Multilayer tablet fuse and method of manufacturing the same
A multi-layer chip, fuse technology, applied in fuse manufacturing, emergency protection devices, electrical components, etc., can solve the problems of not being widely used, large equipment investment, long production cycle, etc., to achieve shortened production cycle, equipment The effect of low investment and simple process
- Summary
- Abstract
- Description
- Claims
- Application Information
AI Technical Summary
Problems solved by technology
Method used
Image
Examples
Example Embodiment
[0029] Example 1: Preparation of three-layer chip fuse
[0030] The preparation process is as figure 1 As shown, the specific operations are as follows:
[0031] One: Provide substrate 1, mainly made of alumina or steatite porcelain, such as figure 2 ;
[0032] 2: Form the back electrode
[0033] Such as image 3 As shown, on the left and right sides of the lower surface of the substrate 1, the back electrode pattern 2 is formed by screen printing conductive paste, and the conductive paste material contains silver;
[0034] 3. Put it in a drying oven to dry (temperature: 150℃, time: 15min)
[0035] 4: Form the front electrode
[0036] Such as Figure 4 As shown, the front electrode 3 is formed by screen printing conductive paste on the front surface of the substrate 1, and the material contains silver or silver palladium;
[0037] 5. Put it in a drying oven to dry (temperature: 150℃, time: 15min)
[0038] 6. Put into sintering furnace for sintering (maximum temperature: 600℃ - 8...
Example Embodiment
[0063] Example 2:
[0064] The S1206-S-0.5A product is made through the above example 1, and tested in accordance with the inspection items and technical requirements of GB9364.4-2006 and GB9364.1-1997, which fully meets the performance requirements, especially the 10 times current anti-surge test Compared with the traditional single-layer chip fuse, the result is greatly improved. For the convenience of explanation, the comparison table of the above test is listed:
[0065] Table 1: Comparison of aging test
[0066]
[0067] Note: The test conditions are: 20 samples are taken from each, the rated current is applied for 200h at a temperature of 25°C and a humidity of 40%, and the fusing time of twice the current and ten times the current after the end of the sample.
[0068] Instruments used in this experiment: BXC-35A fuse tester, DS5062M digital oscilloscope.
PUM
Abstract
Description
Claims
Application Information
- R&D Engineer
- R&D Manager
- IP Professional
- Industry Leading Data Capabilities
- Powerful AI technology
- Patent DNA Extraction
Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic.
© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap