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Barrel-plating device and barrel-plating system

A barrel plating and circulation device technology, applied in the direction of cells, electrolysis process, electrolysis components, etc., can solve the problems such as floating objects cannot be discharged in time, affecting the quality of electroplating of the workpiece to be plated, and too many electroplating solutions.

Active Publication Date: 2017-06-20
KUNSHAN DONGWEI MACHINERY CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] Therefore, the technical problem to be solved in the present invention is to overcome the barrel plating device electroplating process in the prior art, the floating matter on the surface of the electroplating solution cannot be discharged in time, which affects the quality of the electroplated workpiece, and the required There are many electroplating solutions, and at the same time, it is impossible to realize the problem of long-term automatic continuous electroplating process

Method used

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  • Barrel-plating device and barrel-plating system
  • Barrel-plating device and barrel-plating system
  • Barrel-plating device and barrel-plating system

Examples

Experimental program
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Effect test

Embodiment 1

[0094] This embodiment provides a barrel plating device, such as figure 1 and figure 2 As shown, it includes a first tank 20 , a barrel coating barrel 10 , a circulation device 30 and a discharge mechanism 70 .

[0095] Wherein, the first tank 20 has an inner cavity, and a first inlet and a first outlet are respectively set on the opposite side walls; the barrel 10 is rotatably arranged in the inner cavity of the first tank 20 by a rotating mechanism, There are feed inlets and discharge outlets on the two side end faces, and overflow holes 1084 located below the feed inlet and the discharge outlet are provided on the two side end faces; the feed inlet corresponds to the first inlet, and the discharge port corresponds to the first inlet. The first outlet; the inner cavity of the barrel plating barrel 10 communicates with the inner cavity of the first tank 20; one end of the circulation device 30 is connected to the overflow hole 1084, and the other end is located in the barre...

Embodiment 2

[0147] This embodiment provides a barrel plating device, such as Figure 19 As shown, the difference between it and the barrel plating device provided in Example 1 is only that the structure of the barrel plating barrel 10 is different, and the barrel plating barrel 10 in this embodiment only has the first section 1011 and the second section 1012, and does not A third section 1013 is provided, that is, a dial member 103 is provided on one side of the scoop member 102, and other structures are the same as those in Embodiment 1.

Embodiment 3

[0149] This embodiment provides a barrel plating device, such as Figure 22 As shown, the difference with the barrel plating device provided in Embodiment 1 or Embodiment 2 is only that: the structure of the first section 1011 of the barrel plating barrel 10 is different, and the first section 1011 is not formed by connecting each scoop material piece 102 end to end. The first section 1011 is a cylindrical hollow cylinder, and the scooping material 102 is a plate, which is evenly distributed on the circumferential inner wall of the hollow cylinder. Of course, several scooping material 102 can also be unevenly distributed on the hollow cylinder. At this time, the connecting end 10211 of the scoop material member 102 is directly fixed on the wall surface of the first section 1011, and in the discharging state, the tilting end 10212 is formed between the circumferential wall surface of the first section 1011. The scoop area 105 with the opening facing upwards. Other structures a...

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Abstract

The invention discloses a barrel-plating device and a barrel-plating system. The barrel-plating device comprises a first tank, a barrel-plating barrel and a circulating device. The first tank is provided with an inner cavity. The barrel-plating barrel is rotationally arranged in the inner cavity of the first tank, a feeding opening and a discharging opening are formed in the two side end faces in the axial direction of the barrel-plating barrel, and overflow holes located below the feeding opening and the discharging opening are formed in at least one end face. One end of the circulating device is connected to the overflow holes, the other end of the circulating device is located in the barrel-plating barrel, and the circulating device is used for recycling and filtering electroplate liquid at the position higher than the overflow holes in the barrel-plating barrel through the overflow holes and inputting the filtered electroplate liquid into the barrel-plating barrel again. The barrel-plating system comprises at least two above barrel-plating devices. The circulating device can recycle and filter matter floating on the surface of the electroplate liquid, the filtered electroplate liquid is input into the barrel-plating barrel again, so that the circulating mode of the electroplate liquid is formed, it is guaranteed that few impurities are contained in the electroplate liquid in the barrel-plating barrel, the electroplating quality of plated workpieces is improved, and the plated workpieces can be continuously electroplated.

Description

technical field [0001] The invention relates to the technical field of electroplating of metal parts, in particular to a barrel plating device and a barrel plating system. Background technique [0002] Barrel plating is drum electroplating, which is to place a certain number of small parts in a special drum, and deposit various metal or alloy coatings on the surface of the parts in a rolling state in an indirect conductive manner to achieve surface protection, decoration and various functions. An electroplating processing method for permanent purpose. [0003] With the automatic realization of electroplating equipment, the traditional closed barrel plating equipment has been gradually replaced. For example, a barrel plating device disclosed in the Chinese patent document CN203229582U previously applied by the inventor, the barrel plating device includes a frame, a barrel plating barrel installed on the frame, an anode plate and a cathode lead are arranged in the barrel plat...

Claims

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Application Information

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IPC IPC(8): C25D17/16C25D21/00C25D21/06
Inventor 张军危勇军方志斌
Owner KUNSHAN DONGWEI MACHINERY CO LTD
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