High-aspect-ratio stepped backdrilling method

A technology with high aspect ratio and manufacturing method, applied in printed circuit manufacturing, electrical components, printed circuits, etc., can solve problems such as large accuracy deviation, step back drilling deviation, accuracy problem and difficult tolerance control, and achieve product quality assurance. , increase the cost, improve the effect of the front

Pending Publication Date: 2021-05-04
AOSHIKANG TECH CO LTD
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  • Abstract
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  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0010] However, the existing technology is not mature enough for the step-drilling technology. The positioning holes on the back-drilling surface of the steps are not mirrored to the positioning holes duri

Method used

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  • High-aspect-ratio stepped backdrilling method

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Embodiment Construction

[0028] Such as figure 1 A method for manufacturing a high-aspect-ratio step backdrill includes the following steps:

[0029] A method for manufacturing a step back drill with a high aspect ratio, comprising the following steps:

[0030] Step 1. Make a through-hole positioning hole on the PCB, and then use a through-hole Pin nail to position in the through-hole positioning hole. The diameter of the through-hole Pin nail is 3.15mm minl;

[0031] Step 2: Drill the via hole 1 with a through-hole drill, the diameter of which is 8mil;

[0032] Step 3: Use the through-hole positioning hole as the positioning hole for the depth-controlled drilling, and use the depth-controlling drill to perform controlled-depth drilling to obtain the controlled-depth hole 2; the diameter of the depth-controlling drill is 8 minl larger than the diameter of the through-hole drill; the stub value is controlled at Between 6-12mil;

[0033] Step 4, electroplating Electroplate copper on the depth control...

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Abstract

The invention discloses a high-aspect-ratio stepped backdrilling method. The method comprises the following steps: 1, punching a through positioning hole in a PCB; 2, drilling a via hole by using a through hole drill bit, wherein the diameter of the through hole drill bit is b minl; 3, with the through positioning hole serving as a positioning hole for depth-controlled drilling, conducting depth-controlled drilling by using a depth-controlled drilling bit to obtain a depth-controlled hole; 4, conducting electroplating, namely electroplating and copper loading on the depth-controlled hole and the via hole to realize conduction between the depth-controlled hole and the via hole; 5, electroplating an outer-layer circuit and a pattern; 6, conducting backdrilling on a back face, wherein a hole obtained after mirroring of the through positioning hole serves as a backdrilling positioning hole during backdrilling, the backdrilling positioning hole is positioned by adopting a backdrilling Pin nail, and during backdrilling, the diameter of a backdrilling bit is the same as the diameter of the depth-controlled drilling bit; and 7, carrying out alkaline etching on a backdrilling hole. According to the method, the alignment deviation of stepped backdrilling can be reduced to 0-0.05 mil, the actually finished stub value is 2-6 mil, and a controlled depth meets requirements, so the requirement of a connecting component of a depth-controlled part is met.

Description

Technical field: [0001] The invention belongs to the field of PCB board manufacture, and in particular relates to a method for manufacturing a high aspect ratio stepped back drill. Background technique: [0002] Back-drilling is mainly to drill out the through-hole section that does not need to be conducted. Step back-drilling is mainly to do controlled depth drilling on the basis of the through-hole. The back-drilled holes with deep and large apertures can avoid signal "distortion" and are of great help to signal integrity. [0003] Now there is a normal back-drilling technology, the main control back-drilling depth and stub value control range is 2-12mil. The existing back drilling process is as follows: [0004] 1. Drill the normal via holes first. [0005] 2. Via plating is done normally. [0006] 3. Make the outer circuit normally, and expose the required back drilling part. [0007] 4. Do graphic electroplating and tin-plate the holes to protect the sections that ...

Claims

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Application Information

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IPC IPC(8): H05K3/00
CPCH05K3/0047
Inventor 韩启龙李军唐先渠刘禹琦
Owner AOSHIKANG TECH CO LTD
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