30results about How to "Reduce cutting pressure" patented technology

An acetabular reamer (10′) for cutting a required cut shape. The reamer has a cutting shell (12′) having a series of doubly curved cutting teeth (16′) thereon of a quantity to substantially reduce a cutting pressure on each tooth as well as to reduce a size of a typical chip generated upon cutting. Substantially all the teeth each have a matched arc cutting edge (20′) of substantial length that has a cutting profile which substantially matches a profile of a shape to be cut. Such a configuration reduces the number of teeth required to cut the shape.

A shank cutter has plural circumferential cutting edges which run in a helical manner in the region of its cutting section and of which at least one critical number are equipped in each case with a preferably essentially flattened roughing profile with chip-separating grooves with rounded bases, so that the chip-separating grooves of cutter ridges which are adjacent in the circumferential direction are axially offset relative to each other. To create a tool which provides long service life by combined advantages of a vibration-stabilized finishing cutter and a conventional roughing cutter, at least one circumferential cutting edge has an angle of twist which differs from that of another circumferential cutting edge. In addition, the chip-separating grooves of the circumferential cutting edges which are equipped with a roughing profile in each case merge into a preferably essentially flattened central section of the roughing profile by means of a predefined flank radius.

The invention includes a double helix thread cutting tap with both right-handed and left-handed helical chip removal flutes. The double helix thread cutting tap places a positive rake angle on all sets of thread cutting teeth for optimum performance and minimal cutting pressure.

The invention relates to the technical field of machining, in particular to a mechanical part machining waste recycling crushing device. The device comprises a grinding outer ring, a cutting inner ring, an elastic piece and an adjusting rod, and the grinding outer ring is formed by hinging and enclosing an even number of outer ring pieces around a vertical axis; the cutting inner ring is positioned in the grinding outer ring, and is formed by hinging and enclosing a plurality of inner ring pieces with the same quantity as the outer ring pieces around the vertical axis; the elastic piece comprises an upper circular ring, a lower fixing ring and spiral elastic strips, a grinding cavity is defined between a barrel-shaped structure defined by the spiral elastic strips and the grinding outer ring, and a cutting cavity is defined between the barrel-shaped structure and the cutting inner ring; and the two ends of the adjusting rod are hinged to one hinge position of the outer ring pieces and one hinge position of the inner ring pieces respectively. The hinged position of the cutting inner ring is changed through waste extrusion, then the hinged position of the grinding outer ring is driven to be changed through the adjusting rod, the area of the grinding cavity is increased, the grinding resistance of the grinding cavity is reduced, more power of the device is distributed to the cutting cavity, and cutting of the waste in the cutting cavity is accelerated.

A method for cutting optical element includes such steps as providing a bench, fixing an optical element to be cut onto the bench, cutting it to a predefined deepth, turning over the optical element, fixing it onto the bench, and cutting the residual tickness.

A method of manufacturing electronic dies by separating a wafer into electronic dies, wherein the method comprises forming a groove in the wafer with a first material removal tool having a first thickness, enlarging the groove by a second material removal tool having a second thickness larger than the first thickness, and subsequently increasing a depth of the groove by a third material removal tool having a third thickness smaller than the second thickness until the wafer is separated.

A method of manufacturing electronic dies by separating a wafer into electronic dies, wherein the method comprises forming a groove in the wafer with a first material removal tool having a first thickness, enlarging the groove by a second material removal tool having a second thickness larger than the first thickness, and subsequently increasing a depth of the groove by a third material removal tool having a third thickness smaller than the second thickness until the wafer is separated.

The invention relates to the field of buildings, in particular to an auxiliary positioning device for ceramic tile cutting. The auxiliary positioning device comprises a translation structure, universal wheels, a dust collecting structure, a fixing structure, a scale strip, a limiting structure, a supporting structure, a driving structure and a cutting groove; the translation structure is used forfixing a cutting machine; the cutting groove is used for being coordinated with the cutting machine for cutting; the universal wheels are used for conveniently moving the device; the dust collecting structure is used for conveniently collecting cutting dust; the limiting structure and the driving structure are used for fixing a ceramic tile; and the scale strip is used for conveniently and visually measuring the length of the ceramic tile. According to the auxiliary positioning device, the limiting structure is coordinated with the driving structure so that the ceramic tile can be limited conveniently, and the cutting quality is improved; the position of the ceramic tile to be cut can be conveniently and visually measured by the use of the scale strip; the translation structure is used forconveniently fixing a cutting motor, so that sliding of the cutting motor is facilitated, cutting pressure of constructors is reduced, and the working efficiency is greatly improved; and the supporting structure is coordinated with the dust collecting structure, so that cut waste chips can be collected conveniently.

