2868results about How to "Avoid scrapping" patented technology

An adapter for connectors to couple connectors and power supply sockets of different specifications to establish electric connection between them includes two terminal sets that are insertable into the power supply sockets. The two terminal sets are pivotally coupled on one end of the adapter in an opposite open manner, and are held in a housing trough formed on the adapter in normal conditions. When in use desired terminals can be inserted into a corresponding power supply socket of a selected specification and raised upright. The terminal sets can be retracted and extended so that the size of the adapter is smaller. Such a design also can keep the terminals from extending to prevent hurting people or articles.

A press-fit terminal is adapted to be press-fitted in an through-hole of board for electrically conducting with the press-fit terminal. The press-fit terminal includes a terminal-base portion and a board inserting portion at least partially plated with tin. A thickness of the plated tin is from 0.1 to 0.8 μm.

Apparatus and methods for removal of pollutants from a stream of water, by binding the pollutant particles to magnetic seeding particles using a flocculating polymer, and then removing the composite magnetic particles from the water stream in a simple and efficient apparatus. The invention is applicable to many common water treatment applications but is especially important for high flow applications requiring efficiency and simplicity. Magnetic fields concentrate the composite magnetic particles in a stratified layer that is then continually separated from the moving stream of water. In another preferred embodiment, vortex separation is combined with magnetic separation to enhance magnetic seed material cleaning and to reduce the solids load on the final magnetic collector.

A confinement ring coupling arrangement for coupling, in a plasma processing chamber, a confinement ring to a plunger. The plunger is configured to move the confinement ring to deploy and stow the confinement ring to facilitate processing of a substrate within the plasma processing chamber. The confinement ring coupling arrangement includes a hanger adapter having a locking head, the hanger adapter being configured to be coupled with the plunger. The confinement ring coupling arrangement further includes a hanging bore disposed in the confinement ring and configured to receive the locking head and to secure the locking head within the hanging bore during stowing and deployment of the confinement ring, wherein a diameter of the locking head is sufficiently smaller than a cross-section dimension of the hanging bore to prevent a sidewall of the locking head from scraping against a sidewall of the hanging bore during the stowing and deployment of the confinement ring.

The invention provides a grinding device for wooden door manufacturing. The grinding device for wooden door manufacturing comprises a bracket, an overturning assembly, a limiting assembly, a grindingassembly and a material moving assembly used for driving the grinding assembly to move horizontally. The bracket comprises a left side plate, a right side plate and a top plate of a cuboid structure.The material moving assembly comprises a first feed assembly and a second feed assembly. The overturning assembly comprises a first material overturning assembly and a second material overturning assembly. The first material overturning assembly and the second material overturning assembly are of the same structure and each comprise a rotary tube, a clamping assembly located the end, close to thetop plate, of the rotary tube and a rotating assembly used for driving the rotary tube to rotate in the axial direction of the rotary tube. The grinding device has the beneficial effects that workpieces can be turned over through the overturning assembly and can be limited through the limiting assembly, and the situation that the workpieces are scrapped due to not being limited; the surface and the two sides of each workpiece can be ground through the grinding assembly, and the grinding device can also conduct processing on wood bits produced during grinding.

The invention provides a correction device and a correction method for an inner ring of an engine crankcase. The correction device comprises a correction clamp base, positioning pins and a pressure plate; the tooling surface of the correction clamp base is provided with a circular seam allowance, and the inner side of the seam allowance is provided with a circle of uniform positioning pin holes; and the middle section of the positioning pin has a round table step-shaped columnar structure, the taper of the round table of the middle section is as same as that of the inner ring of the crankcase, and the maximum diameter of the positioning pin enables the positioning pin inserted into the positioning hole not to interfere with a blade of the crankcase. The correction method comprises the following steps of: jointing the seam allowance of the crankcase and the seam allowance on the correction clamp base; inserting the positioning pins into the positioning pin holes, positioning the positioning pins and the inner ring of the crankcase in a two-section contact mode, and then fixing the crankcase on the correction clamp base through the pressure plate; welding the inner ring and the blade of the crankcase; and finally, pouring a glue layer into the inner side of the inner ring of the crankcase, and gluing the inner ring and the blade of the crankcase. The device and the method ensurethe concentricity of the easily-deformed inner ring and the outer crankcase and the ellipticity of the inner ring.

A data storage device chassis for housing a plurality of data storage devices has a plurality of walls at least some of which have at least one guide strip along at least part of the length of the wall to define a plurality of bays in which data storage devices (18) can be housed. The guide strips support respective data storage devices in the bays such that the data storage devices can be slid into and out of the bays by sliding along the guide strips. The at least some of the walls are composed of a non-metallic material such that the surface of said guide strips along which a data storage device slides is non-metallic. Each of said at least some of the walls have an electrically conductive portion passing through the wall to provide for electrical conduction between the bays thereby providing electrical shielding for data storage devices housed in the bays.

