19results about How to "Improve plating efficiency" patented technology

The utility model discloses a kind of electroplating nickel anode copper bar hydraulic pressure quick breaking locking device, it is related to power supply locking equipment technical field.The utility model includes clamp, clamp outside is equipped with clamping frame, two titanium blue copper bars are installed between clamping frame one end and clamp, and two rectifier copper bars are installed between another end and clamp, clamp one end is equipped with jack locking part, jack locking part is used to control the locking state of rectifier copper bar, titanium blue copper bar by clamp.The utility model is installed clamp between two groups of rectifier copper bar and titanium blue copper bar, clamping frame is installed outside in clamp middle part, lockable jack locking part is installed in clamp one end, the opening and closing of clamp is controlled by jack locking part, in turn, the clamping state of two groups of copper bar is controlled, artificial installation bolt is avoided, and electroplating efficiency is indirectly improved.

The utility model relates to a self-adaptive cathode conductive roller, and relates to the field of solar cell electroplating. According to the technical scheme, the device comprises an axis part which comprises an axis; the conductive sleeve part is located on the outer side of the axis part and comprises an axis ring arranged on the periphery of the axis in a sleeving mode and a conductive outer sleeve located on the outer side of the axis ring. Wherein the conductive outer sleeve is elastically connected with the axis ring through an elastic piece. Under the condition, the self-adaptive cathode conductive roller is dynamically and tightly attached to the upper surface of the solar cell silicon wafer through the gravity self-adaptive structure, so that the contact resistance of the self-adaptive cathode conductive roller and the solar cell silicon wafer is remarkably reduced, and the current conduction stability is improved; the problem of uneven coating thickness caused by poor contact in the traditional electroplating process is fundamentally solved, the mechanical stress concentration is effectively avoided, the hidden crack and fragment risk of the solar cell silicon wafer is greatly reduced, and the collaborative improvement of the electroplating efficiency, quality and cost control is realized.

This application relates to an electroplated reinforced hanger, comprising a main shaft and multiple annular bases vertically distributed along the main shaft. Multiple hook assemblies are arranged around the annular bases. Each hook assembly includes a support rod, an arc-shaped elastic element, and an S-shaped elastic element. The arc-shaped and S-shaped elastic elements are connected to the support rod, with the arc-shaped elastic element positioned above the S-shaped elastic element. The arc-shaped elastic element is configured to abut against the inner wall of the cylindrical material through inward radial elastic deformation, while the S-shaped elastic element is configured to bend upward and abut against the outer wall of the cylindrical material through outward radial elastic deformation. By incorporating the arc-shaped and S-shaped elastic elements, the arc-shaped elastic element abuts against the inner wall of the material with its toughness, while the S-shaped elastic element undergoes outward radial elastic deformation. Through bidirectional elastic clamping, the cylindrical material can be firmly fixed and will not fail due to slight differences in its diameter, effectively preventing the risk of detachment under severe liquid flow impact.

The utility model relates to the neodymium iron boron magnet surface electroplating technical field, concretely relates to a kind of magnet surface electroplating device for neodymium iron boron sintering, including bottom plate, electroplating bath, electric sliding rail, electric push rod, mounting plate, hanging material rack and neodymium iron boron magnet, the parallelism of multiple electroplating baths is provided in the top of bottom plate, electric sliding rail is also provided on bottom plate, the slider of electric sliding rail is equipped with electric push rod, the free end of electric push rod is connected with mounting plate, and mounting plate bottom is rotatably provided with hanging material rack, and hanging material rack is uniformly provided with hanging rod with the circumferential interval of its connection with mounting plate as center, and hanging rod is misalignedly provided with hanging hook, and neodymium iron boron magnet is hung on the hanging hook of hanging material rack.By the collaborative control of electric sliding rail and electric push rod, the automatic lifting, translation and multi-slot switching of neodymium iron boron magnet are realized, and thus the efficient electroplating operation to neodymium iron boron magnet is realized.

