Manufacturing process of double-sided ultra-thick copper plate

Abstract

A manufacturing process of the double-sided ultra-thick copper plate comprises the following steps: material distribution; performing first plate electroplating thick copper; drilling positioning holes in the side edges of the substrate; pressing a circuit dry film for the first time and performing acid etching for the first time; carrying out first resin printing, namely filling the resin in thearea with the copper layer etched in the last step, and keeping the resin layer and the copper layer flat after printing; carrying out primary copper deposition and secondary plate electroplating thick copper; pressing a circuit dry film for the second time and performing acid etching for the second time; Resin printing for the second time; repeating the steps 6-8 for n times, wherein n is greaterthan or equal to 0; drilling a via hole in the substrate; repeating the sixth step and the seventh step again; and finally, carrying out surface resistance welding, character printing, surface treatment, shaping, flying probe, FQC and packaging on the substrate to prepare the double-sided ultra-thick copper plate. Multiple times of etching are adopted, so that the bottom copper of the dry film can be completely removed in each time of etching; And meanwhile, resin is filled for multiple times, so that the poor solder mask printing phenomenon caused by too thick copper layers is reduced.

Description

technical field [0001] The invention relates to the field of manufacturing double-sided PCB boards, in particular to a manufacturing process for double-sided ultra-thick copper boards. Background technique [0002] Usually, PCB boards with a copper thickness of not less than 10OZ (1OZ=35 microns) are called ultra-thick copper boards. This type of board has good current carrying capacity, excellent heat dissipation, and high reliability. It is mainly used in network energy and communications. , automobiles, high-power power supplies, clean energy solar energy, etc., have a broad market and development prospects. [0003] Due to the thick copper layer, the ultra-thick copper plate has major problems in the etching, drilling, and solder mask processes. The process is difficult and has a great impact on product performance. Contents of the invention [0004] The technical problem to be solved by the present invention is to overcome the deficiencies of the above-mentioned prio...

AI Technical Summary

Problems solved by technology

[0003] Due to the thick copper layer, ultra-thick copper plates have major problems in etching, drilling, and solder masking processes. The process is difficult and has a great impact on product performance.