Ultrasonic vibration micro laser assisted composite single-point diamond cutting processing system

Abstract

The invention belongs to the field of ultra-precision processing, and discloses an ultrasonic vibration micro laser assisted composite single-point diamond cutting processing system. The system comprises a laser emitting module and a cutting module, wherein the laser emitting module is used to emit laser, the cutting module comprises a tool, an ultrasonic amplitude-change pole and a piezoelectricunit, a through hole is formed in the center of the ultrasonic amplitude-change pole, laser emitted by the laser emitting module is focused on the tip point of the tool through the through hole, the piezoelectric unit converts an electrical signal into a pressure signal to enable the ultrasonic amplitude-change pole to drive the tool to vibrate, thereby converting the cutting method from continuous cutting to intermittent cutting, the back end of the tool is an elliptical spherical surface, and when the tool vibrates, the laser is always focused on the tip point of the tool through the back end of the tool to avoid the misalignment of the laser and the tip point when the ultrasonic amplitude-change pole vibrates. Through the system, the organic integration of ultrasonic vibration, single point cutting technology and micro laser assisted processing technology is realized, and the processing efficiency and precision are improved.

Description

technical field [0001] The invention belongs to the field of ultra-precision machining, and more specifically relates to an ultrasonic vibration micro-laser assisted composite single-point diamond cutting processing system. Background technique [0002] At present, difficult-to-process hard and brittle materials (such as semiconductor materials, optical crystal materials, etc.) have been widely used for their excellent mechanical properties, optical properties, physical properties and chemical properties. [0003] Single-point diamond turning (SPDT) machining is an ultra-precision machining technology that uses diamond tools for cutting. Due to the high hardness of diamond tools, sharp edges, high precision of tool nose radius, and small cutting deformation, it is often used in optical systems with super excellent The processing of optical components with excellent surface forming quality and surface shape accuracy; micro-laser-assisted processing technology is a cutting tec...

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Problems solved by technology

[0004] Ultrasonic vibration-assisted cutting technology is an intermittent cutting method, which can achieve nano-scale material removal in each vibration cycle, effectively enhance tool cooling and lubrication, and reduce cutting force. However, ultrasonic vibration requires small amplitude, which is easy to cause The processing efficiency is low. For hard and brittle materials, the microscopic impact between the tool and the workpiece causes the chipping of the tool; laser-assisted cutting technology softens the material through laser heating, increases the critical plastic-brittle transition depth, and improves the material removal rate. However, continuous Larger laser heating can easily cause subsurface damage on the surface of the workpiece and reduce the surface integrity; therefore, there is an urgent need for a method that can not only realize intermittent cutting, but also laser-assisted processing of hard and brittle materials, and ensure the surface quality of the processed workpiece. The processing system can solve the above problems

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