The utility model relates to the technical field of circuit board processing, in particular to a current adjusting device for circuit board electroplating, which comprises an electroplating box, a portal frame is mounted in the middle of the top of the electroplating box, an electric cylinder is mounted in the middle of the top of the portal frame, and the output end of the electric cylinder is fixedly mounted in the middle of the top of a transverse plate. A rotating shaft is rotatably mounted on the side, away from the anode, of the transverse plate, a clamping assembly is arranged at the bottom of the rotating shaft, a conductive slip ring connected with the cathode of the current regulator is mounted at the top of the rotating shaft, a stirring shaft is rotatably mounted on the other side of the transverse plate, and a plurality of stirring rods are mounted below the outer side wall of the stirring shaft. The electric cylinder drives the transverse plate to ascend, the U-shaped plate can be driven to ascend, the U-shaped plate drives a circuit board to ascend to leave electroplating liquid in the electroplating box, when a worker takes the circuit board, fingers do not need to stretch into the electroplating liquid, and harm to the fingers is reduced.

The application provides an electroplating device, comprising a plurality of electroplating units, a driving mechanism and a conveying mechanism; electrodes are distributed in the electroplating units; the driving mechanism is connected with each electroplating unit respectively, and is used for driving each electroplating unit to rotate and roll respectively, so that parts in the electroplating units tumble, to realize barrel plating; the plurality of electroplating units are installed on the conveying mechanism in sequence and at intervals, and the conveying mechanism is used for suspending each electroplating unit in an electroplating solution and driving each electroplating unit to move along a preset track, to realize hanging plating. Through the setting of the conveying mechanism and the driving mechanism, the electroplating units can move in the electroplating solution while barrel plating the parts, the collision probability between the parts and the electrodes can be continuously increased, the plating layer on the surface of the parts is also more and more uniform, and the electroplating effect is better.

The utility model relates to an electroplating device for tissue holder production, which comprises an electroplating bath body, one end of the electroplating bath body is provided with a filtering mechanism, the top of the electroplating bath body is provided with a driving mechanism, the driving mechanism comprises a frame body at the top of the electroplating bath body, one end of the frame body is fixedly connected with a motor, and the motor is fixedly connected with the electroplating bath body. A disc is fixedly connected to the outer surface of an output shaft of the motor, a movable rod is hinged to one end of the disc, a movable frame is hinged to one end of the movable rod, a limiting rod is fixedly connected to the interior of the frame body, and a movable frame is fixedly connected to one end of the movable frame. According to the electroplating device for tissue holder production, impurities and metal ions in electroplating liquid can be filtered through the arranged filtering mechanism, the cleanliness and stability of the electroplating liquid are kept, and the plating layer quality problems, such as uneven plating layers and different thicknesses, caused by electroplating liquid pollution are effectively avoided; therefore, the appearance quality and the corrosion resistance of electroplated products such as the tissue holder are remarkably improved.

The utility model discloses a multi-channel electroplating production line for faucets. The multi-channel electroplating production line comprises an electroplating bedplate, a sliding assembly, a lifting structure and an electroplating structure, supporting rods are installed on the periphery of the bottom of the electroplating table plate, an electroplating structure is placed in an inner clamping groove of the electroplating table plate, sliding assemblies are installed on the pool walls of the two sides of the electroplating table plate, lifting structures are installed on the sliding assemblies and located above the electroplating structure, and a PLC is installed on the front side wall of the electroplating table plate. Through the overall design of the electroplating structure, the electroplating efficiency is improved, the stability and the consistency of the electroplating quality are ensured, and powerful guarantee is provided for high-quality electroplating of faucet parts; meanwhile, due to the overall design of the electroplating structure, the electroplating process is more automatic and intelligent, an operator can finish the electroplating operation only through simple operation, and the production efficiency and the electroplating quality are greatly improved.

