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31results about How to "Ensure uniformity of light emission" patented technology

LED (Light Emitting Diode) lamp filament and manufacturing method thereof

The invention provides an LED (Light Emitting Diode) lamp filament and a manufacturing method thereof. An LED chip is encapsulated on the edge top surface of a thin and long sheet metal support of the LED filament innovatively, meanwhile the sheet metal is inserted into a preformed transparent plastic model frame to produce a light source, and accordingly the automated continuous production of the LED lamp filament is implemented and the problem of the facing direction strength caused by the too thin and too long metal support is solved due to the transparent plastic model frame; meanwhile the lateral direction strength of the metal support is effectively utilized and accordingly the integral mechanical strength of the LED lamp filament is ensured; the heat dissipation characteristics of the metal is directly utilized, meanwhile the heat dissipation efficiency of the LED chip is maximized through the innovative encapsulation of thermal conductive coatings, and accordingly the problem of a heat dissipation bottleneck of the LED lamp filament is effectively solved, the LED lamp filament can work at the rated power for a long time, and the cost is reduced; the LED light extraction efficiency is improved, the light attenuation is reduced, the high lighting effect and ambient light of lamp filament light emission is implemented, and the market vacancy of the existing LED lamp filament is filled through innovative fluorescence encapsulation materials.
Owner:DONGGUAN RIWEI ELECTRONICS

Substrate, preparation method of substrate and display device

Embodiments of the invention provide a substrate, a preparation method of the substrate and a display device, relate to the technical field of display, and can solve the problem that the thickness ofa light-emitting functional layer formed in an opening region of an existing pixel definition layer is not uniform. The preparation method of the substrate comprises the following steps of forming a pixel definition layer thin film on a substrate, wherein the material of the pixel definition layer thin film comprises a photoresist, and a hydrophilic material, elastic materials and auxiliary particles doped in the photoresist; the auxiliary particles are used for releasing gas during decomposition, and the elastic material is used for expanding the pixel definition layer thin film when the auxiliary particles release the gas; the molecular weight of the hydrophilic material, the photoresist and the elastic material is larger than that of the auxiliary particles; heating the pixel definitionlayer thin film, and enabling the auxiliary particles to move in the direction far away from the substrate; and processing the pixel definition layer thin film to form a pixel definition layer, and enabling the auxiliary particles to be decomposed to release gas. The preparation method is used for preparing the pixel definition layer.
Owner:BOE TECH GRP CO LTD +1

Manufacturing method of LED display module for splicing

The invention provides a manufacturing method of an LED display module for splicing, which comprises the following steps of: providing a substrate, arranging a process edge around the substrate, and defining a display area for mounting a light-emitting unit on the front surface of the substrate; defining a drive mounting area for mounting an electronic drive element on the back surface of the substrate; a groove which does not penetrate through the substrate is formed in the process edge, and the depth of the groove is larger than the thickness of the part, not penetrating through the substrate, of the substrate; mounting a light-emitting unit array on the display area; a light-transmitting packaging adhesive layer covering the display area is molded on the substrate, and the groove is filled with the light-transmitting packaging adhesive layer; and cutting off part of the process edge and part of the light-transmitting packaging adhesive layer along one side of the process edge to form a cutting surface on the outer side of the LED display module, and enabling the distance from the central point of the light-emitting unit closest to the cutting surface on the plane where the display area is located to the cutting surface to be smaller than or equal to 1 / 2 of the line spacing value between two rows of light-emitting units parallel to the cutting surface. The spliced display screen has the beneficial effects that water vapor invasion is prevented, and the spliced display screen is uniform in light emitting.
Owner:SHENZHEN JUFEI OPTOELECTRONICS CO LTD

A kind of preparation method of light-emitting diode epitaxial wafer

The invention discloses a preparation method of a light emitting diode epitaxial wafer, belonging to the field of light emitting diode manufacture. When the substrate is placed into the turntable of the organic chemical vapor deposition apparatus, the distance between the midpoint of the chord of the arcuate rounded edge surface and the axis of rotation is greater than the distance between the midpoint of the arc of the arcuate rounded edge surface and the axis of rotation, such an arrangement that the flat edge surface of the substrate faces the side away from the axis of rotation of the turntable. At this time, under the centrifugal force of the tray, the rounded edge surface portion of the substrate moves away from the flat edge surface, the friction between the peripheral portion of the epitaxial layer on the round edge surface and the sidewall of the circular groove is reduced, so that the temperature of the epitaxial layer of the part is not too high, the In in the InGaN well layer in the peripheral part is not excessively lost, the wavelength difference between the central part of the epitaxial layer grown on the round edge surface and the wavelength of the light wave emitted from the peripheral part is not too large, and the light emitting uniformity of the light emitting diode is further ensured.
Owner:HC SEMITEK ZHEJIANG CO LTD

