Technique for producing ultrathin diamond cutting slice of metal anchoring agent

Abstract

The present invention relates to the manufacturing field of hard brittle material, and especially to a technique for manufacturing an ultrathin diamond cutting slice of metal anchoring agent. The method comprises the following steps: selecting high-fundamental-grain diamond for executing surface metallization procession; precise-grinding and ball-milling the metal powder through water cooling; mixing the processed diamond and metal powder; cold pressing; hot pressing sintering to prepare thin sheet with high compactness degree; and finally clamping the thin sheet for grinding to prepare cutting slice with satisfied standard and dimension. According to the technique, the surface of diamond has stable cutting property and combination property after metallization procession. The metal powder is mechanically pre-alloyed through water cooling, precise-grinding and ball-milling and has stable performance. The high-strength and high-density cutting slice can be obtained through hot pressing sintering. The technique is easy and convenient for controlling. The cutting slice has stable cutting performance and long service lifetime.

Description

Technical field [0001] The invention relates to the field of processing hard and brittle materials, in particular to a manufacturing process of an ultra-thin diamond cutting sheet of a metal bond. Background technique [0002] Thin diamond cutting discs are used for cutting various semiconductor materials such as germanium, silicon, boron, gallium arsenide, cobalt phosphide, silicon carbide, etc., C-MOS green plate glass, phosphoric acid filter glass, quartz glass, optical glass, micro glass tube Etc glass, Al 2 o 3 , ZrO 2 、Si 3 N 4 、CatiO 3 , Ferrite and other ceramic materials and cutting of electronic packaging materials. The existing metal-bonded diamond cutting discs do not form mechanical pre-alloying, and their performance is unstable. The thickness of diamond slices is too thick, such as cutting slices with a thickness of more than 1mm, which can only be used for cutting building materials such as stone and concrete. However, if the thickness is too thin, th...

AI Technical Summary

Problems solved by technology

However, if the thickness is too thin, there is a problem of insufficient strength. For example, a cutting sheet with a thickness below 0.5mm is easy to break, especially when cutting electronic materials, it will cause material damage such as chipping.