382results about How to "Improve plating efficiency" patented technology

The invention discloses an electroplated diamond wire saw sand-applying device. The device sequentially comprises the components, from top to bottom: a vertical tubular sand-applying sub tank, a liquid-returning box, and a plating solution master tank. A guide wheel is fixed in the liquid-returning box. A core wire is sequentially wound on a wire-feeding conductive wheel on the bottom of the vertical tubular sand-applying sub tank and the guide wheel. The core wire then penetrates the vertical tubular sand-applying sub tank, and is finally wound on a wire-discharging conductive wheel on the top of the vertical tubular sand-applying sub tank. The wire-feeding conductive wheel and the wire-discharging conductive wheel are connected in parallel, and are then connected to the negative electrode of an electroplating power supply. Metal anodes are arranged around the core wire in the vertical tubular sand-applying sub tank. The metal anodes are connected with positive electrodes of the electroplating power supply. Through a water pump above the plating solution, the plating solution is lifted from the plating solution master tank into the vertical tubular sand-applying sub tank. With the device provided by the invention, sand-application of produced diamond wire is uniform and good. During the production process, current density is high, efficiency is high, internal stresses of the plating and the substrate are small, plating solution application amount is low, and wire breakage probability is low.

The invention discloses a preparation method for a super-hydrophobic metal surface. The method comprises the following steps: constructing a micrometer structure on the surface of a frequently used engineering material (such as copper, iron, stainless steel, nickel, aluminum, an aluminum alloy and a high-molecular section covering the above-mentioned metal through chemical plating) by using an electrocoppering process; then constructing a nanometer structure by using a chemical silvering process; and carrying out modification with low-surface energy substances like octadecanethiol so as to obtain excellent and stable super-hydrophobicity. The method has a wide application scope and can be used on pure metal, alloys and metalized high-molecular sections; an obtained surface has stable and reliable surface performance, strong film-substrate bonding force and good corrosion resistance, especially good acid resistance, can be extensively applied in fields like self-cleaning, water prevention and dehumidification, corrosion prevention, fluid drag reduction, frost prevention and condensation and heat exchange, and has an industrialization value.

The invention provides an electroplating device for a printed circuit board. The electroplating device comprises a plating tank the middle part of which is used for passing through of the printed circuit board, one or more anode plates arranged at any one side or two sides of the printed circuit board, and nozzles which are arranged in the planting tank and are opened towards the printed circuit board, wherein through holes penetrating through along the thickness direction thereof are formed in the anode plate; the nozzles are fixedly arranged on the anode plate; and the openings of the nozzles are matched with the through holes. Compared with the prior art, on the premise of not changing the distance between the nozzles and the printed circuit board, the distance between the printed circuit board serving as a cathode and the anode plate is greatly shortened to 2-3cm, on the one hand, the thickness uniformity of a surface electroplated coating of the printed circuit board is effectively improved, and on the other hand, the electroplating efficiency is greatly enhanced, and the energy consumption is lowered.

The invention discloses a copper plating tank. The copper plating tank comprises a tank body, a spraying pipe array arranged in the tank body, anode hangers and an anode array, wherein the tank body is used for accommodating an electroplating solution and consists of a U-shaped tank body unit or a plurality of the U-shaped tank body units connected in sequence; the spraying pipe array is provided with a plurality of spraying pipes arranged side by side, a plurality of spray nozzles for spraying a plating solution are arranged on the front surface of each of the spraying pipes in the height directions of the spraying pipes, and shielding grooves are formed in two side edges of the spraying pipes; the anode hangers are used for supplying anode currents and comprise conductive flat plates arranged in the length direction of the U-shaped tank body unit; the anode array is provided with a plurality of anode monomers, anode strips immersed in the electroplating solution are arranged at the lower parts of the anode monomers, and the left lateral edges and the right lateral edges of the anode strips are inserted into shielding grooves between every two adjacent spraying pipes. According to the copper plating tank disclosed by the invention, the distribution of electric power lines in the plating solution can be effectively improved, so that an edge effect is eliminated; the electric currents which do not exceed the upper limit of current density can also be effectively supplied, so that the uniformity of a copper layer is improved, and the electroplating efficiency is improved; the copper plating tank is suitable for various printed circuit boards such as a back board, a base board, and a flexible board .