A dual-function led drive circuit

The invention belongs to the technical field of automobile lamps, and particularly relates to a dual-function LED drive circuit. The dual-function LED drive circuit comprises a protective circuit module, a power supply module, a PWM signal generating module, a current adjusting module, a fault diagnosis module and an LED lamp. The protective circuit module, the power supply module, the PWM signal generating module and the current adjusting module are electrically connected in sequence. The output end of the protective circuit module and the output end of the current adjusting module are connected with the anode and the cathode of the LED lamp respectively, the input end of the fault diagnosis module is connected with the cathode of the LED lamp, and the output end of the fault diagnosis module is connected with the PWM signal generating module. The LED drive circuit is controlled by PWM, a constant flow source is adopted to control a field effect transistor in the LED drive circuit to enable the current flowing through the LED lamp to be constant, the uniformity and stability of LED brightness are ensured, two kinds of light with different kinds of brightness can be emitted by a series of LED lamps through the drive circuit, the number of the LED light sources on an automobile body is effectively reduced, and the space utilization rate of the automobile body is improved.
Owner:DONGFENG PEUGEOT CITROEN AUTOMOBILE

A kind of LED filament and manufacturing method thereof

The invention provides an LED (Light Emitting Diode) lamp filament and a manufacturing method thereof. An LED chip is encapsulated on the edge top surface of a thin and long sheet metal support of the LED filament innovatively, meanwhile the sheet metal is inserted into a preformed transparent plastic model frame to produce a light source, and accordingly the automated continuous production of the LED lamp filament is implemented and the problem of the facing direction strength caused by the too thin and too long metal support is solved due to the transparent plastic model frame; meanwhile the lateral direction strength of the metal support is effectively utilized and accordingly the integral mechanical strength of the LED lamp filament is ensured; the heat dissipation characteristics of the metal is directly utilized, meanwhile the heat dissipation efficiency of the LED chip is maximized through the innovative encapsulation of thermal conductive coatings, and accordingly the problem of a heat dissipation bottleneck of the LED lamp filament is effectively solved, the LED lamp filament can work at the rated power for a long time, and the cost is reduced; the LED light extraction efficiency is improved, the light attenuation is reduced, the high lighting effect and ambient light of lamp filament light emission is implemented, and the market vacancy of the existing LED lamp filament is filled through innovative fluorescence encapsulation materials.
Owner:广东佳光电子有限公司

Multifunctional reusable slender through lamp and mounting structure thereof

The invention discloses a multifunctional reusable slender through lamp and a mounting structure thereof. The slender through lamp comprises a movable rear lamp and fixed rear lamps symmetrically arranged on the left side and the right side of the movable rear lamp. The light-emitting module of the fixed rear lamp is composed of a first light-emitting module and a second light-emitting module, the first light-emitting module is composed of a plurality of brake lamp light sources and a plurality of position lamp light sources, and the second light-emitting module is composed of a plurality of steering lamp light sources and a plurality of position lamp light sources. The movable rear lamp comprises a fourth light-emitting module and third light-emitting modules arranged on the two sides of the fourth light-emitting module, each third light-emitting module is composed of a plurality of functional light sources and a plurality of position light sources, and the fourth light-emitting module is composed of a plurality of position light sources. A first thick-wall condenser is arranged above the first light-emitting module, the second light-emitting module and the third light-emitting module; and a second thick-wall condenser is arranged above the fourth light-emitting module. The slender through lamp can realize the function multiplexing of a position lamp, a steering lamp and a brake lamp, and can form a slender characteristic at the rear part of an automobile.
Owner:CHONGQING CHANGAN AUTOMOBILE CO LTD

LED integrated light source manufacturing process and LED integrated light source

The invention relates to the technical field of LED integrated light sources, and discloses an LED integrated light source manufacturing process and an LED integrated light source. The manufacturing process of the LED integrated light source comprises the following steps: S10, adhering a plurality of chips into counter bores of a substrate through an adhesive, and baking to form a chip layer; S20,conducting the plurality of chips, and reserving lead layers conducted with the chips; S30, placing an edge shielding frame, mixed fluorescent powder, fluorescent glue and a diluent on the peripheryof the chip layer, spray-covering the chip layer, taking down the edge shielding frame, baking to form a fluorescent layer, and placing the chip layer in the fluorescent layer; and S40, dispensing a packaging adhesive on the fluorescent layer, baking to form a packaging layer, and placing the chip layer in the packaging layer. According to the invention, by adding the diluent, the viscosity of thepowder glue mixed solution is reduced, the content of fluorescent powder is increased, and the brightness of light generated after excitation is ensured to be higher; and the spraying mode enables the excitation efficiency of each position of the chip to be the same, guarantees the light-emitting uniformity, reduces the risk of glue cracking, and prolongs the service life of the LED integrated light source.
Owner:GUANGDONG GMA OPTOELECTRONICS TECH +3
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