15results about How to "Avoid reliability" patented technology

The application discloses a gallium oxide vertical device and a preparation method thereof. The gallium oxide vertical device comprises an epitaxial structure, a cathode and an anode matched with the epitaxial structure, the epitaxial structure comprises a heavily doped n-type Ga2O3 substrate, a lightly doped n-type Ga2O3 drift region, an interlayer and a p-type nitride epitaxial layer which are sequentially stacked, the lightly doped n-type Ga2O3 drift region, the interlayer and the p-type nitride epitaxial layer form a p-i-n structure, the cathode forms an ohmic contact with the heavily doped n-type Ga2O3 substrate, and the anode forms an ohmic contact with the p-type nitride epitaxial layer, wherein the material of the interlayer is an Al-containing compound, and the surface layer region of the lightly doped n-type Ga2O3 drift region close to the interlayer also has Al elements, the Al elements are diffused into the lightly doped n-type Ga2O3 drift region in the bonding process under high pressure.

This invention provides a gear power transmission device for a speed reducer, relating to the field of gear reducer technology. The device includes a speed reducer body and an intelligent monitoring and self-cleaning system mounted on a base plate. This invention, through real-time monitoring of multiple parameters such as oil viscosity, abrasive particle concentration, and morphology, can accurately capture early anomalies and effectively distinguish wear types. After diagnosing anomalies, it can automatically purify the lubricating oil online, removing harmful abrasive particles without stopping the machine, effectively extending the lifespan of the oil and equipment. The highly integrated multi-functional modules within a unified detection box result in a compact structure, improving the overall reliability of the system and avoiding the looseness and unreliability issues of external structures in harsh industrial environments, thus enhancing the intelligence level of fault diagnosis. The introduction of machine learning-based automatic particle morphology recognition technology replaces offline analysis relying on professionals, lowering the technical threshold and making fault diagnosis more intuitive and efficient.

The utility model relates to a kind of bush type air expansion shaft, comprising: always fill air expansion shaft;Bushing expansion piece is set in the large diameter end of the always fill air expansion shaft, and its outer ring is polygonal structure;And reel is set in the outside of the bushing expansion piece and is lifted inner wall by the edge of the polygonal structure when the bushing expansion piece tightens.Compared with prior art, the utility model has the advantages of preventing reel slip, improving winding stability, improving product yield, etc.

This application provides a laser semiconductor chip packaging structure, packaging method, and electronic device, relating to the field of packaging technology. In this packaging structure, a first substrate has through-holes; the height of the laser semiconductor chip and leads disposed in the through-holes of the first substrate and on a second substrate does not exceed the upper surface of the first substrate; the through-holes of the first substrate are filled with optical adhesive. The space formed in the through-holes of the first substrate accommodates the laser semiconductor chip and leads. Since the highest point of the leads remains below the upper surface of the substrate after wire bonding, it does not affect screen printing, component mounting, and reflow soldering. Therefore, wire bonding can be performed before reflow soldering, thereby avoiding the influence of flux residue after reflow soldering on the wire bonding process.

This invention relates to the field of data processing technology for predictive purposes, and discloses a method for adjusting the power generation performance of an energy system throughout its entire life cycle. The method determines the parameter boundaries of a wind-solar-storage power supply system, divides the entire life cycle planning period into multiple consecutive life stages, and determines the load demand input for the entire life cycle. It sets a baseline power generation performance at the initial commissioning stage, calculates the degradation maintenance level for each stage, establishes a monotonic mapping relationship between the degradation maintenance level and maintenance intensity, constructs a stage-dependent model for calculating available power generation capacity coupled with degradation and maintenance, and obtains available power supply capacity parameters for each stage of the entire life cycle. It generates a maintenance time series distribution through Monte Carlo simulation and constructs a set of life cycle power generation performance evolution scenarios. With the goal of minimizing the total cost throughout the entire life cycle, a mixed-integer linear programming model is constructed to obtain the optimal capacity configuration and adjust the power generation performance throughout the entire life cycle. This method solves the problems of ignoring degradation maintenance and inaccurate planning, achieving the goal of accurate and reliable life cycle data at a low cost.

