Probe switching control system for flying probe test and method thereof

Abstract

The invention provides a probe switching control system for flying probe test and a method thereof. The probe switching control system comprises the components of a control host computer, an I/O control unit, a relay combination unit, an insulation resistance test unit, a precise resistance test unit and a capacitor test unit; wherein the insulation resistance test unit, the precise resistance test unit and the capacitor test unit are electrically connected with the relay combination unit. The relay control unit is furthermore connected with a first probe, a second probe, a third probe and a fourth probe electrically. The control host computer controls the on-and-off state of the combined relay in the relay combination unit through the I/O control unit, thereby realizing selection of a substrate test mode from insulation resistance test, precise resistance test and capacitance test, and switching a probe assembly in a corresponding substrate test mode. The probe switching control system for flying probe test and the method have functions of reducing number of used relays, reducing mounting dimension, reducing use cost and designing difficulty for an array switching control board, and improving test efficiency and reliability in control and operation of the whole system.

Description

technical field [0001] The invention relates to the technical field of flying probe testing, in particular to a probe switching control system and method for flying probe testing. Background technique [0002] The flying probe test refers to replacing the bed of needles with probes, using multiple motor-driven, fast-moving electrical probes to make contact with the pad pins on the substrate and perform electrical measurements. The flying probe test equipment is the key equipment for semiconductor post-packaging. Its working mechanism is: the resistance and capacitance measurement module used for the flying probe test generates the GERBER process file according to the schematic diagram of the circuit substrate, converts the GERBER file into a test file, and then automatically Test, and the test module is the execution part of the automatic test. [0003] Substrate faults are generally formed during the manufacturing process. The most common faults are: short circuits between...

AI Technical Summary

Problems solved by technology

When the number of stylus is four, the existing stylus switching method requires at least 24 relays in three test modes and 4 stylus switching one-to-one conduction

Moreover, in the process of flying probe testing, especially for testing LTCC substrates, the test

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