Silicon through hole patch board wafer testing system and method

Abstract

The invention discloses a silicon through hole patch board wafer testing system and method. The system comprises a fly-probe tester and a circuit board, wherein the fly-probe tester is used for testing a silicon through hole patch board wafer to be tested, the circuit board is used for fixing the silicon through hole patch board wafer to be tested to the fly-probe tester, and position alignment marks for alignment with a rack plate frame of the fly-probe tester are provided. According to the silicon through hole patch board wafer testing system and method, the silicon through hole patch board wafer can be automatically tested through the fly-probe tester, silicon through hole patch board wafers with different layouts can be tested, an automatic testing machine and an automatic probe table do not need to be purchased, corresponding expensive probe cards do not need to be customized according to the silicon through hole patch board wafers with different layouts, testing efficiency is improved, and a testing scheme with low cost is provided.

Description

technical field [0001] The invention relates to the field of electronic technology, in particular to a wafer testing system for a through-silicon via adapter board and a wafer testing method for a through-silicon via adapter board. Background technique [0002] With the rapid development of electronic products, microelectronic packaging technology is developing towards the trend of multi-function, miniaturization, portability, high speed, low power consumption and high reliability. System In a Package (SIP for short) can effectively reduce the chip area, and Through Silicon Via (TSV for short) technology is an important technology in the SIP packaging process. Layer chips are interconnected, so TSV has received more and more attention. [0003] However, because TSV technology is not fully mature in China, the device yield rate is not ideal. Therefore, it is necessary to test the TSV interposer wafer. The traditional flying probe test machine has high density of test compone...

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Problems solved by technology

[0003] However, because TSV technology is not fully mature in China, the device yield rate is not ideal. Therefore, it is necessary to test the TSV interposer wafer. The traditional flying probe test machine has high density of test components, many layers, and high wiring density. , The circuit board with a small measuring point distance has the advantages of fine pitch, not limited by the grid, flexible testing and fast speed. However, because the thinned TSV adapter wafer is only a few hundred microns thick, it is very fragile Fragile, cannot be fixed directly on the current flying probe tester

At the same time, the sample to be tested on the flying probe testing machine is determined based on the copper frame on the rectangular substrate as the approximate reference position, which cannot be aligned with the reference position of the circular TSV adapter board wafer to be tested. Among them, in order to test the TSV interposer wafer, it is necessary to purchase an automated test system (Automatic Test Equipment, referred to as ATE), an automatic probe station, and for different TSV layouts, it is necessary to customize different probe cards. The test is not flexible and the test high cost

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