The invention discloses a TSV solid-phase hole filling interconnection method and structure, and relates to the technical field of semiconductor packaging. The TSV solid-phase hole-filling interconnection method comprises the steps of S1, silicon through hole etching and deposition, S2, copper column insertion and fixation, S3, surface treatment and interconnection construction and S4, electrical testing and process feedback, a complex electroplating production line is abandoned, the through holes are filled through plastic deformation of the solid copper columns, the inherent hole and seam problems of an electroplating method are avoided, and the TSV solid-phase hole-filling interconnection method is suitable for large-scale production. The high-purity solid copper columns are high in mechanical strength and are tightly and mechanically interlocked with the inner walls of the through holes through plastic deformation, and the anti-fatigue capacity of the interconnection structure under the thermal cycle load is improved by combining the insulating layer and the barrier layer, so that reliable vertical interconnection is obtained, thermal expansion coefficient mismatch of copper and silicon is effectively avoided, and the reliability of the interconnection structure is improved. Stress is generated on the interface in the electroplating process and the subsequent thermal cycle.

The invention discloses a credit survey report generation method based on an improved prompt chain. The method comprises the following steps: firstly, decomposing a plurality of chapter writing tasks with specific rules and corresponding material extraction tasks according to an instruction; then, intelligently judging whether an available material refining text exists in a second database by querying state identifiers (a state I, a state II and a state III): directly binding and using existing (state I) or doubted (state III) materials, and calling a large language model to generate and update the database in real time for missing (state II) materials; and finally, fusing the refined text of each material with the chapter rule to form a cue word, generating the content of each chapter by using the large language model again, and integrating into a complete credit survey report. According to the method, through dynamic material management and multi-round prompt optimization, the accuracy and efficiency of report generation are remarkably improved.

The invention relates to the technical field of photovoltaic, in particular to a photovoltaic module, a preparation method thereof and manufacturing equipment of the photovoltaic module, the photovoltaic module comprises a back contact battery piece, an insulating strip, a conductive piece and an electric connecting piece, the back contact battery piece comprises a first surface, and the first surface is provided with a fine grid extending along a first direction; the insulating strips are arranged on the first surface at intervals in the first direction, the insulating strips cover part of structures of the fine grids, at least part of structures of the conductive pieces are located in gaps between the adjacent insulating strips, the conductive pieces are electrically connected with the fine grids, and the electric connecting pieces comprise first connecting parts and second connecting parts connected to the two ends of the first connecting parts in the first direction. The two second connecting parts are in lap joint with the two adjacent insulating strips respectively, and the first connecting parts are electrically connected with the conductive pieces. According to the design, the quality and reliability of the photovoltaic module are improved, the preparation difficulty of the photovoltaic module is reduced, and the preparation efficiency of the photovoltaic module is improved.

This invention provides a hybrid bonding structure and bonding method based on an interlocking structure. The hybrid bonding structure includes: a first chip to be bonded, having a silicon oxide layer and a first connector protruding from the silicon oxide layer; and a second chip to be bonded, having a polyimide layer, a recess within the polyimide layer, and a second connector at the bottom of the recess. The surface of the second connector is provided with a first adhesive layer. The materials of the first and second connectors include copper and / or aluminum. The first and second chips to be bonded are configured such that: before bonding, the height difference of the first connector protruding from the oxide layer is greater than the height difference between the top surface of the first adhesive layer and the top surface of the silicon oxide layer; after bonding, the silicon oxide layer and the polyimide layer are connected, and the first connector extends into the recess and is connected to the second connector using the first adhesive layer, thus forming an interlocking structure. This invention is used to optimize the performance of the hybrid bonding process and bonding structure.

The application discloses a heat work driving type refrigeration system with heat and mechanical compression in parallel and multiple heat recovery and a method thereof; an evaporator is sequentially connected with a first-stage compressor and a heat recovery device; the heat recovery device is connected with a gas-liquid separator and an absorber; the gas-liquid separator is connected with a second-stage compressor, the heat recovery device and a condenser; the condenser is connected with a first throttling valve and the gas-liquid separator; the condenser is connected with the gas-liquid separator, a second throttling valve and the evaporator; the absorber is connected with a solution pump, a heat recovery cycle side of the heat recovery device and a generator; one side of the generator is sequentially connected with a third throttling valve of the heat recovery cycle side of the heat recovery device and the absorber, and the other side of the generator is connected with the heat recovery device and the condenser. In the system, the heat and mechanical compressors have parallel connection characteristics at a high-pressure stage, and are connected in series at a low-pressure stage, and the exhaust heat of three compression processes is compactly recovered and utilized in heat compression through a multiple flow heat recovery device, so that the heat consumption is significantly reduced and the matching of the system with a small and medium-sized heat source is improved.

