High-heat-conductivity LED (light-emitting diode) high-power packaging bracket

A packaging bracket, high thermal conductivity technology, applied in the direction of semiconductor devices, electrical components, circuits, etc., can solve the problems of high cost of LED packaging bracket, weak market competitiveness, complex production process, etc., to ensure luminous efficiency and light color uniformity. , to achieve the effect of cost control and simple production process

Inactive Publication Date: 2012-09-19
JIANGSU WINAD LIGHTING TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The production process is complex and the production cost is high, which to a large extent results in high cost of LED packaging brackets, which in turn leads to weak market competitiveness of products

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0018] Aluminum-copper-carbon alloy contains 91% of aluminum, 1.5% of copper, 7% of carbon, and the balance of phosphorus, sulfur, zinc and other inevitable impurities. The thermal conductivity of the alloy is 250 W / (m·K) ). In the experiment, a 1mm chip with a 4×4 spacing of 2mm was uniformly distributed to emit light for 4 hours. The temperature at 1cm above the chip was 47°C. During the experiment, the peak light intensity was 800lm and the average light intensity was 720lm.

Embodiment 2

[0020] The aluminum-copper-carbon alloy contains 95% of aluminum, 1.8% of copper, 3% of carbon, and the balance of phosphorus, sulfur, zinc and other inevitable impurities. The thermal conductivity of the alloy is 270 W / (m·K) ). In the experiment, a 1mm chip with a 4×4 spacing of 2mm was uniformly distributed to emit light for 4 hours. The temperature at 1cm above the chip was 45°C. During the experiment, the peak light intensity was 820lm and the average light intensity was 740lm.

Embodiment 3

[0022] The aluminum-copper-carbon alloy contains 93% of aluminum, 2.5% of copper, 4% of carbon, and the balance of phosphorus, sulfur, zinc and other inevitable impurities. The thermal conductivity of the alloy is 280 W / (m·K) ). In the experiment, a 1mm chip with a 4×4 spacing of 2mm was uniformly distributed to emit light for 4 hours. The temperature at 1cm above the chip was 44℃. During the experiment, the peak light intensity was 810lm and the average light intensity was 750lm.

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PUM

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Abstract

The invention discloses a high-heat-conductivity LED (light-emitting diode) high-power packaging bracket, comprising a radiating substrate, an insulating heat conduction layer and a dielectric layer, wherein the radiating substrate is made of high-heat-conductivity metal materials, the surface of the radiating substrate is provided with a circuit, the surface of the radiating substrate is covered by the insulating heat conduction layer and the dielectric layer, and the radiating substrate is made of aluminum copper carbon alloy materials. The technical problem to be solved is to improve the radiating performance of LED packaging. According to the high-heat-conductivity LED high-power packaging bracket, the heat conductivity performance of the packaging bracket is improved, and meanwhile, the material cost of the packaging bracket is controlled; the radiating performance of the packaging bracket is improved, and meanwhile, the production cost of products is effectively reduced, the luminous efficiency and the light color uniformity of LED lamps are ensured, and the controllability of luminous color temperature is increased.

Description

[0001] technical field [0002] The invention relates to an LED packaging accessory, in particular to a high thermal conductivity LED high-power packaging bracket. Background technique [0003] It is now possible to produce 0.5W---5W high-power LED products, such as the Luxeon LED of Lumileds in the United States. The generated heat is conducted in the air, but the heat dissipation of the copper-aluminum substrate still cannot solve the problem of high heat of the LED. Encapsulating a single large-size chip or multiple small-size chips on a metal base can also effectively increase the power and brightness of the LED, but it is also a small increase. Because the heat dissipation of the substrate is not enough, it still cannot solve the high heat of the chip when it is working. Problems cause LED chips to easily attenuate and collapse, and the process is difficult, the cost is high, and it is not easy to promote. [0004] In addition, the light made of dozens or hundreds of...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L33/64C22C21/00
Inventor 牟小波张姗姗韦海洋
Owner JIANGSU WINAD LIGHTING TECH
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