The invention discloses a use method of a tooling for simultaneously electroplating the inner and outer surfaces of a hydraulic oil cylinder. The use method comprises the following steps: first, a conducting column is put in the cylinder body of the hydraulic oil cylinder, and a bolt arranged on the lower end surface of the conducting column penetrates through a valve hole formed in the cylinder bottom of the hydraulic oil cylinder; then, an external thread ring sleeve is connected with an internal thread formed on the cylinder mouth of the hydraulic oil cylinder, and an insulating sleeve is connected onto the bolt; and finally, a lifting hook is hung on a cathode bar of an electroplating bath, the cylinder body of the hydraulic oil cylinder is placed in the electroplating bath, and the conducting column is connected with the anode of the electroplating bath through a lead wire. The use method disclosed by the invention has the advantages that a conventional process for electroplating a hydraulic oil cylinder with a copper-tin alloy is changed, so that the hydraulic oil cylinder machining frequency and transfer frequency can be reduced, the hydraulic oil cylinder can be electroplated with the copper-tin alloy through one-step operation in an electroplating production line, the hydraulic oil cylinder electroplating efficiency and transfer efficiency can be improved by 50% or above, and the production cost can be reduced by about 30%; and meanwhile, the defect that the valve hole formed in the cylinder bottom of the hydraulic oil cylinder cannot be electroplated with the copper-tin alloy is overcome, and the product service life is prolonged.

The conductive member has a stable contact resistance, resists peeling, displays a low insertion/removal force and is stable when used as a connector, and has an excellent fusing characteristic when used as a fuse. A Cu-Sn intermetallic compound layer (4) is formed between a Ni-based underlayer (3) formed on a Cu-based base material (1), and a Sn-based surface layer (5) that forms the surface. In addition, the Cu-Sn intermetallic compound layer (4) comprises a Cu3Sn layer (6) disposed on the Ni-based underlayer (3) and a Cu6Sn5 layer (7) that is disposed on the Cu3Sn layer (6). The surface roughness of the contact face between the Sn-based surface layer (5) and the Cu-Sn intermetallic compound layer (4) combining the Cu3Sn layer (6) and Cu6Sn5 layer (7) has an arithmetic mean roughness Ra of 0.05-0.25 [mu]m, and the maximum valley depth Rv of the roughness curve is 0.05-1.00 [mu]m. Furthermore, the Cu3Sn layer covers the Ni-based underlayer with a surface coverage of 60-100%.

The present invention relates to compositions and methods employing postnatal (e.g., adult) neural crest stem cells. The stem cells are multipotent and differentiate when transplanted in vivo. Transplantation methods are provided for therapeutic, diagnostic, and research applications.

The invention discloses a barrel-plating device and a barrel-plating system. The barrel-plating device comprises a first tank, a barrel-plating barrel and a circulating device. The first tank is provided with an inner cavity. The barrel-plating barrel is rotationally arranged in the inner cavity of the first tank, a feeding opening and a discharging opening are formed in the two side end faces in the axial direction of the barrel-plating barrel, and overflow holes located below the feeding opening and the discharging opening are formed in at least one end face. One end of the circulating device is connected to the overflow holes, the other end of the circulating device is located in the barrel-plating barrel, and the circulating device is used for recycling and filtering electroplate liquid at the position higher than the overflow holes in the barrel-plating barrel through the overflow holes and inputting the filtered electroplate liquid into the barrel-plating barrel again. The barrel-plating system comprises at least two above barrel-plating devices. The circulating device can recycle and filter matter floating on the surface of the electroplate liquid, the filtered electroplate liquid is input into the barrel-plating barrel again, so that the circulating mode of the electroplate liquid is formed, it is guaranteed that few impurities are contained in the electroplate liquid in the barrel-plating barrel, the electroplating quality of plated workpieces is improved, and the plated workpieces can be continuously electroplated.

The invention provides an electroplating clamp of a solar cell. The electroplating clamp of the solar cell, provided by the invention, comprises a first frame, a second frame and a plurality of magnets, wherein the first frame and the second frame are of a hollow shape, edge parts of the first frame and the second frame are in contact and clamp the cell; and the plurality of magnets are respectively symmetrically fixed on the first frame or second frame, and the first frame and the second frame are jointed by using a magnetic force. The electroplating clamp of the solar cell, provided by the invention, is capable of rapidly locating the cell, quick in assembly, and continuous in production, ensures that the cell is uniformly conducted, and is capable of reducing the breakage rate of the cell.

