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149results about How to "Simplify the process" patented technology

Display panel, manufacturing method of display panel and display device

The invention provides a display panel, a display device and a manufacturing method of the display panel. The display panel comprises a substrate; an array layer which is arranged on one side of the substrate; a luminescence functional layer which is arranged on one side away from the substrate of the array layer and comprises an anode layer, an organic light-emitting layer and a cathode layer which are arranged along the direction away from the substrate; and a thin film packaging layer which is arranged on one side away from the array layer of the luminescence functional layer and completelycovers the luminescence functional layer and comprises a first inorganic packaging layer, a first organic packaging layer and a second inorganic packaging layer which are arranged along the directionaway from the substrate, wherein the edges of the orthographic projection of the cathode layer, the first inorganic packaging layer and the first organic packaging layer on the display panel are overlapped, and the second inorganic packaging layer covers the luminescence functional layer, the first inorganic packaging layer and the first organic packaging layer. According to the display panel, the manufacturing process can be simplified and the accuracy of the cathode patterning technology can be enhanced.
Owner:SHANGHAI TIANMA MICRO ELECTRONICS CO LTD

OLED (organic light-emitting diode) display

The invention discloses an OLED (organic light-emitting diode) display, which comprises a base plate, an isolation layer and a touch controlled functional layer, wherein an OLED light-emitting element is formed on the base plate. The OLED light-emitting element comprises an OLED displaying component, an organic light-emitting functional layer and an OLED anode; the isolation layer is formed on the OLED light-emitting element; the touch controlled functional layer is formed on the isolation layer, and the touch controlled functional layer is provided with a touch controlled electrode; and the touch controlled electrode and the OLED anode are respectively connected onto respective ICs (integrated circuits) to form a top light-emitting OLED display integrated with touch control. A shielding layer is arranged between the isolation layer and the touch controlled functional layer, an insulation layer is arranged on the shielding layer, and thus signal interference between the OLED light-emitting element and the touch controlled functional layer is prevented. As the OLED light-emitting element and the touch controlled functional layer are arranged on the same base plate, the thickness of the OLED display integrated with a touch control function in the prior art is reduced. The touch controlled electrode is connected onto the terminal part of the base plate and is further connected onto the respective IC through the terminal part, thus the manufacture process of the display is simplified.
Owner:NANJING CEC PANDA LCD TECH

Relative radiometric correction method for automatically extracting pseudo-invariant features for remote sensing image

For multi-spectral space remote sensing data in a visible light and near-infrared range, the invention provides a relative radiometric correction technology for automatically extracting pseudo-invariant feature points for a remote sensing image. The technology mainly comprises the following steps of: for a target image with a digital number (DN) value, searching a matched reference image with surface reflectivity; pre-processing the two images; by using a canonical correlation analysis technology, searching a canonical correlation point set; screening the pseudo-invariant feature points in the canonical correlation point set; and by using the pseudo-invariant feature points, fitting a linear relation, and by using the linear relation, performing linear relative radiometric correction processing on the target image. By adoption of an algorithm, the DN value of the target image is directly converted into the surface reflectivity. The algorithm has the characteristics of simple processing flow, high processing speed and stability, and manual interaction is not required; moreover, the algorithm can be used for relative radiometric correction of the same sensors or different sensors and is particularly applicable to radiometric processing of remote sensing data, wherein the auxiliary information of the remote sensing data is lost or calibration accuracy is low, and absolute radiometric correction is not suitable for the remote sensing data.
Owner:INST OF REMOTE SENSING & DIGITAL EARTH CHINESE ACADEMY OF SCI