The utility model provides a gantry type electroplating automatic device which comprises a base, an electroplating pool is formed in the base, guide rails are fixedly mounted on the left side and the right side of the upper surface of the base, sliding blocks are slidably connected to the exteriors of the guide rails, and a gantry frame is fixedly mounted on the upper surfaces of the two sliding blocks; a hydraulic rod is fixedly mounted on the upper side surface of the portal frame, a connecting plate is fixedly mounted at the lower end of the hydraulic rod, and a filtering mechanism is arranged in the electroplating tank. Through the use of the filtering mechanism, impurities such as particulate matters and chemical reaction residues can be effectively intercepted and removed, and the purity of electroplating liquid and the stability of the electroplating process are improved, so that high quality, high uniformity and consistency of an electroplated layer are ensured, surface flaws are reduced, the service life of the electroplating liquid is prolonged, and the production cost is reduced. The replacement cost is reduced; meanwhile, the filtering mechanism is easy to disassemble and clean, the maintenance work is simplified, and the overall electroplating efficiency is improved.

The utility model discloses an electrophoresis tank for automobile parts, which is convenient to use and comprises an electrophoresis tank body, a top plate is arranged at the top of the electrophoresis tank body, and an electric rod is fixedly connected to the rear side wall in the electrophoresis tank body. By arranging an electrophoresis tank body, a top plate, an electric rod, a moving assembly, a water pump, a connecting water pipe, an air pump, a connecting air pipe, a sliding groove and a placing frame, parts are placed in the placing frame, after the electrophoresis tank body is started, electrophoresis liquid in the electrophoresis tank flows, meanwhile, the air pump is started, the air pump extracts external air and injects the external air into a bottom pipe, and the external air is sprayed out from a spray head; compared with the prior art, not only can the electrophoresis liquid flow faster and the electrophoresis liquid at the bottom be fully blown up, but also the generated bubbles can accelerate electroplating and improve the electroplating efficiency, and when the inside of the electrophoresis tank body needs to be cleaned after electrophoresis is completed, the water pump can be started to directly inject water in an external water supply system into the bottom pipe to clean the inside of the electrophoresis tank body, so that the operation is convenient. And the electrophoresis tank body is more convenient to clean.

The application discloses a three-dimensional tower-shaped zinc negative electrode for aqueous zinc ion batteries and a preparation method and application thereof, and relates to the technical field of aqueous zinc ion batteries. The preparation method comprises the following steps: taking a copper foil as a working electrode, a zinc sheet as a counter electrode, and placing the copper foil and the zinc sheet in an electroplating solution to perform electroplating; after the electroplating is completed, a zinc plating layer is formed on the surface of the copper foil, and thus the three-dimensional tower-shaped zinc negative electrode for aqueous zinc ion batteries is obtained; and the electroplating solution is composed of a conductive salt, a zinc salt, isomalt and water. In the application, the copper foil is taken as the working electrode, the zinc sheet is taken as the counter electrode, the electroplating solution composed of the conductive salt, the zinc salt and the isomalt is adopted, and the zinc layer is electroplated on the surface of the copper foil through the electroplating process. The zinc plating layer has a clear three-dimensional tower-shaped structure, can provide stable sites for the deposition / dissolution of zinc, buffer volume changes, inhibit the growth of dendrites and corrosion from the structural and chemical aspects, and thus the cycle stability and safety performance of the aqueous zinc ion battery are improved.