The invention discloses a roll forming method of a TC25 titanium alloy thin-walled ring forging. In order to roll-form a thin-walled ring forging with high dimensional precision and excellent tissue and performance, the technical scheme comprises the steps of: firstly, sleeving a preheated follower die sleeve and a titanium alloy pre-rolled blank heated to a deformation temperature in a ring rolling mill, sleeving the follower die sleeve in the pre-rolled blank, and positioning the two workpieces by using a main roll, a core roll, clutching rolls, an upper cone roll and a lower cone roll of the ring rolling mill; and starting the ring rolling mill, making a feeding motion by the core roll towards the direction of the main roll along the radial direction and rolling the pre-rolled blank at a rolling force of 200-4000KN under the support of the follower die sleeve by the core roll together with the main roll to ensure that the pre-rolled blank expands radially at a speed of 5-10mm/s, wherein the wall thickness is gradually reduced, and the pre-rolled blank is rolled into the thin-walled ring forging when the deformation reaches 25-45 percent. The minimum value of the wall thickness of the titanium alloy thin-walled ring forging roll-formed by adopting the method is 25mm, the maximum value of the height-thickness ratio is 25mm, and the ring forging is mainly used for gyrorotor parts, such as a cylindrical shell and the like used in the fields, such as aerospace and the like.

The invention discloses an antenna array module. More than two antenna units are arranged on a surface, which two power division circuits are arranged, of a feeding network circuit board, a filter isarranged on a surface, which two coupling circuits are arranged, of the feeding network circuit board, each power division circuit is provided with an input end and a plurality of output ends, the plurality of output ends of one of the power division circuits is used for performing polarization feeding on one of the antenna units at -45 degrees, the plurality of output ends of the other power division circuit are used for performing polarization feeding on one of the antenna units at +45 degrees, each coupling circuit is provided with a radio frequency input end and an output end, the output end of each coupling circuit is electrically connected with the input end of one of power division circuits, the filter is at least provided with two output ends, and the two output ends of the filterare electrically connected with the radio frequency input end of one of the coupling circuits. The invention also discloses a base station antenna. Integration and modularization are achieved, the expansibility is improved, an installation structure and a connection structure are simple, the antenna array module is easy to debug and maintain subsequently, and the manufacturing cost and the application cost are reduced.

The invention provides a preparation method of a flexible circuit board capable of being continuously discharged one by one. The method includes the following steps of firstly, stamping the flexible circuit board multiple times, and preparing a slightly-adhering film with drilled holes; secondly, pasting the slightly-adhering film; thirdly, stamping the stamped flexible circuit board to which the slightly-adhering film adheres again; fourthly, tearing off waste. According to the preparation method, the flexible circuit board does not need to be taken out each time after being stamped, the whole FPC is machined, and time and labor are saved; statistics can be conveniently and rapidly conducted on the single pcs number after stamping is conducted; FQC can be conducted on the whole flexible circuit board after a bubble cushion is slightly torn off, and detection efficiency is improved; the risks that folds are formed on the FPC and 3M glue release paper falls off due to the fact that the FPC is touched by hand during detection are avoided, and quality is ensured; the process that multiple pieces of single pcs are sequentially arrayed and placed on the slightly-adhering film through manual operation is replaced by the process that the waste is overall torn from the slightly-adhering film, efficiency is improved, and time and labor are saved.

The invention discloses manufacturing process for an integrated fully-sealed liquid crystal screen. Components which are sequentially arranged are laminated into a whole through a solid ultraviolet flexible adhesive, wherein the components comprise screen protecting glass, a liquid crystal screen set, a support frame and a rear glass cover plate, wherein edge lighting type backlight module is nested in the support frame. The integrated fully-sealed touch and display screen manufactured by the process is waterproof, damp-proof and ultrathin, all gaps of the screen protecting glass or the touch screen set, a liquid crystal display screen set and the side lighting type backlight module are eliminated, image definition is improved, and brightness can be reduced to achieve a remarkable energy-saving effect.

The present invention is drawn to an integrally formed flat flexible fender flare and mud flap assembly made to be easily fitted on existing wheel wells, even ones having existing factory flare sections, which will prevent mud and road debris from being thrown unto the truck body sections such as the front end bumper and the running board.

The aim of the invention is to reduce the formation of scratches in a device for the thermal treatment of substrates, in particular, semiconductor substrates, in a chamber in which the substrate is placed upon support elements. According to the invention, said aim is achieved by means of displaceable support elements.