Method for manufacturing plated-through holes in HDI plate

The invention relates to the technical field of circuit board production, in particular to a method for manufacturing plated-through holes in an HDI plate. After blind holes and through holes are drilled in multiple inner-layer plates, inner-layer copper deposition and whole-plate hole filling electroplating are conducted so that the blind holes and the through holes can be metallized at the same time. A horizontal copper deposition electroplating wire is used during inner-layer copper deposition, a perpendicular continuous electroplating wire is used during whole-plate hole filling electroplating, the blind holes and the through holes can be metallized at the same time when the horizontal copper deposition electroplating wire and the perpendicular continuous electroplating wire are used in cooperation, and therefore the technological process can be simplified, production efficiency can be improved, and production cost can be reduced. Specific electroplate liquid is used during whole-plate hole filling electroplating, and therefore the quality of the metallized blind holes and the metallized through holes can be remarkably improved, and the metallized blind holes are prevented from cavities, fractures, poor hole filling and the like, the thickness of hole wall copper layers of the metallized through holes is 25 micrometers or higher, the thickness of electroplated copper on the surfaces of the inner-layer plates ranges from 35 micrometers to 45 micrometers, the requirements of a client are completely met, and manufacturing of circuits in the later procedure is completely achieved.
Owner:SHENZHEN SUNTAK MULTILAYER PCB

Transistor and manufacturing method thereof

The invention provides a transistor and a manufacturing method thereof. The manufacturing method comprises the following steps: patterning a first semiconductor layer and forming a source part, a drain part and a fin between the source part and the drain part; removing part of a dielectric layer and making the fin suspended on the remaining dielectric layer; performing the step of oxidizing the fin and removing an oxide layer twice or more to form a nanowire; and forming a fence structure on the nanowire. The transistor comprises a substrate, a germanium nanowire, and a fence structure. The substrate comprises a silicon layer, and a dielectric layer and a germanium-silicon layer disposed on the silicon layer sequentially. A groove is formed in the germanium-silicon layer and part of the dielectric layer, and the parts of the first semiconductor layer at the two sides of the groove are respectively used as a source or a drain. The germanium nanowire is disposed between the source and the drain and is in contact with the source and the drain. The fence structure fills the groove and covers the nanowire. According to the invention, the carrier mobility of the channel region of the transistor can be improved, and the performance of the transistor can be optimized.
Owner:SEMICON MFG INT (SHANGHAI) CORP

Method for manufacturing glass product

The invention relates to a method for manufacturing glass products, which comprises the following steps: grinding preset metal and/or oxide materials of the preset metal with a certain proportion into nanometer powder; pouring the nanometer powder into water solution and evenly dispersing the nanometer powder to form water solution of nano-scale metal and/or nano-scale metal oxide; pouring the water solution into glass materials and evenly mixing the mixture; pouring the glass materials mixed with the water solution of the nano-scale metal and/or the nano-scale metal oxide into a furnace and melting the glass materials through high-temperature heating to form glass paste of a hot melting state; injecting the glass paste into a mould to carry out molding and demoulding and conveying the obtained product to a cooling chamber through a conveying belt; and cooling the obtained product to room temperature to form glass products which can release far-infrared ray and/or have functions of antibacterium and bacteriostasis. The method can simply combine the nanometer metal or the nanometer metal oxide into a glass manufacture procedure so as to manufacture functional glass containing nanometer materials. The method is simple in manufacture procedure, does not need complex equipment and complex technology, reduces the production cost and is suitable to be applied to large-scale industry.
Owner:陈建仁

Array substrate and its manufacturing method and In Cell touch control display panel

The invention provides an array substrate and its manufacturing method and an In Cell touch control display panel. According to the array substrate, a first flat layer, a touch control signal layer, a second flat layer, a common electrode, a passivation layer and a pixel electrode are sequentially formed on a source/drain electrode, a data line and a third insulating layer, in the structure, the touch control signal layer is located below the second flat layer, the situation that bulges form in the region, corresponding to the touch control signal layer, on the surface of the array substrate does not occur, the surface of the array substrate is relatively flat, the situation that sliding of a spacer causes the collapse of a liquid crystal box or the scratch of an alignment film can be avoided, and the displaying quality is improved; at the same time, three passivation layers in an existing array substrate are reduced to one passivation layer, the manufacture procedure is thus simplified, and the manufacturing cost is reduced. According to the manufacturing method of the array substrate, the surface of the prepared array substrate is flat, the manufacture procedure is simple, and the manufacturing cost is low. The In Cell touch control display panel is good in displaying quality and low in production cost.
Owner:WUHAN CHINA STAR OPTOELECTRONICS TECH CO LTD

