173results about How to "Avoid circuit breaking" patented technology

The invention relates to a mixed bonding structure for three-dimension integration and a bonding method for the mixed bonding structure. The mixed bonding structure for the three-dimension integration comprises a first substrate. The first substrate is provided with bonding interconnection metal electrically connected with the first substrate; the other end part of the bonding interconnection metal, which is correspondingly connected with the first substrate, is sunk to form a cavity; a first dielectric adhesion layer covers at the periphery of the bonding interconnection metal on the first substrate; the bonding interconnection metal is encircled by the first dielectric adhesion layer; and the first dielectric adhesion layer is lower than the edge of the bonding interconnection metal. According to the mixed bonding structure for the three-dimension integration, the first dielectric adhesion layer is lower than the edge of the top part of a salient point, and when bonding is performed under the pressure action, the edge of the top part of the salient point is bonded with a pad of a second substrate, and thereby, the dielectric adhesion layer can be stopped entering the surface of the bonding interconnection metal, which is bonded with the pad, and the open circuit problem and the reliability problem can be avoided. The mixed bonding structure for the three-dimension integration is compact in structure and is convenient in process operation.

The invention provides a display device, an array substrate and a driving method thereof. Sub pixels from a first to a sixth in a each pixel unit in the array substrate are arranged in a two-row three-column mode; a first gate line in each gate line group is connected with the first sub pixel and the third sub pixel; a second gate line is connected with the second sub pixel and the fourth sub pixel; a third gate line is connected with the fifth sub pixel and the sixth sub pixel; a first data line in a first sub data line group is connected with the first sub pixel, the fourth sub pixel and the fifth sub pixel; and a second data line is connected with the second sub pixel, the third sub pixel and the sixth sub pixel. In comparison with the prior art, one data line is reduced for each three columns of sub pixels, the arrangement density of the data lines in a transition region can thus be reduced, and short circuit or broken circuit of the data lines can be avoided.

The invention discloses a novel pogo pin. The novel pogo pin comprises multiple insulated and concentric contact needles. Each contact needle corresponds to a needle tube matched with the contact needle, a tension spring is connected between each contact needle and the needle tube corresponding to the contact needle, and each contact needle can move in a telescopic mode in the axial direction of the corresponding needle tube. The needle tube corresponding to each contact needle is fixedly and electrically connected with a corresponding circuit, and each contact needle is elastically connected with a corresponding conductive terminal. By the adoption of the scheme, the contact needles can move in the telescopic mode along the corresponding needle tubes, it can be guaranteed that the contact needles stably make contact with contacts in the using process, and open circuits are avoided. It can be guaranteed that first contact needles and the second contact needles are independently separated through insulating bushes, and short circuits are avoided. Each contact needle is of a columnar boss structure with the front portion narrower than the rear portion, the contact needles and the needle tubes are easy to install in the assembly process, production efficiency is high, and no additional buckle structure is needed for fixation.

The invention discloses a method for notifying downstream equipment when switching the uplink status, comprising: configuring a tracking command in the uplink equipment of a route redundant backup system according to existing technology; binding the primary equipment of the route redundant backup system and the core router link as an uplink via the tracking command; binding the primary equipment and a standby equipment link as a downlink via the tracking command. By using the method for notifying downstream equipment when switching the uplink status provided by the invention, when error occurs in the upstream equipment or malfunction occurs in the upstream equipment link, the route redundant backup system can detect the status of the upstream equipment, in order to correctly configure the equipment according to VRRP to realize the primary-standby switching; thus, the open circuit error of the access layer equipment caused by error occurred in the uplink equipment can be prevented, and the anti-error ability of the route redundant backup system in actual network can be enhanced.

The invention discloses a battery pack, comprising a plurality of parallel branches formed by connecting a plurality of battery units in parallel. The corresponding battery units between the parallel branches are serially connected into a plurality of serial branches, each serial branch is respectively connected with an output terminal through an independent conductor, or each serial branch is connected with a current collector with uniform current density. Compared with the prior art, current on each serial branch can not accumulate on collecting bars of the parallel branches, and the the current density of each part of output part circuits is the same, thereby avoiding that performances of the battery pack are affected because the circuits are damaged by local overlarge current density of the collecting bars under the condition of heavy current.

The invention discloses a method and device for guaranteeing reliable operation for Ethernet ring. Main node is restarted by following steps: main node of Ethernet ring network acquires network state before restarting and network configuration information after restarting; the main node blocks the data relay function of control VLAN of self ring port and protection service VLAN, adds the ring port in control VLAN and protection service VLAN; the ring port comprises main port and slave port; data relay function is opened for control VLAN of ring port; the link state is detected for validating entirety; protection service VLAN data relay function of ring port or main port is opened according to the detection result; other node is notified to update MAC address list. The inventive method effectively guarantees normal and reliable operation of Ethernet Ring network.

