452 results about "Diamond cutting" patented technology

A treatment that can be applied to the face of a golf club head complies with USGA regulations but imparts certain advantageous characteristics. The treatment can comprise a certain pattern and can be imparted to the club head via laser etching, diamond cutting, chemical etching or any other process that will achieve the desired result. In accordance with USGA rules, the treatment must cover the intended area of impact on the golf club face.

A roller cone drill bit for drilling earth formations includes a bit body having at least one roller cone rotably attached to the bit body and a plurality of cutting elements disposed on the at least one roller cone in a plurality of rows arranged circumferentially around the at least one roller cone, wherein at least one cutting element in the gage row, the heel row, or a surface of the at least one roller cone bounded by the gage and heel rows comprises thermally stable polycrystalline diamond or a thermally stable polycrystalline diamond composite. The at least one cutting element may be a TSD insert or a TSD composite insert and may be formed by brazing, sintering, or bonding by other technologies known in the art a thermally stable polycrystalline diamond table to a substrate. The interface between the diamond table and the substrate may be non-planar. A roller cone drill bit includes a bit body, at least one roller cone rotably attached to the bit body, and a plurality of cutting elements disposed on the at least one roller cone, where at least one of the plurality of cutting elements comprises thermally stable polycrystalline diamond or a thermally stable polycrystalline diamond composite and a cutting surface, wherein at least a portion of the cutting surface is contoured.

The invention discloses a circular diamond saw blade bit and a manufacturing method thereof. The circular diamond saw blade bit is made of diamond particles and matrix powder used for consolidation of the diamond particles. The matrix powder comprises, by mass percent, 40%-80% of Fe, 15%-30% of Cu, 0%-10% of Ni, 2%-8% of Sn, 0%-10% of Co, 0%-5% of Me and the balance inevitable impurities. Me is at least one of Mn, Ti, Si, Cr, P and Al. The manufacturing method comprises the steps of mixing raw materials, conducting cold-press molding and free sintering. The manufacturing method is simple and can effectively avoid the loss of a graphite mould and reduce manufacturing cost. Meanwhile, a volume production requirement can be met, and blade bits in complicated shapes can be produced; production efficiency is prolonged, and the service life of the tool is similar to that of a tool manufactured through a hot-press sintering method; the purpose that high-quality diamond cutting tools are produced under the condition of low cost can be achieved; and the circular diamond saw blade bit and a manufacturing method thereof are easy to popularize in an industrialized manner.

The invention discloses a diamond fretsaw cutting method and device. An annular diamond fretsaw is used for cutting a crystal ingot workpiece; the annular diamond fretsaw surrounds a plurality of horizontal guide wheels and is tensioned by a tension mechanism; under the driving of one of the guide wheels, namely, a driving wheel, the annular diamond fretsaw operates at a high speed; under the driving of a lifting mechanism, the annular diamond fretsaw is fed to a crystal ingot cutting workpiece and retracts upward; and in a cutting process of the annular diamond fretsaw, the crystal ingot workpiece is driven by a rotary mechanism to rotate uni-directionally around a shaft of the workpiece. According to the method and the device, the annular diamond fretsaw has a higher linear speed; when a workpiece rotates uni-directionally and continuously, point contacting type cutting between the diamond fretsaw and the crystal ingot workpiece is realized; and diamond particles can be pressed into a cut material more easily, so that the device has a cutting efficiency about ten times of that of the ordinary fretsaw diamond cutting.

An apparatus for making microlens molds and microlens array molds is described which utilizes a forming element having a rotating half radius diamond cutting member. A substrate is alignably arranged with the diamond cutting member so that the cutting member can mill a mold cavity in the substrate. The apparatus can be used to make high sag lens molds with high accuracy and a nearly 100% fill factor.

