Substrate, preparation method of substrate and display device

A substrate, substrate substrate technology, applied in semiconductor/solid-state device manufacturing, electrical components, electrical solid-state devices, etc., can solve problems such as uneven thickness of the light-emitting functional layer

Active Publication Date: 2018-11-23
BOE TECH GRP CO LTD +1
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0005] Embodiments of the present invention provide a substrate and its preparation method, and a display device, which can solve the

Method used

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  • Substrate, preparation method of substrate and display device
  • Substrate, preparation method of substrate and display device
  • Substrate, preparation method of substrate and display device

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Example Embodiment

[0029] The technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, rather than all the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative work shall fall within the protection scope of the present invention.

[0030] The embodiment of the present invention provides a method for preparing a substrate, such as figure 2 Shown, including:

[0031] S100, such as image 3 As shown, a pixel defining layer film 40 is formed on a base substrate 10; wherein, the material of the pixel defining layer film 40 includes photoresist and affinity materials doped in the photoresist, elastic materials and auxiliary particles 50; auxiliary The particles 50 are use...

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Abstract

Embodiments of the invention provide a substrate, a preparation method of the substrate and a display device, relate to the technical field of display, and can solve the problem that the thickness ofa light-emitting functional layer formed in an opening region of an existing pixel definition layer is not uniform. The preparation method of the substrate comprises the following steps of forming a pixel definition layer thin film on a substrate, wherein the material of the pixel definition layer thin film comprises a photoresist, and a hydrophilic material, elastic materials and auxiliary particles doped in the photoresist; the auxiliary particles are used for releasing gas during decomposition, and the elastic material is used for expanding the pixel definition layer thin film when the auxiliary particles release the gas; the molecular weight of the hydrophilic material, the photoresist and the elastic material is larger than that of the auxiliary particles; heating the pixel definitionlayer thin film, and enabling the auxiliary particles to move in the direction far away from the substrate; and processing the pixel definition layer thin film to form a pixel definition layer, and enabling the auxiliary particles to be decomposed to release gas. The preparation method is used for preparing the pixel definition layer.

Description

technical field [0001] The invention relates to the field of display technology, in particular to a substrate, a preparation method thereof, and a display device. Background technique [0002] Organic Electro-luminescent Display (OLED) has many advantages such as self-luminescence, high luminous efficiency, low operating voltage, light and thin, flexible and simple manufacturing process, and has been widely used in display, lighting and other fields. application. [0003] At present, there are two film-forming methods for the light-emitting layer in OLED devices. One is the evaporation process, which is suitable for the production of small-sized OLED devices; the other is the solution process, which includes spin coating, inkjet printing or screen printing etc. The method of film formation by solution process is widely used in the production process of OLED devices due to its advantages of low cost, high production capacity, and being suitable for the production of large-s...

Claims

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Application Information

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IPC IPC(8): H01L51/56H01L27/32
CPCH10K59/122H10K71/00
Inventor 胡月廖金龙叶志杰彭锐
Owner BOE TECH GRP CO LTD
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