The invention discloses a tamper switch and a financial machine, and aims to provide the tamper switch which can prevent drilling attack and is safe. The tamper switch comprises a circuit board and a conductive adhesive, wherein an inner ring, an intermediate ring surrounding the inner ring and an outer ring surrounding the intermediate ring are arranged on the circuit board; the intermediate ring consists of a plurality of bonding pads which are separated and are paired; each pair of bonding pads form a group of signal switch; the conductive adhesive comprises an inner conductive layer pressed on the inner ring, an intermediate conductive layer pressed on the intermediate ring and an outer conductive layer pressed on the outer ring; and the intermediate conductive layer is separated into a plurality of intermediate conductive layers and are pressed on each group of the signal switch one by one. The temper switch can be used for financial industries, such as banks and securities, needing to encrypt data, and used for protecting sensitive information such as the account, the currency amount and password of clients.

The invention discloses a normal-temperature cured conductive adhesive and a process method thereof for connecting rechargeable battery packs. The conductive adhesive is used for communicating rechargeable battery pack electrodes and reinforcing battery packs, and then the rechargeable battery pack electrodes and the battery packs can endure vibration and impact under use conditions. The normal-temperature cured conductive adhesive comprises an epoxy resin, an epoxy diluent, an epoxy curing agent, silicone aids and 30-90% by mass of silver powder of which D50 is greater than 7mu m. When being applied to connection and reinforcement of battery cathodes, the normal-temperature cured conductive adhesive disclosed by the invention can be called as a 'cathode cold welding' process, both the welding reliability of hot welding is maintained, and no external heat is needed in the welding process, direct damage or hidden damage of battery structures is avoided, and thus the properties of conductors are not affected by external heat.

The invention discloses an air conditioning system control method. The method comprises the steps that when an air conditioner executes a preset air conditioner working scheme, the real-time electric current of an air conditioner setting position is obtained; the real-time electric current is compared with a preset total electric current safety threshold value of the air conditioner setting position; and if the real-time electric current exceeds the preset total electric current safety threshold value, corresponding control over the air conditioner is conducted in combination with the type of the air conditioner executing the air conditioner working scheme. The invention further discloses an air conditioning system control device, a computer readable storage medium and an air conditioning system. By controlling the working air conditioner of the air conditioning system, the electric current of the air conditioner setting position does not exceed the rated current of a breaker, and outrage is prevented.

The invention relates to a high-temperature fused salt battery which comprises a positive pole, pasty dual electrolyte and a negative pole, wherein the positive pole is exposed in air, the pasty dualelectrolyte is prepared from fused salt and solid electrolyte powder by mixing, the fused salt is potassium carbonate and/or sodium carbonate, the solid electrolyte powder is zirconium oxide micron powder containing yttrium oxide, and the negative pole is separated from the positive pole by the pasty dual electrolyte. The high-temperature fused salt battery disclosed by the invention is a high-temperature fused salt battery which can be applied to large-scale power grid energy storage and is based on the fused salt and the solid electrolyte powder material. The pasty dual electrolyte disclosedby the invention can be easily prepared from the fused salt and the solid electrolyte powder through direct mixing, so that the pasty dual electrolyte has the advantages of higher oxygen ion conductivity, lower fluidity and good filling ability; furthermore, the short circuit and open circuit phenomena between the positive pole and the negative pole of the battery are effectively avoided, circular charge-discharge property of the battery is remarkably improved, and the processing manufacturing cost of the high-temperature fused salt battery is obviously reduced.

The invention relates to a composite membrane for a lithium sulphur battery and a preparation method thereof. The composite membrane is prepared from a polypropylene diaphragm, a polyethylene diaphragm, or a polypropylene-polyethylene composite diaphragm and silane lithium imide through hydrolytic polycondensation, the silane lithium imide accounts for 0.1-10wt% of the composite membrane. The composite membrane has better liquid protecting performance, prevents circuit break of the battery in use due to the dry diaphragm, can inhibit generation of cathode lithium dendritic crystals, and has better conductivity; and the preparation method is simple and feasible, the raw materials are easy to obtain, the preparation process for modified membranes is simple and practical and is beneficial to industrial production.

The method comprises: in the first, providing an insulated baseboard; etching a groove of circuit on the insulated baseboard; filling in a first colloid in the groove of circuit used for generating bridge-erecting action with the insulated colloid; finally, filling in a second colloid capable of generating chemical reaction with the first colloid to form a wire colloid in the groove of circuit.