Treatment method and treatment device of electroplating mixed water

The invention relates to a treatment method of electroplating mixed water. The method comprises the following steps: (1) collecting the electroplating mixed water in a water collecting tank, adjusting the pH value to be 2 to 3, hoisting the electroplating mixed water from the water collecting tank into a micro-electrolytic reactor, carrying out the micro-electrolysis by virtue of iron-carbon filler, returning the electroplating mixed water to the water collecting tank from the micro-electrolytic reactor, circulating the electroplating mixed water until hexavalent chromium ions in the electroplating mixed water are reduced to trivalent chromium ions, and ending the circulation stage; (2) enabling the mixed water after the micro-electrolysis to enter a coagulation reactor, stirring the mixed water, adjusting the pH value to 10 to 12, and sequentially adding a coagulant, a coagulant aid and a sodium hypochlorite solution; (3) stopping stirring, standing and precipitating; (4) dehydrating the mud-water mixture in the coagulation reactor after the water quality is qualified, discharging the water, adjusting the pH value of the discharged water to 6 to 9, and externally transporting mud cakes. The invention also discloses a device for realizing the method. By adopting the treatment method and the treatment device, heavy metals and organic pollutants in the electroplating mixed water can be simultaneously and efficiently removed.
Owner:BEIJING MUNICIPAL RES INST OF ENVIRONMENT PROTECTION

Lossless compression method applicable to Bayer image format

The invention discloses a lossless compression method applicable to the Bayer image format, which comprises the following steps: carrying out correlation evaluation and calculation by separating a current pixel with the above part by a line of pixels and separating the current pixel with the left side by a column of pixels, adopting two storage lines of line 0 and line 1 to respectively store odd-numbered lines and even-numbered lines of pixel values, and using the line 0 to carry out the correlation evaluation if the current pixel is in the even-numbered line; using the line 1 to carry out the correlation evaluation if the current pixel is in the odd-numbered line; that is, giving corresponding values to variables of N1 and N2, then calculating L which is equal to min (N1, N2) and calculating H which is equal to ma multiplied by (N1, N2), and determining the encoding method according to the distribution position fallen by the current pixel value P. The lossless compression method does not need to carry out pre-treatment, can overcome the calculations of three-color channel decomposition or image structure conversion and the like, inherits the characteristics of fastness, high efficiency and capability of being applicable to physical realization with low power consumption and small area of the FELICS method, and has good compression effect.
Owner:INST OF MICROELECTRONICS CHINESE ACAD OF SCI

Array substrate, manufacturing method thereof and display device

The invention provides an array substrate, a manufacturing method thereof and a display device. The manufacturing method comprises the steps of forming a first conducting layer and a second conductinglayer in a first area and a second area of a substrate, binding pins which are located in the first area and used for being electrically connected with a driving chip are formed, the second conducting layer is located on the side, away from the substrate, of the first conducting layer, and the first area and the second area are spaced; removing the second conductive layer in the second region, and forming a conductive electrode which is located in the second region and is used for being electrically connected with the light-emitting element through a connecting piece; wherein the adhesive force between the first conducting layer and the connecting piece is larger than that between the second conducting layer and the connecting piece, and the second conducting layer is used for preventingthe first conducting layer from being oxidized. The manufacturing method has the advantages that the manufacturing process is simplified, the oxidation resistance of the binding pin is improved, and the adhesive force between the connecting piece and the conductive electrode is improved, so that the light-emitting element is firmly fixed on the array substrate.
Owner:TCL CHINA STAR OPTOELECTRONICS TECH CO LTD
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