Passivation encapsulation method for organic electro luminescence elements and structure

A packaging structure and packaging method technology, applied to electrical components, lighting devices, light sources, etc., can solve the problems of high cost, high equipment cost, poor barrier layer coverage, high production cost, etc., to improve the step effect, simplify the manufacturing process, improve The effect of production efficiency

Inactive Publication Date: 2004-08-11
WINTEK CORP
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Problems solved by technology

Among them, the evaporation method takes a long time, and the cost and equipment cost are high
However, when the spin coating and dipping methods are used for plating, the organic EL elements need to be coated one by one, which cannot be processed in a continuous production manner, and it takes a long time
[0007] 3. In the commonly used multi-lay

Method used

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  • Passivation encapsulation method for organic electro luminescence elements and structure
  • Passivation encapsulation method for organic electro luminescence elements and structure
  • Passivation encapsulation method for organic electro luminescence elements and structure

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Example Embodiment

[0026] Figures 1 to 4 show the embodiments of the present invention, showing a passivation packaging method for organic EL elements. The method includes the following steps:

[0027] As shown in FIG. 1, for the step of providing a transparent substrate 101, a plurality of organic EL element pixels 102 have been formed on the transparent substrate 101, and the transparent substrate 101 has a plurality of ribs 103; the transparent substrate 101 and the organic EL element pixels 102 There is an ITO anode layer 104 as the anode of the organic EL element pixel 102, and the organic EL element pixel 102 has a cathode layer 105 on the upper surface. The rib 103 is designed to prevent the element from generating a cross talk phenomenon.

[0028] As shown in FIG. 2, in order to form a protective layer, a cathode protective layer 106 is plated on the surface of the organic EL element pixel 102, which is an inorganic material layer; and the protective layer 106 is a low-temperature chemical v...

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Abstract

Passivation structure is coated on surface of lamellar structured organic EL elements to isolate contact between organic material/pole material and outside surroundings in order to prolong lifetime of organic EL elements. When coating by vaporization on organic layer and pole layer is completed, inorganic material with gas barrier property is coated on surface of element selectively at same time in order to protect cathode in primary. Then, following steps are carried out: high molecular passivation material coated on element through spray coating or printing method directly; heat cure or ultraviolet cure; filling up surface of element by using macromolecule layer to even the surface and eliminating cascade effect of gap between element and rib so as to reach compactness of passivation structure. Finally, encapsulation material seals passivation surface in order to provide final protection.

Description

technical field [0001] The present invention relates to a polymer layer coated by spraying or screen printing developed to ensure that the interior of the element is not affected by the external environment in an organic light-emitting diode (OLED) element, so as to protect the substrate formed on the substrate. The encapsulation method and structure of the organic electroluminescent (EL) element. Background technique [0002] Organic EL elements are elements with a layered structure, and the materials of each layer are extremely sensitive to the external environment. In order to facilitate the injection of electrons, the cathode uses a material with a low work function, but the material with a low work function is easily oxidized, and the oxidation of the cathode material will greatly reduce the efficiency of the element. In addition, the light-emitting layer formed by fluorescent organic solids of the device and the injection layer and transport layer of electrons and hol...

Claims

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Application Information

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IPC IPC(8): H05B33/04
Inventor 倪瑞铭黄敬佩陈学文陈光荣
Owner WINTEK CORP
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