The invention discloses an electroless copper plating method for PCBs with high aspect ratios. According to the method, the intervals between adjacent PCBs with high aspect ratios are adjusted, and a plug board rack is enabled to swing in a an electroless copper plating potion in a direction perpendicular to the board surface, so that bubbles are discharged from holes in the PCBs with high aspect ratios; then electroless copper plating processes are performed twice on the PCBs with high aspect ratios, and total board electroplating flashing is performed on the PCBs after the primary electroless copper plating; accordingly, the thickness of copper on the hole wall is increased; and then the secondary total board plating is performed to thicken the copper. Compared with the prior art, the method effectively solves the problem that the circuit boards are scrapped due to copper absence in the holes caused by the fact that the bubbles in the holes cannot be cleared out or potion exchange in the holes is poor in the electroless copper plating process; and further, the total board electroplating flashing is adopted after the primary electroless copper plating process, therefore, the problem that original copper is corroded away in the secondary electroless copper plating pretreatment is solved, and accordingly, production scrapping is reduced effectively, and the manufacturing rework cost is reduced.

The invention discloses a high-voltage flexible LED patch lamp tape and a manufacturing technology and a mounting method thereof. The high-voltage flexible LED patch lamp tape is mainly composed of one lamp tape unit or more than one lamp tape units connected back and forth. Each lamp tape unit comprises a transparent flexible casing and a double-sided flexible strip circuit board encapsulated in the transparent flexible casing. The front and rear ends of each lamp tape unit are respectively sleeved with an end cap, and more than one lamp tape unit can be connected back and forth through connecting parts matched with the end caps. Compared with the prior art, the high-voltage flexible LED patch lamp tape has the advantages that the high-voltage flexible LED patch lamp tape is light in weight, small in size, process saving, safe and reliable, convenient to mount, and the like.

The invention discloses a vacuum coating device, a vacuum coating control system and a control method. The vacuum coating device comprises a vacuum chamber, a vacuum pump and a cryogenic pump. The top of the vacuum cavity is provided with an umbrella frame, and a substrate to be coated is placed on the umbrella frame; the vacuum cavity is provided with an e-type electron gun, which is provided with crucibles in a circle and capable of rotating around the center of the circle; a crucible is provided with a coating material; a baffle is arranged above a crucible heating position; and a pipe connecting the cryogenic pump and the vacuum chamber is provided with a flapper valve. According to the invention, a zoning control principle is applied to trajectory control of electron beam from the electron gun; current frequencies of an X axis scanning coil and a Y axial scanning coil in each zone are respectively controlled, thereby further controlling scan time of the electron beam in each block on the surface of the coating material. The invention avoids pit phenomenon caused by uneven evaporation of an oxide material, and effectively prevents crucible damage or substrate scrapping.

The invention provides a chemical mechanical lapping device and a system. The chemical mechanical lapping device comprises a wafer supporting seat, a lapping pad, a lapping pad fixed piece, a shaft lever and a raw material providing device, wherein the wafer supporting seat is used for supporting a wafer to be lapped, and a surface to be lapped of the wafer is upward, the lapping pad is arranged on the upper part of the wafer supporting seat, a lapping surface of the lapping pad is downward and is opposite to the surface to be lapped of the wafer, the area of the lapping area of the lapping pad is less than the area of the surface to be lapped of the wafer, the lapping pad fixed piece is fixed on the upper portion of the lapping pad and for fixing the lapping pad, the shaft lever is arranged on the upper part of the lapping pad fixed piece and for driving the lapping pad fixed piece and the the lapping pad to rotate, and the raw material providing device is arranged on the upper part of the wafer supporting seat for providing lapping liquids for the surface to be lapped of the wafer. According to the chemical mechanical lapping device and the system, wafers with diameters of 450mm or more can be lapped simply and accurately.

The invention discloses an array substrate, a preparation method thereof and a display panel, which are used for preventing a semiconductor region of an active layer of a thin film transistor from being illuminated, improving the working stability of the thin film transistor, avoiding uneven display pictures and improving the display effect. The array substrate comprises a substrate body, a shading layer located on the substrate body, a buffer layer located on the shading layer, an active layer located on the buffer layer and a shading part. The buffer layer is provided with a groove. The active layer includes a semiconductor region, and a first conductive region and a second conductive region connected to the semiconductor region. The semiconductor region and the shading part fill the groove. The orthographic projection of the shading part on the substrate is annular, the side surface of the semiconductor region is completely surrounded by the shading part, and the first conductor region and the second conductor region are located above the shading part and the semiconductor region. The orthographic projection of the shading layer on the substrate covers the orthographic projection of the semiconductor region on the substrate.