This application relates to an electroplating fixture for sealing through-holes in parts, comprising an outer surface shielding part, an inner hole plug, an end face shielding part, and a conductive device. The outer surface shielding part has a shielding cavity that surrounds the outer surface of the part, with a mounting hole at one end and an open end at the other. The inner hole plug is disposed within the through-hole of the part, shielding the non-electroplating area. The end face shielding part is installed at the open end of the part via a first sealing ring, shielding the end face and adjacent outer surface. The conductive device includes a negative conductive component and a positive conductive component: the negative component is installed in the end face shielding part and electrically connected to the surface of the part; the positive component includes a conductive post and a mounting bracket, with one end of the conductive post extending into the electroplating area of ​​the through-hole and the other end fixed to the mounting bracket. This fixture completely prevents plating solution leakage through synergistic shielding and sealing, ensuring that the outer surface, end face, and non-electroplating area of ​​the through-hole are free of plating layer coverage; simultaneously, it enables non-destructive current conduction through the part and direct current flow to the electroplating area within the hole, significantly improving plating uniformity and electroplating efficiency.

Embodiments of the present application provide a PCB electroplating control method and system and a storage medium, the method comprising: obtaining target electroplating parameters and electroplating operation data of a PCB to be electroplated by scanning a target code of the PCB to be electroplated through a handheld terminal; generating a visual electroplating operation interface on the handheld terminal according to the electroplating operation data; generating electroplating confirmation information in response to a first operation; and controlling an electroplating flying target to electroplate the PCB to be electroplated according to the electroplating confirmation information to obtain a target PCB. The electroplating parameters can be automatically entered by scanning the target code through the handheld terminal, and the corresponding electroplating flying target can be automatically selected for electroplating, so that the electroplating efficiency is high, manual input of the electroplating parameters is not required, electroplating errors are reduced, and the electroplating cost is low.

The utility model discloses a metal piece machining device, and relates to the technical field of metal piece electroplating machining. The electroplating device comprises an electroplating box, a mounting rack is arranged on the upper side of the electroplating box, a lifting mechanism is arranged on the mounting rack, a moving frame is arranged on the lifting mechanism, and a plurality of fixing mechanisms are arranged in the moving frame; the fixing mechanism comprises a moving groove and a limiting groove which are formed in the moving frame and communicate with each other, a plurality of clamping grooves are formed in one side of the inner wall of the moving groove, and a plurality of rotating shafts are arranged in the moving groove. Through the arrangement of the fixed adjusting piece, the fixing of the rotating shaft can be relieved, and the U-shaped hook at one end of the rotating shaft can be conveniently driven to move, so that the distance between the U-shaped hooks can be adjusted, and when metal pieces of different sizes need to be machined, the situation of collision caused by too short distance can be conveniently avoided; and the machining gaps between the metal pieces can be reasonably adjusted according to the sizes of the metal pieces, and the number of the metal pieces machined each time can be increased.

This invention discloses an electroplating apparatus and an electroplating production line, comprising: an electroplating tank and a clamping and conveying structure; wherein, the clamping and conveying structure is disposed on the open side of the electroplating tank; the clamping and conveying structure conveys the film to be coated along the conveying direction, and the clamping and conveying structure includes at least two sets of clamping and conveying mechanisms; each clamping and conveying mechanism includes an electroplating clamp, a closing clamp assembly, and an opening clamp assembly; on one clamping and conveying mechanism, the closing clamp assembly and the opening clamp assembly are disposed at both ends of the clamping and conveying mechanism along the conveying direction; along the conveying direction of the film to be coated, the closing clamp assembly and the opening clamp assembly of two adjacent clamping and conveying mechanisms are spaced apart and form an adjustable interval. This structure, by providing an adjustable interval, corrects the error caused by the asynchronous electroplating clamps in the previous clamping and conveying mechanism when the film to be coated enters the next stage of the clamping and conveying mechanism; thus greatly solving the synchronization problem.

