A kind of substrate and its preparation method, display device

A substrate and substrate substrate technology, which is applied in semiconductor/solid-state device manufacturing, semiconductor devices, electrical components, etc., can solve problems such as uneven thickness of light-emitting functional layers

Active Publication Date: 2020-03-06
BOE TECH GRP CO LTD +1
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] Embodiments of the present invention provide a substrate and its preparation method, and a display device, which can solve the problem of uneven thickness of the light-emitting functional layer formed in the opening area of ​​the existing pixel defining layer

Method used

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  • A kind of substrate and its preparation method, display device
  • A kind of substrate and its preparation method, display device
  • A kind of substrate and its preparation method, display device

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Embodiment Construction

[0029] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only some, not all, embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention.

[0030] Embodiments of the present invention provide a method for preparing a substrate, such as figure 2 shown, including:

[0031] S100, such as image 3 As shown, a pixel defining layer film 40 is formed on the base substrate 10; wherein, the material of the pixel defining layer film 40 includes photoresist and an affinity material doped in the photoresist, an elastic material and auxiliary particles 50; The particles 50 are used to release gas when decom...

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Abstract

Embodiments of the present invention provide a substrate, a preparation method thereof, and a display device, which relate to the field of display technology and can solve the problem of uneven thickness of a light-emitting functional layer formed in an opening area of ​​an existing pixel defining layer. The preparation method of the substrate includes: forming a pixel defining layer thin film on a base substrate; wherein, the material of the pixel defining layer thin film includes photoresist, an affinity material doped in the photoresist, an elastic material and auxiliary particles; The particles are used to release gas when decomposed, and the elastic material is used to expand the pixel defining layer film when the auxiliary particles release the gas; the molecular weight of the affinity material, photoresist and elastic material is greater than the molecular weight of the auxiliary particles; the pixel definition The layer film is heated to make the auxiliary particles move away from the substrate; the pixel defining layer film is processed to form a pixel defining layer, and the auxiliary particles are decomposed to release gas. For the preparation of the pixel definition layer.

Description

technical field [0001] The invention relates to the field of display technology, in particular to a substrate, a preparation method thereof, and a display device. Background technique [0002] Organic Electro-luminescent Display (OLED) has many advantages such as self-luminescence, high luminous efficiency, low operating voltage, light and thin, flexible and simple manufacturing process, and has been widely used in display, lighting and other fields. application. [0003] At present, there are two film-forming methods for the light-emitting layer in OLED devices. One is the evaporation process, which is suitable for the production of small-sized OLED devices; the other is the solution process, which includes spin coating, inkjet printing or screen printing etc. The method of film formation by solution process is widely used in the production process of OLED devices due to its advantages of low cost, high production capacity, and being suitable for the production of large-s...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L51/56H01L27/32
CPCH10K59/122H10K71/00
Inventor 胡月廖金龙叶志杰彭锐
Owner BOE TECH GRP CO LTD
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