Novel manufacturing method for back drilling of PCB (Printed Circuit Board)

A manufacturing method and back-drilling technology, applied in the direction of boring/drilling, drilling/drilling equipment, manufacturing tools, etc., can solve the problem of serious orifice draping, the welding ring of the orifice falling off, affecting the yield and performance and other issues, to achieve the effect of improving the front problem

Inactive Publication Date: 2011-03-30
SHENZHEN SUNTAK MULTILAYER PCB
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In the prior art, the method of drilling twice in a row after the circuit etching or direct gong is used; this method will cause the hole to be severel...

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0022] Parameter requirements:

[0023] ●Inner core board: 0.2mm H / H (without copper)

[0024] ●Number of layers: 24L

[0025] ●Inner line width spacing: Min 3.0 / 3.0miL

[0026] ●Outer line width spacing: Min 4.0 / 4.0miL

[0027] ●Sheet Tg: 170°

[0028] ●Outer copper foil: H OZ

[0029] Hole copper thickness: Min 25um

[0030] ●Solder mask: green oil

[0031] ●Surface technology: immersion gold

[0032] ●Completed board thickness: 4.8mm+ / -10%

[0033] ●Minimum aperture: 0.3mm

[0034] ●Require back drilling from the 13th to the 24th floor

[0035] ●Working PNL size: 466mm*411mm

[0036] Board making process:

[0037] 1. Cutting - cut out the core board according to the panel size 466mm*411mm, the thickness of the core board is 0.2mm l / l (excluding copper);

[0038] 2. Inner layer——Complete the exposure of the inner layer circuit with 5-7 grid exposure rulers (21 grid exposure rulers), etch out the inner layer circuit pattern after development, and the minimum measu...

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Abstract

The invention discloses a novel manufacturing method for the back drilling of a PCB (Printed Circuit Board), which comprises the steps of: A) drilling the PCB substrate for the first time after the PCB substrate is subjected to cutting, bonding with a dry film, browning the inner layer and treating with a pressing board; B) carrying out the copper-deposition panel electroplating or added-panel electroplating; C) carrying out the back drilling on holes to be subjected to the back drilling; D) carrying out alkaline etching treatment on the board subjected to the back drilling; and E) carrying out solder stripping treatment on the PCB board, detecting the PCB board subjected to the solder stripping treatment through a flying probe tester and obtaining a finished product when the PCB is detected to be qualified. In the manufacturing method, the pattern tin electroplating is carried out after the external layer dry film on the PCB is made, then the back drilling is carried out on the hole to be subjected to the back drilling, and then etching is carried out so that the burr generated in the course of the drilling can be eliminated and the copper in a part of the hole with the copper can be protected from being etched at the same time.

Description

technical field [0001] The invention belongs to the technical field of PCB production, and in particular relates to a novel PCB back-drilling production method. Background technique [0002] When the PCB board needs to make only one copper-free hole on top of a through hole, that is, half of the depth of the hole needs to be copper-plated and the other half does not need to be copper-plated, it needs to be made by back drilling. In the prior art, the method of drilling twice in a row after the circuit etching or direct gong is used; this method will cause the hole to be severely draped, and the welding ring of the hole will fall off after two consecutive drillings, which will seriously affect the finished PCB. rate and performance. Contents of the invention [0003] The purpose of the present invention is to provide a novel method for making PCB back-drilling holes. The present invention performs graphic tinning after the outer dry film of the PCB is finished, and then pe...

Claims

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Application Information

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IPC IPC(8): H05K3/00B23B41/02
Inventor 叶应才何淼彭卫红刘东
Owner SHENZHEN SUNTAK MULTILAYER PCB
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