The application discloses a kind of probe card space converters and temperature control method in the technical field of semiconductor, wafer testing system, to solve the problem of probe card thermal expansion compensation in prior art depends on inaccurate experience data, difficult to adapt to multi-temperature test requirements, resulting in low test accuracy and poor probe card versatility.It includes ceramic substrate;Heating module is integrated in the inside of the ceramic substrate, for raising the temperature of the ceramic substrate according to control signal;Cooling module is integrated in the inside of the ceramic substrate, for reducing the temperature of the ceramic substrate according to control signal;And, temperature monitoring module is integrated on the ceramic substrate, for real-time monitoring the temperature of the ceramic substrate and feedback to external controller;The application in the application process of actual chip testing, through program temperature control, realize the good matching of probe position and wafer test pin in a certain range.

The utility model belongs to the technical field of kitchen appliances, and discloses a food processor which comprises a cup body, a cup cover and a smashing device, the cup cover comprises an inner cover with an installation hole, an outer cover, a float valve and a push plate, the push plate is provided with a lock pin, the float valve comprises a valve body and a sealing ring, and a pressure relief channel communicated with the outside is arranged in the valve body. The bottom wall of the valve body is provided with a pressure relief hole for communicating the pulping cavity with the pressure relief channel, the float valve further comprises a pressure relief valve movably arranged in the pressure relief channel, and the pressure relief valve is pressed on the bottom wall of the valve body to seal the pressure relief hole; in the first state, the valve body ascends to lock the push plate, so that the cup cover is locked relative to the cup body, and the pressure relief valve seals the pressure relief hole; and in the second state, the valve body keeps locking the push plate, and the pressure relief valve moves relative to the valve body until the pressure relief hole is opened. The pressure relief valve and the float valve are integrated, the structure is simple, the high-pressure braising function of the food processor is expanded, and potential safety hazards caused by too high pressure in the cup are avoided through the pressure relief valve.

This application provides a method and system for electromagnetic transient modeling and verification of an energy storage power station, relating to the technical field of model verification. The method includes: during modeling, constructing an electromagnetic transient digital model of the energy storage power station containing a detailed switching model and an average value converter model; calculating the consistency deviation by applying the same disturbance signal to both models and collecting dynamic response data; during simulation, if the consistency deviation is less than a preset threshold, locking the model, performing simulation calculations under specified operating conditions to obtain model simulation data, and acquiring corresponding benchmark data; during verification, performing time-series synchronization processing on the model simulation data and benchmark data, calculating the verification error, and generating a verification pass signal if it is less than a preset error threshold. This application can improve the accuracy or reliability of verification results.

The invention discloses an electromagnetic pump performance test device and a test method thereof, and belongs to the technical field of electromagnetic pump test design, the electromagnetic pump performance test device comprises an electromagnetic pump, the electromagnetic pump is arranged on a test bench, an iron core is arranged in an inner cavity of the electromagnetic pump, an annular pump groove is formed between the inner cavity of the electromagnetic pump and the iron core, and a winding coil is arranged on the electromagnetic pump and located on the outer side of the pump groove. A test tube axially arranged in the electromagnetic pump is arranged in the pump groove in a penetrating mode, a force measuring assembly is arranged at one end of the test tube, and a temperature measuring assembly is arranged outside the test tube and located in the electromagnetic pump. In the scheme, the winding coil is electrified to generate a magnetic field, the test tube simulates the actual axial force and temperature of liquid metal in the electromagnetic pump in the pump groove of the electromagnetic pump, the axial force of the test tube is measured through the force measurement assembly, and the temperature of the test tube is detected through the temperature measurement assembly. Therefore, the performance of the electromagnetic pump under different conditions is simulated, the test accuracy is improved, and the method has guiding significance for the design of the electromagnetic pump.

The utility model discloses a kind of semiconductor discrete devices, it is related to semiconductor discrete device technical field, including device substrate, buffer layer, device source, device drain, channel assembly, gate layer, ohmic electrode layer, electrode cap and pin assembly, device substrate adopts high-purity single crystal silicon, top epitaxial gallium nitride film, the high and low doping silicon carbide layer of combination channel assembly, heat generation is controlled from bottom layer, electrode cap adopts copper material, pin assembly is mechanically interlocked with electrode cap by fitting structure, cooperate installation slot opening heat-conducting material, connecting pin recess filling solder and air cavity design, shorten heat conduction path, strengthen heat conduction and radiation, the device is synergized through multilayer heat conduction path and multiple heat dissipation mode, effectively improve overall heat dissipation performance, avoid the problem such as the increase of on-resistance caused by excessively high temperature, reliability decline, ensure that device maintains good performance in work.