The invention discloses a collecting device for sheet type integrated circuit plating equipment. The collecting device comprises a base and further comprises a sorting frame assembly, a collecting box assembly, a stand and a collecting clamp assembly which are arranged on the base; the collecting clamp assembly is arranged above the collecting box assembly; the front end and the rear end of the sorting frame assembly are respectively provided with a feeding hole and a temporary storage area, wherein the temporary storage area of the sorting frame assembly is arranged near the front end of the collecting box assembly and extends to the position below the collecting box assembly; the collecting clamp assembly comprises a horizontal guide rail mechanism, an adsorbing component and two clamping components, wherein the adsorbing component and the two clamping components can be arranged on the horizontal guide rail mechanism in a horizontal sliding way and a vertical lifting way; and the collecting box assembly comprises a collecting box mounting support, a collecting box and an auxiliary box, wherein the collecting box and the auxiliary box are arranged on the collecting box mounting support. The collecting device for the sheet type integrated circuit plating equipment can be used for collecting sheets automatically in the process of plating the sheets, thus the integral plating efficiency of the sheets can be improved effectively.

The invention provides a continuous metal electroplating method for carbon fiber tows. According to the method, after cleaning treatment by a surfactant solution, a carbon fiber is used as a cathode and plated metal is used as an anode for electroplating, and then cleaning, drying and tow winding are carried out. The continuous metal electroplating method provided by the invention has the advantages of high safety, good deoxidation effect, less investment, high convenience in operation and low operating cost.

The invention discloses a continuous composite plating sand overlying tank for a diamond cutting line. The continuous composite plating sand overlying tank comprises an electroplating bath body, a cathode roller, an anode rack, a sand loading tank and a wire guiding wheel, wherein the cathode roller is connected with the cathode of a power supply, and the anode rack is connected with the anode of the power supply; the cathode roller is arranged on the outer side of the electroplating bath body; a plating solution is filled in the electroplating bath body; diamond micro-powder is loaded by the sand loading tank; the anode rack, the sand loading tank and a cutting steel wire wound at the upper part and lower part of the cathode roller are submerged in the plating solution; the anode rack is fixed below the sand loading tank; the cutting steel wire below the cathode roller is buried in the diamond micro-powder. The composite plating sand overlying tank has the characteristics of high electroplating efficiency, high controllability on the length of the needed electroplating bath body and the plating quality, strong binding force of cutting line diamond with a base body, good heat-resisting and abrasion-resisting properties and high cutting efficiency.

The invention provides an adjustable fixed plate and a hanging fixture. The adjstable fixed plate comprises a main body, a conductive slide rod and a locking mechanism. The hanging fixture comprises the adjustable fixed plate. The main body is arranged on a conductive plate; the conductive slide rod is slidably arranged between the main body and the conductive plate; sliding clamping jaws are connected to one side of the condutive slide rod; and the locking mechanism is provided with an extrusion structure arranged between the main body and the conductive slide rod so as to tightly press the conductive slide rod onto the conductive plate. Acording to the adjustable fixed plate with the structure, the sliding clamping jaws can adapt to clamping circuit boards with different widths; the conductive slide rod is tightly pressed on the condutive plate through the extrusion structure, and the conductive slide rod is tightly pressed on the condutive plate through an extrusion way so as to bepositioned, so that the contact area of the extrusion structure and the conductive slide rod is large; and meanwhile, a pressing force acted on the conductive slide rod is stable, the condutive sliderod is positioned firmly through thelocking mechanism after sliding in place, and the conductive slide rod stably contacts the conductive plate so as to conduct electricity stably, so that the slidingclamping jaws can be ensured to conduct electricity stably.

The invention discloses a through hole electroplating and filling method and a preparation method of a printed circuit board. The through hole electroplating and filling method comprises the followingsteps: S1, carrying out reversing pulse electroplating on a to-be-plated substrate with a through hole by utilizing pulse electroplating liquid; and S2, carrying out hole filling treatment on the through hole treated in the step S1. Wherein the pulse electroplating solution contains metal ions to be plated, halogen ions and an accelerator, the accelerator comprises organic sulfonate, and the concentration c of the organic sulfonate meets the following relational expression: c is equal to or more than 1 ppm and less than 8 ppm; and the reversing pulse electroplating adopts PPR square wave current with at least one turn-off time, and the single turn-off time ranges from 20 ms to 80 ms. According to the scheme, the pulse electroplating liquid is combined with PPR electroplating to realize the situation that the electroplating efficiency in the middle of the hole is higher than that in a hole opening and surface copper in the electroplating process, so that protrusions exist on the surface of the copper in the hole, plating starting points are provided for hole filling lotion, and then electroplating hole filling is achieved.