The invention relates to a crashing-preventing type rock sample cutting and grinding device and a cutting and grinding process thereof, wherein a motor of the crashing-preventing type rock sample cutting and grinding device drives two parallel transmission shafts, one is provided with a diamond cutting piece, the other one is provided with a grinding wheel, and a clamping device is opposite to the diamond cutting piece and the grinding wheel; a feeding device can run along a base so as to adjust the positions between the clamping device and the diamond cutting piece, and between the clamping device and the grinding wheel; the clamping device is provided with a holder that penetrates from a bracket, the holder is split, an upper holding body and a lower holding body are buckled to form a cylindrical holding cavity, the upper holding body is provided with a clamping rocking handle which is in threaded connection with the upper holding body by penetrating through the bracket, a cooling pipe is arranged on the holder, and a nozzle of the cooling pipe is arranged in front of the holding cavity. The crashing-preventive type rock sample cutting and grinding device integrates cutting and grinding, and the problem that a rock sample is easy to be clamped to be crashed is solved, the operation is simple and convenient and successful rate is high.

A technology and apparatus for manufacturing the antiwear combined cutting diamond wire features that the diamond microparticles are inlaid in the subsurface of steel wire by squeezing or punching. Its advantages are long length up to 60 km, uniform diameter, and high antiwear performance and tension strength.

The invention discloses a solar-grade silicon wafer being cut by a diamond wire and a cutting method thereof. A mono-crystalline silicon square rod is cut by a diamond wire. The cutting method comprises the following steps that: the mono-crystalline silicon square rod which is formed by squaring, grinding and sharpening a mono-crystalline silicon circular rod, the mono-crystalline silicon square rod is fixed on a resin strip through an adhesive bar, the resin strip is fixed on an adhesive plate, then the adhesive plate and the mono-crystalline silicon square rod are collectively placed into a working cabin to be preheated, cutting liquid is circulated in the working cabin to work, then the diamond cutting is performed, the cut mono-crystalline silicon wafer is inversely arranged on a degumming device to degum, and the mono-crystalline silicon wafer is washed by ultrasonic and then is centrifugally dehydrated. Due to the adoption of the cutting method, the photoelectric conversion efficiency and the cutting efficiency of the mono-crystalline silicon wafer can be improved, a silicon wafer with the thickness of 140 to 200 micrometers can be produced, the qualification rate of the product can reach more than 98 percent; and silicon powder is recyclable, so valuable silicon resource can be saved, and the environment-friendly production can be really realized during the production process.

The invention belongs to the field of technologies for processing advanced materials, and particularly provides a method and equipment for efficiently cutting large-diameter single crystals by the aid of diamond wires. The method and the equipment have the advantages that the equipment is convenient to operate and is provided with a multi-wire cutting machine and the diamond cutting wires, the diameters of the diamond cutting wires range from 120 micrometers to 400 micrometers, diamond particles are plated on outer layers of the diamond cutting wires, multiple pieces of large-diameter SiC crystal bars can be cut by the aid of reciprocating high-speed cutting movement of the diamond cutting wires, the surface roughness, the bending and the total thicknesses of cut SiC wafers hardly vary, and a plurality of target crystals can be cut in each procedure; the crystal can be cut at high speeds, crystal cutting elapsed time is short, and accordingly the silicon carbide wafers can be efficiently cut by the aid of the method and the equipment.

The invention relates to a diamond cutting grinding piece. The diamond cutting grinding piece comprises a diamond cutting grinding piece body arranged on a substrate, wherein the diamond cutting grinding piece body is evenly distributed in the circumferential direction, and corrugated water channels which are beneficial to heat dissipation and chip removal in the process of grinding are formed in the surface of the diamond cutting grinding piece body. The diamond cutting grinding piece organically combines the cutting performance and grinding performance through the unique design, is simple and reliable in structure, convenient to operate, low in manufacturing cost and long in service life, solves the problem that the cutting performance and the grinding performance of a diamond tool are independent from each other in an existing market, and is particularly applicable to cutting and grinding of building materials such as stones, concrete, ceramics, bricks and tiles.

