The invention provides a
hybrid bonding structure and bonding method based on an
interlocking structure, and the structure comprises a first
chip to be bonded, which is provided with a
silicon oxide layer and a first connecting piece protruding out of the
silicon oxide layer; the second
chip to be bonded is provided with a
polyimide layer, a recess arranged in the
polyimide layer and a second connecting piece arranged at the bottom of the recess, the surface of the second connecting piece is provided with a first adhesion layer, and the first connecting piece and the second connecting piece are made of
copper and / or aluminum; the first
chip to be bonded and the second chip to be bonded are configured as follows: before bonding, the
height difference of the first connecting piece protruding out of the
oxide layer is greater than the
height difference of the top surface of the first adhesion layer and the top surface of the
silicon oxide layer; the
silicon oxide layer is connected with the
polyimide layer, and the first connecting piece extends into the recess and is connected with the second connecting piece through the first adhesion layer to form an
interlocking structure. The method is used for optimizing the performance of the
hybrid bonding process and the bonding structure.