The utility model relates to the field of metal material strip processing, in particular to a metal material strip continuous electroplating self-feeding device which comprises an electroplating bath, a driving motor is fixedly installed outside the electroplating bath, the output end of the driving motor is fixedly connected with a first rotating shaft, and second rotating shafts which are evenly distributed are arranged on the upper side of the first rotating shaft. Symmetrically-distributed chain wheels are fixedly installed on the outer surfaces of the first rotating shaft and the second rotating shaft, baffles are fixedly connected to the exteriors of the chain wheels, chains are rotationally connected to the exteriors of the chain wheels, material belt clamping assemblies are fixedly installed on the two corresponding chains, and the material belt clamping assemblies are evenly distributed on the chains. A blocking frame is fixedly connected to the exterior of the supporting frame; by arranging the driving motor, the chain wheel, the chain and the material belt clamping assembly, the material belt clamping assembly can be driven to move, metal material belts are sequentially placed in the material belt clamping assembly from bottom to top manually, the material belt on the lower side moves downwards to an electroplating bath to be soaked, and continuous feeding operation is achieved.

The utility model relates to the field of electroplating equipment, in particular to a sealed electroplating carrier for a diamond grinding disc, which comprises a mounting substrate, a first sealing gasket, a middle plate, a second sealing gasket and a cover plate which are sequentially arranged from bottom to top, a conductive disc is installed on the installation substrate, the first sealing gasket and the middle plate are wrapped outside the conductive disc in a sleeving mode, open holes are formed in the second sealing gasket and the cover plate, and the diameter of the open holes is smaller than that of the conductive disc. Compared with the prior art, in the technical scheme, during electroplating operation, due to the special sealing design of the second sealing gasket and the cover plate, electroplating liquid can only act on the designated hole opening area of the diamond grinding disc, and the electroplated area is greatly reduced under the condition of the same current intensity. And when the electric quantity is fixed, the plated area is reduced, the electroplating efficiency of unit area is remarkably improved, the production period is shortened, and the production cost is reduced.

The invention discloses a neodymium-iron-boron zinc plating method for maintaining shearing force performance based on high and low temperature circulation. The neodymium-iron-boron zinc plating method comprises the following steps: carrying out electroplating pretreatment on a neodymium-iron-boron magnet; carrying out first-layer zinc plating on the pretreated magnet, wherein the first-layer zinc plating is carried out in a sulfate-containing zinc plating solution; carrying out second-layer zinc plating on the magnet subjected to first-layer zinc plating, wherein the second-layer zinc plating is carried out in a potassium salt-containing zinc plating solution; carrying out electroplating post-treatment on the magnet after the second layer of zinc plating is completed; the cathode current density adopted by the first layer of galvanization is greater than that adopted by the second layer of galvanization. The problems that an existing neodymium-iron-boron magnet is insufficient in shearing force in an extreme temperature environment, and potential safety hazards are likely to be caused are solved, the second-layer current density reducing technology releases coating stress, the high-low-temperature cyclic shearing force of the magnet is improved, meanwhile, the salt mist performance of the magnet is further improved, and the service life of the magnet is prolonged. And the sintered neodymium-iron-boron magnet and the galvanized magnet have high corrosion resistance at the same time.

The utility model relates to the related field of electroplating baths, and particularly discloses a mechanical stirring type electroplating bath which comprises an electroplating bath main body, a stirring frame and a control box seat, a motor is arranged in the middle of the top end of the electroplating bath main body through a motor seat, and a sealing cover and an electroplating liquid adding head are respectively arranged on two sides of the top of the electroplating bath main body. A stirring frame is arranged in the electroplating bath main body, a control box seat is arranged at the bottom of the electroplating bath main body, and hanging lugs are arranged at the corners of the top of the electroplating bath main body. The sealing cover and the electroplating liquid adding head are respectively arranged on the two sides of the top of the electroplating bath main body, the sealing cover is used for conveniently sealing the feeding opening and conveniently feeding, the electroplating liquid is conveniently added into the electroplating bath main body through the electroplating liquid adding head, and the flow guide plate is arranged on one side of the electrode plate, so that the electroplating efficiency can be improved, and the production cost is reduced. The feeding wheels are arranged at the two ends of the stirring frame, auxiliary feeding can be achieved through the feeding wheels, the workpiece capable of being rolled can be conveyed and electroplated, and a waterproof electrode is arranged on the stirring frame.