A method for producing carbide and diamond cutting tool inserts adapted to compensate for braze-induced warp is provided. In this method, the anticipated warpage of the insert from brazing is considered prior to cutting the insert from a PCD and carbide disk and the cutting path for the insert is adjusted to compensate. The adjusted cutting path creates an insert shape that, after warping as a result of the brazing process, will conform substantially to the originally intended insert or cutting tool shape. Also, a method of providing relief on the bottom surface of a brazeable insert is provided. Further, tools produceable by these methods are disclosed, such as a diamond edged rotary cutting tool with a substantially sinusoidal rake face and cutting edge.

The invention relates to a hybrid drill bit for petroleum, natural gas and geological drilling. The hybrid drill bit comprises a drill bit body, wherein a cutter wing and a roller cone are arranged on the drill bit body, cutting teeth are arranged on the cutter wing, the roller cone is connected with the drill bit body through a cone leg, and the hybrid drill bit is characterized in that the roller cone is a disk type roller cone. A cutting element on the disk type roller cone is shaped like a disk cutter or an intermittent disk cutter. The patent disclosed by the invention has the beneficial effects that, 1) the scraping motion of a diamond drill bit and the rolling motion of a disk type roller cone drill bit are combined for realizing precrushing at the bottom of a well, thereby ensuring that the diamond cutting teeth can effectively bite rock, eliminating the stick-slip phenomenon of the drill bit in some special formations and the probability of impact disrepair of a polycrystalline diamond compact (PDC) and improving the cutting efficiency and the mechanical drilling speed of the drill bit; and 2) the disk type roller cone can realize the precrushing of a rock layer at the bottom of the well more steadily, reduce the impact on the PDC, enhance the stability in drilling of the drill bit and enable the drill bit to realize faster and more stable drilling.

A high-precision, efficient and cheap method for mechanically sharpening the diamond cutting tool includes such steps as regulating the static balance of grinding machine, turning the grinding disc, polishing it, adhering the grinding diamond particles on the surface of grinding disc, regulating the dynamic balance of the mainshaft system of grinding machine, fixing the diamond cutting tool, regulating the level degree of fixture, opening air source, turning on the grinding machine, regulating rotation speed, grinding pressure and front angle of cutting tool, and grinding.

A cutting insert for metalworking operations has an insert core with a pair of cutting portions having cutting tips extending therefrom such that a toolholder having a pocket to accept such a core is suitable to accept different cutting inserts having a common core plus different cutting portions. As a result, for example, an 80° diamond, a 55° diamond and a 35° diamond cutting insert may all be utilized within a common toolholder. The invention is also directed to a toolholder that will accept such a variety of cutting inserts.

The present invention relates to the manufacturing field of hard brittle material, and especially to a technique for manufacturing an ultrathin diamond cutting slice of metal anchoring agent. The method comprises the following steps: selecting high-fundamental-grain diamond for executing surface metallization procession; precise-grinding and ball-milling the metal powder through water cooling; mixing the processed diamond and metal powder; cold pressing; hot pressing sintering to prepare thin sheet with high compactness degree; and finally clamping the thin sheet for grinding to prepare cutting slice with satisfied standard and dimension. According to the technique, the surface of diamond has stable cutting property and combination property after metallization procession. The metal powder is mechanically pre-alloyed through water cooling, precise-grinding and ball-milling and has stable performance. The high-strength and high-density cutting slice can be obtained through hot pressing sintering. The technique is easy and convenient for controlling. The cutting slice has stable cutting performance and long service lifetime.

