Printed circuit board maintenance method an system

A printed circuit board and repair station technology, applied in the field of printed circuit board repair methods and systems, can solve problems such as low efficiency, high cost, and poor reliability of PCBs, and achieve the goals of avoiding missed inspections, improving efficiency, and improving product quality Effect

Inactive Publication Date: 2017-11-21
王俊 +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] The purpose of the present invention is to provide a printed circuit board maintenance method and system, aiming at solving the problems in the prior art that the traditional PCB maintenance method has low efficiency, high cost and poor PCB reliability after maintenance

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  • Printed circuit board maintenance method an system
  • Printed circuit board maintenance method an system
  • Printed circuit board maintenance method an system

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Embodiment Construction

[0032] In order to make the object, technical solution and advantages of the present invention clearer, the present invention will be further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described here are only used to explain the present invention, not to limit the present invention.

[0033] It should be noted that when an element is referred to as being “fixed on” or “disposed on” another element, it may be directly on the other element or there may be an intervening element at the same time. When an element is referred to as being "connected to" another element, it can be directly connected to the other element or intervening elements may also be present.

[0034] In addition, it should be noted that the orientation terms such as left, right, up, and down in the embodiments of the present invention are only relative concepts or refer to the normal use state of the product, and...

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PUM

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Abstract

The invention provides a printed circuit board maintenance method and system, wherein the maintenance method includes the steps of inputting a standard pattern and parameters of a printed circuit board to an automatic optical detection scanning host; obtaining a scanning pattern of a printed circuit board to be maintained through the host; comparing the scanning pattern with the standard pattern and parameters to find out difference points and recording coordinates; performing amplification displaying on the difference point through maintenance station rechecking equipment to judge whether the printed circuit board to be maintained is qualified; if yes, transporting the printed circuit board to a board collecting area; if no, repairing the printed circuit board; then performing rechecking through the rechecking equipment to judge whether the printed circuit board is qualified; if yes, transporting the printed circuit board to the board collecting area, and ending maintenance; if no, repairing the printed circuit board again; and repeating rechecking and maintenance till the printed circuit board is qualified. The method and system realize detection and repair of the printed circuit board, saves manpower and reworking material cost, improves efficiency, improves product quality, and avoids problems of missing detection and reliability caused by manual checking and repair.

Description

technical field [0001] The invention relates to the field of printed circuit boards, in particular to a method and system for repairing printed circuit boards. Background technique [0002] The circuit production of traditional printed circuit boards first covers the board with a layer of photosensitive dry film or wet film, then aligns the graphics on the film on the board, and transfers the circuit graphics to the board by exposure Finally, chemical development is used to develop and remove the unexposed dry film (or wet film) to leak out of the copper surface, and the exposed dry film (or wet film) remains on the board surface as a resist layer. [0003] In the circuit production process, due to the influence of various factors, various defects will occur, such as dry film scratches, exposed copper, film breakage, film throwing and other problems. The circuit on the inner layer of the circuit board adopts an acidic negative etching process, and the dry film (or wet film)...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G01R31/28G01R31/309B07C5/34
CPCB07C5/34G01R31/2801G01R31/309H05K2203/162
Inventor 管术春王俊
Owner 王俊
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