The invention provides a packaging structure and a forming method thereof, in the forming method, a bridge
chip assembly is firstly formed, a
silicon through hole of a bridge
chip is exposed in a mode of firstly depositing a
protection layer and then
thinning the
silicon through hole, the
protection layer can protect a substrate in the
thinning process, and the substrate is prevented from being damaged.
Metal ions generated by
thinning the
silicon through hole can be prevented from being migrated and diffused into the substrate, so that the problem of reliability failure of the packaging structure caused by migration and
diffusion of the
metal ions is avoided; meanwhile, when the bridge
chip assembly is plastically packaged, the bottom surface of the bridge chip
assembly is provided with an adhesion layer, the adhesion layer is removed after
plastic packaging, so that the bottom surface of the bridge chip assembly is higher than the bottom surface of the first
plastic packaging layer, and after bottom rewiring
layers are formed on the bottom surface of the first
plastic packaging layer and the bottom surface of the bridge chip assembly, the bottom rewiring
layers are formed on the bottom surface of the first plastic packaging layer and the bottom surface of the bridge chip assembly. The thickness of the bottom rewiring layer located on the bottom face of the bridge chip assembly is larger than that of the bottom rewiring layer located on the bottom face of the first plastic packaging layer, namely, the bottom of the bridge chip assembly is provided with a thicker
dielectric layer, so that the connection strength of all connection points of the bridge chip assembly is guaranteed, higher stress buffering is provided for the bridge chip, and the reliability of the bridge chip assembly is improved. And the reliability of the packaging structure is improved.