This invention relates to powder metallurgy, more specifically, to methods of fabricating hard alloy items. The invention can be used as an iron, cobalt or nickel base binder for the fabrication of diamond cutting tools for the construction industry and stone cutting, including segmented cutting discs of different designs and wires for reinforced concrete and asphalt cutting used in the renovation of highway pavements, runways in airports, upgrading of metallurgical plants, nuclear power plants, bridges and other structures, monolithic reinforced concrete cutting drills, as well as discs and wires for the quarry production of natural stone and large scale manufacturing of facing construction materials. This invention achieves the objective of providing binders for the fabrication of diamond tools having higher wear resistance without a significant increase in the sintering temperature, as well as higher hardness, strength and impact toughness. The achievement of these objectives by adding an iron group metal as the main component of the binder composition and alloying additives in the form of nanosized powder in accordance with this invention is illustrated with several examples of different type binders for the fabrication of diamond tools.

The invention relates to a preparation method for a diamond cutting grinding piece. The diamond cutting grinding piece comprises a diamond cutting grinding piece body arranged on a 65Mn steel substrate, and corrugated water channels are formed in the surface of the diamond cutting grinding piece body. The preparation method for the diamond cutting grinding piece comprises the steps of material mixture, substrate machining, compression forming, sintering and edge forming. The diamond cutting grinding piece produced through the preparation method for the diamond cutting grinding piece has the cutting effect and the grinding effect, and is safe and reliable in performance, simple and reasonable in structure, low in manufacturing cost, flexible in operation, good in sharpness of products and good in chip-removal performance.

The present invention discloses a glass substrate cutting device, comprising a laser emission device and a cutting device, wherein the laser emission device emits a laser beam on the surface of a glass substrate to be cut to form a microgroove on the glass substrate surface, the cutting device is used for cutting the glass substrate at the position of the microgroove and comprises a cutting wheel fixing device and a diamond cutting wheel fixed on the cutting wheel fixing device. According to the invention, by using the laser emission device to emit the laser beam to form the microgroove on the glass substrate surface, the diamond cutting wheel can be embedded in the microgroove at the position of the microgroove to cut, thus the friction between the diamond cutting wheel and the glass substrate can be increased, the diamond cutting wheel is prevented from sliding when cutting, and the cutting precision is improved.

The invention discloses a treatment process of injecting a product in a mold, which comprises the following steps: (1) coating UV finish on one surface of a base material, curing to form a UV hardened layer; (2) coating the UV finish on the other surface of the base material, performing die casting on the UV finish to obtain lines, curing the base material in a curing furnace to form a UV line layer; (3) performing vacuum sputtering of a titanium oxide metal layer on the UV line layer, wherein the light transmittance of the titanium oxide metal layer is 75-80%; (4) printing an ink layer on the titanium oxide metal layer; (5) punching the base material with the printed ink layer to form a sheet material; (6) putting the punched sheet material in a corresponding injection mold to perform injection molding so as to obtain a finished product. The product processed by the treatment process of injecting a product in a mold of the invention has diamond cutting effect with high angularity and high stereoscopic impression, has high wear resistance, and is applicable to mobile phones, panel personal computers, and products with other structures.

The invention belongs to the field of ultra-precision processing, and discloses an ultrasonic vibration micro laser assisted composite single-point diamond cutting processing system. The system comprises a laser emitting module and a cutting module, wherein the laser emitting module is used to emit laser, the cutting module comprises a tool, an ultrasonic amplitude-change pole and a piezoelectricunit, a through hole is formed in the center of the ultrasonic amplitude-change pole, laser emitted by the laser emitting module is focused on the tip point of the tool through the through hole, the piezoelectric unit converts an electrical signal into a pressure signal to enable the ultrasonic amplitude-change pole to drive the tool to vibrate, thereby converting the cutting method from continuous cutting to intermittent cutting, the back end of the tool is an elliptical spherical surface, and when the tool vibrates, the laser is always focused on the tip point of the tool through the back end of the tool to avoid the misalignment of the laser and the tip point when the ultrasonic amplitude-change pole vibrates. Through the system, the organic integration of ultrasonic vibration, single point cutting technology and micro laser assisted processing technology is realized, and the processing efficiency and precision are improved.