Flexible circuit board capable of being continuously discharged one by one, and preparation method thereof

Abstract

The invention provides a preparation method of a flexible circuit board capable of being continuously discharged one by one. The method includes the following steps of firstly, stamping the flexible circuit board multiple times, and preparing a slightly-adhering film with drilled holes; secondly, pasting the slightly-adhering film; thirdly, stamping the stamped flexible circuit board to which the slightly-adhering film adheres again; fourthly, tearing off waste. According to the preparation method, the flexible circuit board does not need to be taken out each time after being stamped, the whole FPC is machined, and time and labor are saved; statistics can be conveniently and rapidly conducted on the single pcs number after stamping is conducted; FQC can be conducted on the whole flexible circuit board after a bubble cushion is slightly torn off, and detection efficiency is improved; the risks that folds are formed on the FPC and 3M glue release paper falls off due to the fact that the FPC is touched by hand during detection are avoided, and quality is ensured; the process that multiple pieces of single pcs are sequentially arrayed and placed on the slightly-adhering film through manual operation is replaced by the process that the waste is overall torn from the slightly-adhering film, efficiency is improved, and time and labor are saved.

Description

technical field [0001] The invention relates to the field of processing and manufacturing of mobile phone and computer / digital product parts, in particular to a flexible circuit board for continuous shipment and a preparation method thereof. Background technique [0002] With the continuous development and progress of science and technology, the requirements for circuit boards are getting higher and higher, especially for digital products that pursue convenience and light weight. Flexible circuit boards with scrambling, ultra-thin and light weight are used as high-tech products in The field of electronics has been greatly developed and applied, and at the same time, the requirements for its performance have gradually increased. [0003] However, with the rapid development of automation today, the flexible circuit board that requires single pcs shipment still adopts the traditional process method: the flexible circuit board is punched twice or three times (because a variety o...

AI Technical Summary

Problems solved by technology

The specific process is: one-time punching → SMT (mounting components) → 3M adhesive bonding (used to fix the FPC when the customer installs the machine) → secondary punching (forming single pcs) → FQC → packaging (manual single pcs film packaging), such as flexible circuit boards such as figure 1 As shown, after one punching and two punching, it is formed as figure 2 For the single pcs shown, each single pcs is manually pasted on the film for packaging, but this method has the following disadvantages: (1) The punching operation is time-consuming and laborious, that is, one punch and one take, and the single pcs need to be packed each time. The pcs are taken out from the mold; (2) After punching, it is easy to cause the 3M glue release paper attached to the FPC to fall off and rework or the bulk FPC will be lost or scrapped during the feeding process; (3) The number of single pcs after punching is not enough Good statistics; (4) The efficiency of FQC single pcs inspection is low; (5) It is a time-consuming and complicated task for the packaging staff to neatly arrange the single pcs of FPCs on the micro-mucosa with cotton swabs

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