Array substrate, manufacturing method thereof and display device
A technology of an array substrate and a manufacturing method, applied in the display field, can solve the problems of sub-millimeter light emitting diodes that cannot be firmly bonded, sub-millimeter light emitting diodes are not firmly bonded, and poor solder paste adhesion, so as to prevent oxidation and simplify the process. , the effect of improving adhesion
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[0034] The technical solutions in the embodiments of the present application will be clearly and completely described below in conjunction with the drawings in the embodiments of the present application. Obviously, the described embodiments are only a part of the embodiments of the present application, rather than all the embodiments. Based on the embodiments in this application, all other embodiments obtained by those skilled in the art without creative work fall within the protection scope of this application.
[0035] See figure 2 , Which is a flowchart of a manufacturing method of an array substrate according to an embodiment of the application. The manufacturing method of the array substrate includes the following steps:
[0036] S101: A first conductive layer and a second conductive layer are formed in both the first area and the second area of the substrate to form binding pins located in the first area and used for electrical connection with the driving chip. The second...
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