The invention discloses a film pasting device with a cleaning function for display screen processing, and relates to the technical field of display screen processing. The film pasting device specifically comprises a conveying belt and a defoaming scraper assembly, wherein a limiting groove is formed in the surface of the conveying belt, sliding frames are arranged on the two sides of the conveying belt, the bottom of an electric lifting rod is connected with a pressing frame plate, sliding grooves are formed in the two sides of the inner wall of the pressing frame plate, sliding film winding reels are arranged on the left sides of the interiors of the sliding frames, and micro push rods are fixed on the two sides of the outer wall of the pressing frame plate. According to the film pasting device with the cleaning function for display screen processing, a main scraper piece, an auxiliary scraper piece and a spring auxiliary scraper piece are arranged in a combined mode, the film pasting device can be self-adaptive to sizes of different angles through the cooperation of a strong torsion spring and a spring, so that the film pasting device can be always comprehensively attached to the surface of a display screen body to complete the defoaming operation, and compared with a mode that at least two kinds of scrapers are needed for operation on the market, the conflict between the scrapers can be prevented.

The invention discloses a composite conductive structure which comprises a first substrate and a first conductive layer. The first conductive layer is arranged on the first substrate, and the first conductive layer comprises a crystalline-state conductive film and a non-crystalline-state conductive film. The invention further discloses a manufacturing method of the composite conductive structure and a display and touch panel with the composite conductive structure. The composite conductive structure and the manufacturing method of the composite conductive structure can improve the situation that after the conductive layer is bent, disconnection is prone to occurring. Moreover, a display device manufactured by the application of the conductive layer can avoid the problem that circuit disconnection occurs after the conductive layer is bent or driving resistance becomes larger, and the durability and sensitivity of the display device are both expected to be improved.

The invention discloses a pin wiring structure of a card insertion end of a flexible printed circuit board, which comprises a substrate, a first conductive layer, a second conductive layer and a plurality of conducted elements, wherein the first and second conductive layers are arranged on the two surfaces of the substrate respectively; the first conductive layer is provided with a plurality of first wires; the second conductive layer is provided with a plurality of second wires; the first wires electrically extend a plurality of first pins and are provided with a plurality of second pins in different positions from the first pins; the second wires are correspondingly extended to the corresponding positions of the second pins; and the conducted elements are electrically communicated to thesecond pins and the second wires respectively so that the second pins, the first wires and the first pins are in a non-contacted off state to form the card insertion end of the flexible printed circuit board with two layers of wires.

The invention provides an array substrate, a method for manufacturing the same and a display device. The array substrate comprises a substrate and a plurality of electrode structures. The electrode structures are arranged on the upper side of the substrate and comprise body electrodes and substrate electrodes, the body electrodes are made of metal materials, and the substrate electrodes are made of transparent metal oxide materials; the substrate electrodes are positioned under the body electrodes and are partially or completely overlapped with the body electrodes in orthographic projection directions; the substrate electrodes are electrically connected with the body electrodes. The array substrate, the method and the display device have the advantages that the substrate electrodes are arranged under the body electrodes (such as metal lines, source electrodes, drain electrodes, standby electrodes and signal input electrodes) made of the metal materials, so that the body electrodes can be in close contact with a gate insulation layer or active layers, small notches cannot be easily formed inside the body electrodes, open circuit of the body electrodes can be prevented, and the quality of the array substrate can be guaranteed; the display quality of the display device with the array substrate further can be guaranteed.

The invention discloses a thin film transistor liquid crystal display, comprising a cover plate, an upper polaroid, a first substrate, a second substrate, and an IC chip. The upper polaroid is arranged on the lower surface of the cover plate. The first substrate is arranged on the lower surface of the upper polaroid. The edge of one end of the first substrate is provided with a connection terminal. The IC chip is arranged on the first substrate close to the connection terminal. The second substrate is arranged on the lower surface of the first substrate. The thin film transistor liquid crystal display can enhance strength of the connection terminal, and prevents blank screen and broken screen caused by impacting the display.

The invention relates to a formation method of a semiconductor structure. The formation method comprises that a substrate is provided; a first dielectric layer is formed at the surface of the substrate, a sacrifice layer is formed in the first dielectric layer, and the surface of the sacrifice layer is leveled with the surface of the first dielectric layer; parts of the sacrifice layer and first dielectric layer are etched till the surface of the substrate is exposed, a first through hole is formed in the first dielectric layer; the residual sacrifice layer is removed, and an extension opening is formed in the first dielectric layer and communicates with the first through hole; a first conductive plug is formed in the first through hole and the extension opening; and a first conductive layer is formed at the surfaces of the first conductive plug and the first dielectric layer. The formed semiconductor structure is stable in electrical property and higher in reliability.