LED signboard preparation process

Abstract

The preparation process of the LED signboard comprises the following steps: S1, forming a groove in an acrylic plate, wherein the shape of the groove is an identification pattern or an identificationcharacter; s2, preparing a PCB substrate matched with the groove in shape; s3, mounting an LED chip on the surface of the PCB substrate to obtain an LED light source assembly; s4, enabling the LED light source assembly to be subjected to glue pouring packaging; s5, enabling the LED light source assembly to be embedded into the groove, and then carrying out dispensing packaging; s6, electrically connecting the LED light source assembly with an external power supply device. The PCB substrate is prepared into a whole block, then the LED chips are mounted, the light emitting uniformity can be guaranteed, and after the LED chips at a certain point position break down, due to the fact that the mounting density of the LED chips is large, it can be guaranteed that light emitting of the whole signboard is not affected, meanwhile, the deformation resistance is enhanced, and the signboard manufactured through the technology is ingenious in structure and good in light emitting effect.

Description

technical field [0001] The invention relates to the field of LED signboards, in particular to a preparation process for LED signboards. Background technique [0002] In today's life, LED light-emitting signs can be seen everywhere, such as the direction signs of airports and railway stations; there are also billboards in front of shops and door number plates in hotel rooms; all of them can be seen. There are generally two structures of LED signboards, one is to embed reflective coating inside the signboard, and then project light from the outside of the signboard to the reflective coating to achieve its light emission; the other is to have a built-in There are a certain number of LED light groups, and the specific logo graphics are presented through the light groups; however, in the existing technology, the interior of the LED signboard is made by installing lamp beads on the PCB board, and the logo statement alone A group of lamp beads is prepared for a character, so that ...

AI Technical Summary

Problems solved by technology

There are generally two structures of LED signboards, one is to embed reflective coating inside the signboard, and then project light from the outside of the signboard to the reflective coating to achieve its light emission; the other is to have a built-in There are a certain number of LED light groups, and the specific logo graphics are presented through the light groups; however, in the existing technology, the interior of the LED signboard is made by installing lamp beads on the PCB board, and the logo statement alone A group of lamp beads is prepared for a character, so that each character is a separate light-emitting unit, and finally combined on a plastic panel or a metal panel; but the signboard prepared by this process has the following defects: 1. It is a point light source emitted by a single lamp bead, which is very dazzling; 2. If one of the lamp groups of a character is damaged, all the lamp groups of this character will not light up, which will greatly affect the overall effect; 3. After packaging, the anti-deformation ability is weak, and it is very easy to damage the packaging structure by extrusion and collision, resulting in defects. Similarly, if the SMD LED chip of the formal packaging process is used, it will also have this disadvantage; so a more excellent preparation is needed. process to achieve better luminescence effect, simple preparation and higher structural stability

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