The invention discloses a base plate cutting cutter wheel device. The base plate cutting cutter wheel device comprises a mounting frame and a cutter wheel arranged on the mounting frame, and furthermore comprises an air floating platform, wherein the air floating platform comprises a cutter wheel mounting groove and air holes formed in the periphery of the cutter wheel mounting groove; the cutterwheel is arranged in the cutter wheel mounting groove; when the cutter wheel is used for cutting a base plate through air flow formed by the air floating platform, a cutting position of the base platecan slightly protrude and the planeness problem of a cutting platform is solved, so that the cutting pressure is smaller and the abrasion of the cutter wheel is reduced; meanwhile, the airflow of theair floating platform can realize the effect of collecting dust and a bad condition that cutting fragments are splashed to cause foreign matters is prevented.

The present invention relates to a 7-axis intelligent robot suspended abrasive water jet 3D cutting equipment, specifically a suspended abrasive water jet cutting equipment, including a high-pressure pump station for providing cutting power, an abrasive filling device and a suspended abrasive for producing abrasives Generating device, the discharge port of the abrasive filling device is connected to the feed port of the high-pressure container built in the suspended abrasive generating device through the feed pipe, and the water inlet of the abrasive filling device is connected to the high-pressure container built in the suspended abrasive generating device through the water inlet pipe. The water outlets are connected; the high-pressure water generated by the high-pressure pump station is connected with the built-in tee of the suspended abrasive generating device through a high-pressure pipe. The product of the present invention adopts the pre-mixing suspension abrasive cutting technology, which has low cutting pressure and high efficiency; the present invention uses a high-pressure hose as the suspension abrasive transportation pipeline, and the transportation distance is long, ensuring that the nozzle device can realize arbitrary cutting in space under the drive of the robot actuator. Trajectory, high-precision movement at any angle.

The invention relates to an electrode graphite end mill comprising a ball head (9), at least one roughing land (6, 8) and at least one finishing land (5, 7). Each roughing land (6, 8) is formed as a peripheral side file comprising a plurality of teeth (10, 11); each finishing land (5, 7) has a plurality of teeth extending helically around the tool axis Peripheral grooves, wherein the peripheral grooves space apart peripheral lands respectively having peripheral cutting edges (12, 13), machining the first set (5, 6) of the lands (5, 6, 7, 8) , 8) than the working area of ​​the second group (7) of the machining lands (5, 6, 7, 8) extends farther towards the tool head.

The invention relates to the technical field of mechanical processing, in particular to a waste recycling and crushing device for mechanical parts processing, which includes a grinding outer ring, a cutting inner ring, an elastic member, and an adjustment rod. The grinding outer ring is hinged around a vertical axis by an even number of outer ring pieces Enclosed; the cutting inner ring is located in the grinding outer ring, and is formed by hinged and enclosed by a plurality of inner ring pieces equal to the outer ring piece around the vertical axis; the elastic member includes an upper ring, a lower fixed ring, a spiral The elastic bar, the cylindrical structure enclosed by the spiral elastic bar defines the grinding cavity with the grinding outer ring, and defines the cutting cavity with the cutting inner ring; the two ends of the adjusting rod are respectively hinged at a hinge position of the outer ring piece and a hinged position of the inner ring piece; the hinged position of the cutting inner ring is changed by squeezing the waste, and then the hinged position of the grinding outer ring is changed through the adjustment rod, which increases the area of ​​the grinding chamber and reduces the grinding resistance of the grinding chamber, so that The power of the device is more distributed to the cutting chamber, which accelerates the cutting of waste in the cutting chamber.

The invention discloses a special-shaped cutter mold and a preparation method thereof. The special-shaped cutter mold comprises a cutter mold base body, mold cavities and blades; the mold cavities arearranged on the cutter mold base body; two adjacent mold cavities of the same row or column are marked as a first mold cavity and a second mold cavities correspondingly, wherein the first mold cavitycomprises a first linear mold cavity and a first non-linear mold cavity, the second mold cavity comprises a second linear mold cavity and a second non-linear mold cavity, the first linear mold cavityand the second linear mold cavity are overlapped, and the first non-linear mold cavity is connected to the second non-linear mold cavity left and right; the two opposite mold cavities of different rows or columns are marked as a first mold cavity and a third mold cavity correspondingly, wherein the third mold cavity comprises a third linear mold cavity and a third non-linear mold cavity, and a gap is formed between the first linear mold cavity and the third non-linear mold cavity; and the blades are arranged in the mold cavities. According to the special-shaped cutter mold, the common cutterdesign is adopted among the mold cavities, so that the use quantity of the blades is greatly reduced, then the manufacturing cost of the cutter mold is reduced, the number of the blades is reduced, the cutting pressure is correspondingly reduced, and the product reject ratio is reduced.