [0004] The method shown in WO 01 / 40809 A1 makes it possible to test successively regions of a circuit board, where the regions must overlap in such a way that the conductor paths extending from one region to the other must overlap. The...

Claims

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Application Information

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IPC IPC(8): G01R31/28G01R31/312
CPCG01R31/2805G01R31/312G01R31/28
Inventor 爱芙杰尼·亚内科吉尔伯特·福尔普特乌韦·罗特霍格
Owner ATG LUTHER & MAELZER GMBH
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