Method for improving burrs after etching of semi-pore routing

A technology of etching and gong board, which is applied to the removal of conductive materials by chemical/electrolytic methods, the manufacture of electrical components, printed circuits, etc., and can solve problems such as defective repairs or scrapping of products, and shattering

Inactive Publication Date: 2020-10-27
深圳市星河电路股份有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The purpose of the present invention is to solve the shortcoming in the prior art that there are ridges in the half-hole after etching or copper wire residues that are not etched, resulting in defective products that need to be repaired or scrapped. The front method

Method used

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Embodiment Construction

[0026] The following clearly and completely describes the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only some of the embodiments of the present invention, but not all of them.

[0027] A method for improving half-hole gong plate with a sharp edge after etching, comprising the following steps:

[0028] S1: Figure electricity, gong half hole: plate a layer of tin on the surface of the gong board, and then carry out the gong half hole process;

[0029] S2: One-time etching: perform one-time etching at a speed of 1m / min, etch away the copper skin attached to the hole or the hole, and etch away part of the residual copper rolled into the hole due to the gong plate, It is convenient to exchange the potion for the second etching to completely etch the copper skin; because the half hole is protected by tin, and tin is resistant to alkaline etching. If it is etched at a normal etching speed, the copper skin of the gong pla...

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PUM

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Abstract

The invention belongs to the field of semi-pore plates, and especially relates to a method for improving burrs after etching of a semi-hole routing, and provides the following scheme aiming at the problem that a product is bad and needs to be repaired or scrapped due to burrs in an existing etched semi-hole or copper wire residues which are not etched completely. The method comprises: S1, patternelectroplating and semi-hole routing: plating a layer of tin on the surface of the routing, and then performing a semi-hole routing process; S2, primary etching: performing primary etching, attachingthe milled half hole to an orifice or a copper sheet in the hole to be etched off, and etching off part of residual copper rolled into the hole during milling, so that the copper sheet can be completely etched off through liquid medicine exchange during secondary etching; and S3, film stripping is conducted, specifically, using film stripping liquid for conducting film stripping, emphatically checking whether film stripping of the fine-pitch independent lines is thorough or not after film stripping. The alkaline etching operation mode is adjusted, it can be improved that no burrs or copper wire residue abnormity exists in the etched half holes, the complete half hole shape is achieved, and normal use of the next procedure is facilitated.

Description

technical field [0001] The invention relates to the technical field of half-hole plates, in particular to a method for improving the edge-cutting of half-hole plates after etching. Background technique [0002] The normal half-hole plate process is to use a gong plate to drill out the half hole before etching and stripping the film after electroplating, and then go through the etching line for film stripping / etching / palladium removal / sn stripping. [0003] After normal etching, there are ridges in the half hole or copper wire residues that are not etched clean, resulting in defective products that need to be repaired or scrapped. Contents of the invention [0004] The purpose of the present invention is to solve the shortcoming in the prior art that there are ridges in the half-hole after etching or copper wire residues that are not etched, resulting in defective products that need to be repaired or scrapped. The front method. [0005] In order to achieve the above objec...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K3/06
CPCH05K3/068
Inventor 董奇奇温沧罗良禄
Owner 深圳市星河电路股份有限公司
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